• Structural Engineering and Mechanics
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• v.53 no.5
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• pp.1017-1030
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• 2015

In this study, the finite element method was used to analyze the distribution of the adhesive shear stresses in the single-lap bonded joint of two plates 2024-T3 aluminum with and without defects. The effects of the adhesive properties (shear modulus, the thickness and the length of the adhesive were highlighted. The results prove that the shear stresses are located on the free edges of the adhesively bonding region, and reach maximum values near the defect, because the concentration of high stress occurs near this area.

• Journal of the Korean institute of surface engineering
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• v.41 no.6
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• pp.274-278
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• 2008

3-dimensional numerical analysis for a rectangular magnetron cathode model is done to predict cooling characteristics of high power sputtering system for ZnO deposition. It includes cooling channel design, heat transfer analysis of a target, bonding layer and backing plate. In order to model erosion profiles of a target, ion current density distribution from 3D Monte Carlo simulation is used to distribute total sputtering power to 5 discrete regions. At 3 kW of sputtering power and cooling water flow of 1 liter/min at $10^{\circ}C$, the maximum surface temperature was $45.8^{\circ}C$ for a flat new target and $156^{\circ}C$ for a target eroded by 1/3 of its thickness, respectively.

• Journal of the Korean institute of surface engineering
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• v.27 no.1
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• pp.29-35
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• 1994

The effects of coating of 3$\mu\textrm{m}$ thickness on the mechanical property of alumina after heat treatment at 100$0^{\circ}C$ for 30minutes under $10^{-6}$torr vacuum was quantified in terms of modulus of rupture(MOR) using Weibull plot. While the copper coating did not change MOR of alumina due to the nonwetting behavior of Cu on $Al_2O_3$, the reactive titanium metal coating caused a noticeable 29% reduction in averaged MOr strength. This was related with the combined effects of microcracks in coating formed during heat treatment and good bonding character between Ti and $Al_2O_3$. The effect of cosputtering of Ti and Cu, bilayer coatings of Cu/Ti and Ti/Cu were also investigated. It was found that Ti, cosputtered, Cu/ti and Ti/Cu coatings reduced MOR strength of alumina in the order listed. This was correlated with the amount of Ti at coating/alumina inter-face associated with a coated layer or segregation of Ti during heat treatment.

• Proceedings of the KIEE Conference
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• 1995.07c
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• pp.1440-1441
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• 1995

We fabricated diode-type silicon field emitter array device and tested the current-voltage characteristics. Silicon oxide layer having the thickness of $1{\mu}m$ is grown in the (100) oriented n-type silicon substrates. Oxide layer is patterned by the mask with $10{\mu}m$ diameter circles. Silicon substrate is then etched using NAF 1 solution to form the sharp tip arrays as an electron source. In the UHV test station, we tested the current-voltage characteristics for the samples. Turn-on voltage was about 140V and maximum emission current was $310{\mu}A$ at 164V. We studied about silicon bonding process for future work, too.

• Structural Engineering and Mechanics
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• v.85 no.4
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• pp.511-529
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• 2023

This paper aims to better understand the bonding behavior in Reinforced Concrete beams strengthened with an Ultra-High Performance Fiber Reinforced Concrete (RCUHPFRC) layer on the compression side using experimental tests and numerical analyses. The UHPFRC mix design was obtained through an optimization procedure, and the characterization of the materials included compression and slant shear tests. Flexural tests were carried out in RC beams and RC-UHPFRC beams. The tests demonstrated a debonding of the UHPFRC layer. In addition, 3D finite element analyses were carried out in the Abaqus CAE program, in which the interface is modeled considering a zero-thickness cohesive-contact approach. The cohesive parameters are investigated, aiming to calibrate the numerical models, and a sensitivity analysis is performed to check the reliability of the assumed cohesive parameters and the mesh size. Finally, the experimental and numerical values are compared, showing a good approximation for both the RC beams and the RC strengthened beams.

• Restorative Dentistry and Endodontics
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• v.32 no.4
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• pp.313-326
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• 2007

The purpose of this study was to prove that an intermediate resin layer (IRL) oan increase the bond strength to dentin by reducing the permeability of single-step adhesives. Flat dentin surfaces were created on buccal and lingual side of freshly extracted third molar using a low-speed diamond saw under copious water flow. Approximately 2.0 mm thick axially sectioned dentin slice was abraded with wet #600 SiC paper. Three single-step self-etch adhesives; Adper Prompt L-Pop (3M ESPE, St Paul, MN, USA), One-Up Bond F (Tokuyama Corp, Tokyo, Japan) and Xeno III (Dentsply, Konstanz, Germany) were used in this study. Each adhesive groups were again subdivided into ten groups by; whether IRL was used or not; whether adhesives were cured with light before application or IRL or not; the mode of composite application. The results of this study were as follows; 1. Bond strength of single-step adhesives increased by an additional coating of intermediate resin layer, and this increasement was statistically signigicant when self-cured composite was used (p < 0.001). 2. When using IRL, there were no difference on bond strengths regardless the curing procedure of single-step adhesives. 3. There were no significant difference on bond strengths between usage of AB2 or SM as an IRL. 4. The thickness of Hybrid layer was correlated with the acidity of adhesive used, and the nanoleakage represented by silver deposits and grains was examined within hybrid and adhesive layer in most of single-step adhesives. 5. Neither thickness of hybrid layer nor nanoleakage were related to bond strength.

