• Title/Summary/Keyword: Bonding Layer

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Dynamic Characteristic Evaluation of Spin Coater Module for GaAs Wafer Bonding (화합물 반도체 본딩용 Spin Coater Module의 동특성 평가)

  • Song Jun Yeob;Kim Ok Koo;Kang Jae Hoon
    • Journal of the Korean Society for Precision Engineering
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    • v.22 no.6 s.171
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    • pp.144-151
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    • 2005
  • Spin coater is regarded as a major module rotating at high speed to be used build up polymer resin thin film layer fur bonding process of GaAs wafer. This module is consisted of spin unit for spreading uniformly, align device, resin spreading nozzle and et. al. Specially, spin unit which is a component of module can cause to vibrate and finally affect to the uniformity of polymer resin film layer. For the stability prediction of rotation velocity and uniformity of polymer resin film layer, it is very important to understand the dynamic characteristics of assembled spin coater module and the dynamic response mode resulted from rotation behavior of spin chuck. In this paper, stress concentration mode and the deformed shape of spin chuck generated due to angular acceleration process are presented using analytical method for evaluation of structural safety according to the revolution speed variation of spin unit. And also, deformation form of GaAs wafer due to dynamic behavior of spin chuck is presented fur the comparison of former simulated results.

A Study on the Effect of Primer Processing Method on the Mechanical Properties of Impact Relief Air Cushion Materials Prepared through Thermal Film Laminating (프라이머 가공 방법이 열융착 필름 라미네이팅으로 제조한 고충격 대응 에어쿠션 소재의 물성에 미치는 영향 연구)

  • Kim, Ji Yeon;Kim, Hun Min;Min, Mun Hong
    • Textile Coloration and Finishing
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    • v.34 no.3
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    • pp.173-184
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    • 2022
  • In this study, the TPU film was laminated on an aramid fabric or circular knits in order to implement an air cushion material that can respond to high impact forces in case of a fall and is easy to expand. To increase the bonding strength between the fabric layer and the film layer, a primer layer was formed in two ways: one for thermally bonding and laminating PET film and two for coating and aging hot melt type PUR adhesive. The tensile strength of the aramid air cushion was 2.5 times higher than that of the circular knits, but the tensile elongation of the aramid air cushion was very low compared to that of the circular knits. The tear strength of the aramid air cushion was about twice or more superior to that of the circular knits, the primer treatment method was good at A, and the peel strength was excellent at method A. The aramid air cushion was the lightest in weight. Summarizing the above results, it was best to combine the air cushion material with aramid woven fabric and primer treatment method A to cope with the high impact force applied when falling.

Experimental examination for effect of voids on bonding performance in cryogenic temperature condition (내부 기공이 극저온에서 접착강도에 미치는 영향에 대한 실험적 고찰)

  • Shon, Min-Young;Kim, Jong-Ho;Kim, Jong-Hak
    • Composites Research
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    • v.22 no.2
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    • pp.14-17
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    • 2009
  • Adhesive joints are widely used for structural joining applications in various fields and environmental conditions. Polyurethane adhesive is using for LNG carrier with cryogenic temperature condition. In industrial application of polyurethane adhesive, void of adhesive layer is often discussed regarding its effects on bonding properties. In present study, artificial void were prepared on Polyurethane adhesive layer with various size and location. The single lap shear test was carried out by using prepared specimens under $-170^{\circ}C$. As a result, it was confirm that the void of adhesive layer didn't affect the adhesion properties independent of their size and location.

Automatic Layer-by-layer Dipping System for Functional Thin Film Coatings (다층박막적층법 적용 기능성 박막 코팅을 위한 자동화 시스템)

  • Jang, Wonjun;Kim, Young Seok;Park, Yong Tae
    • Composites Research
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    • v.32 no.6
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    • pp.314-318
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    • 2019
  • A simple and very flexible automatic dipping machine was constructed for producing functional multilayer films on wide substrates via the layer-by-layer (LbL) assembly technique. The proposed machine exhibits several features that allow a fully automated coating operation, such as various depositing recipes, control of the dipping depth and time, operating speed, and rinsing flow, air-assist drying nozzles, and an operation display. The machine uniformly dips a substrate into aqueous mixtures containing complementary (e.g., oppositely charged, capable of hydrogen bonding, or capable of covalent bonding) species. Between the dipping of each species, the sample is spray cleaned with deionized water and blow-dried with air. The dipping, rinsing, and drying areas and times are adjustable by a computer program. Graphene-based thin films up to ten-bilayers were prepared and characterized. This film exhibits the highly filled multilayer structures and low thermal resistance, indicating that the robotic dipping system is simple to produce functional thin film coatings with a variety of different layers.