• Journal of Welding and Joining
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• v.13 no.3
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• pp.134-146
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• 1995

Aluminium nitride(AlN) is currently under investigation as potential candidate for replacing alumium oxide(Al$_{2}$ $O_{3}$) as a substrate material for for electronic circuit packaging. Brazing of aluminium nitride(AlN) to Cu with Ag base active alloy containing Ti has been investigated in vacuum. Binary Ag$_{98}$ $Ti_{2}$(AT) and ternary At-1wt.%Al(ATA), AT-1wt.%Ni(ATN), AT-1wt.% Mn(ATM) alloys showed good wettability to AlN and led to the development of strong bond between brate alloy and AlN ceramic. The reaction between AlN and the melted brazing alloys resulted in the formation of continuous TiN layers at the AlN side iterface. This reaction layer was found to increase by increase by increasing brazing time and temperature for all filler metals. The bond strength, measured by 4-point bend test, was increased with bonding temperature and showed maximum value and then decreased with temperature. It might be concluded that optimum thickness of the reaction layer was existed for maximum bond strength. The joint brazed at 900.deg.C for 1800sec using binary AT alloy fractured at the maximum load of 35kgf which is the highest value measured in this work. The failure of this joint was initiated at the interface between AlN and TiN layer and then proceeded alternately through the interior of the reaction layer and AlN ceramic itself.

• Journal of Powder Materials
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• v.10 no.1
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• pp.26-33
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• 2003

Al-l4wt.%Ni-l4wt.% Mm(Mm=misch metal) alloy powders rapidly solidified by the gas atomization method were subjected to mechanical milling(MM). The morphology, microstructure and hardness of the powders were investigated as a function of milling time using scanning electron microscopy(SEM), transmission electron microscopy(TEM) and Vickers microhardness tester. Microstructural evolution in gas-atomized Al-l4wt.%Ni-l4wt.% Mm(Mm=misch metal) alloy powders was studied during mechanical milling. It was noted that the as-solidified particle size of $200\mutextrm{m}$ decreases during the first 48 hours and then increases up to 72 hours of milling due to cold bonding and subsequently there was continuous refinement to $20\mutextrm{m}$ on milling to 200 hours. Two microstructurally different zones, Zone A, which is fine microstructure area and Zone B, which has the structure of the as-solidified powder, were observed. The average thickness of the Zone A layer increased from about 10 to $15\mutextrm{m}$ in the powder milled for 24 hours. Increasing the milling time to 72 hours resulted in the formation of a thicker and more uniform Zone A layer, whose thickness increased to about $30~50\mutextrm{m}$. The TEM micrograph of ball milled powder for 200 hours shows formation of nano-particles, less than 20 nm in size, embedded in an Al matrix.

• Journal of Technologic Dentistry
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• v.27 no.1
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• pp.97-104
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• 2005

The effect of Nb on interfacial bonding characteristics of Ni-Cr alloy for porcelain fused to metal crown (PFM) has been studied in order to investigate oxide layer. A specimens, which is 0.8mm in thickness, were fired at 1,000$^{\circ}C$ with four tests such as air, vacuum, air for 5 minutes and vacuum for 5 minutes in order to examine an oxide behavior of alloy surface generated by the adding of Nb to be controlled at a rate of 0, 1, 3 and 5. It observed oxide film form of the fired specimens with optical microscope and scanning electron microscope (SEM), and chemical formation of them with energy disperse X-ray spectroscopy (EDX). The other specimens, which is 2mm in thickness, were fired at 1,000$^{\circ}C$ with air and vacuum in order to analyze the diffusion behaviors of alloy-porcelain interface by X-ray dot mapping. The results of this study were as follows: 1. The observation of microstructure of specimens by SEM showed that the more Nb content is high, the more much intermediate compound of rich Nb is observed. 2. The surface morphology of oxide film is most dense in 3% Nb. The heat treatment in air constitutes denser oxide film than heat treatment under vacuum. 3. The diffusion behavior of oxide layer by X-ray dot mapping showed that Si, Al of porcelain diffuse toward metal.

• Korean Journal of Materials Research
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• v.11 no.7
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• pp.556-561
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• 2001

We prepared a new a SOS(silicon-on-silicide) wafer pair which is consisted of Si(100)/1000$\AA$-NiSi Si (100) layers. SOS can be employed in MEMS(micro- electronic-mechanical system) application due to low resistance of the NiSi layer. A thermally evaporated $1000\AA$-thick Ni/Si wafer and a clean Si wafer were pre-mated in the class 100 clean room, then annealed at $300~900^{\circ}C$ for 15hrs to induce silicidation reaction. SOS wafer pairs were investigated by a IR camera to measure bonded area and probed by a SEM(scanning electron microscope) and TEM(transmission electron microscope) to observe cross-sectional view of Si/NiSi. IR camera observation showed that the annealed SOS wafer pairs have over 52% bonded area in all temperature region except silicidation phase transition temperature. By probing cross-sectional view with SEM of magnification of 30,000, we found that $1000\AA$-thick uniform NiSi layer was formed at the center area of bonded wafers without void defects. However we observed debonded area at the edge area of wafers. Through TEM observation, we found that $10-20\AA$ thick amourphous layer formed between Si surface and NiSix near the counter part of SOS. This layer may be an oxide layer and lead to degradation of bonding. At the edge area of wafers, that amorphous layer was formed even to thickness of $1500\AA$ during annealing. Therefore, to increase bonding area of Si NiSi ∥ Si wafer pairs, we may lessen the amorphous layers.