Epitaxial Growth of $\beta$-SiC Thin Films on Si(100) Substrate without a Carburized Buffer Layer

  • Wook Bahng;Kim, Hyeong-Joon
    • The Korean Journal of Ceramics
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    • v.3 no.3
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    • pp.163-168
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    • 1997
  • Most of heteroepitaxial $\beta$-SiC thin films have been successfully grown on Si(100) adapting a carburizing process, by which a few atomic layers of substrate surface is chemically converted to very thin SiC layer using hydrocarbon gas sources. Using an organo-silicon precursor, bis-trimethylsilymethane (BTMSM, [$C_7H_{20}Si_2$]), heteropitaxial $\beta$-SiC thin films were successfully grown directy on Si substrate without a carburized buffer layer. The defect density of the $\beta$-SiC thin films deposited without a carburized layer was as low as that of $\beta$-SiC films deposited on carburized buffer layer. In addition, void density was also reduced by the formation of self-buffer layer using BTMSM instead of carburized buffer layer. It seems to be mainly due to the characteristic bonding structure of BTMSM, in which Si-C was bonded alternately and tetrahedrally (SiC$_4$).

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The effect of adhesive thickness on microtensile bond strength to the cavity wall (와동벽에서 접착제의 두께가 미세인장 결합강도에 미치는 영향)

  • Lee, Hwa-Eon;Kim, Hyeon-Cheol;Hur, Bock;Park, Jeong-Kil
    • Restorative Dentistry and Endodontics
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    • v.32 no.1
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    • pp.9-18
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    • 2007
  • The purposes of this study were to examine the variability of adhesive thickness on the different site of the cavity wall when used total-etch system without filler and simplified self-etch system with filler and to evaluate the relationship between variable adhesive thickness and microtensile bond strength to the cavity wall. A class I cavity in six human molars was prepared to expose all dentinal walls. Three teeth were bonded with a filled adhesive, $Clearfil^{TM}$ SE bond ana the other three teeth were bonded with unfilled adhesives, $Scotchbond^{TM}$ Multi Purpose. Morphology and thickness of adhesive layer were examined using fluorescence microscope. Bonding agent thickness was measured at three points along the axial cavity wall edge of cavity margin (rim). halfway down each cavity wall (h1f), internal angle of the cavity (ang). After reproducing the adhesive thickness at rim, h1f and ang, micro-tensile bond strength were evaluated. For both bonding agents, adhesive thickness of ang was significantly thicker than that of rim and h1f (P <0.05). As reproduced the adhesive thickness, microtensile bond strength was increased as adhesive thickness was increased in two bonding agents. Adhesive thickness of internal angle of the cavity was significantly thicker than that of the cavity margin and the halfway cavity wall for both bonding agents. Microtensile bond strength of the thick adhesive layer at the internal angle of the cavity was higher than that of the thin adhesive layer at 1,he cavity margin and the halfway cavity in the two bonding systems.

THE EFFECT OF OXYGEN INHIBITION ON INTERFACIAL BONDING BETWEEN COMPOSITE RESIN LAYERS (복합레진 적층계면에서 oxygen inhibition의 영향에 관한 연구)

  • Choi, Su-Mi;Park, Jae-Hong;Choi, Sung-Chul;Kim, Kwang-Chul;Choi, Young-Chul
    • Journal of the korean academy of Pediatric Dentistry
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    • v.37 no.3
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    • pp.298-307
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    • 2010
  • The purpose of this study was to assess the effect on oxygen inhibition layer(OIL) for the interfacial bonding between resin composite layers, including shear bond strength, fracture modes and degree of conversion. The first layer of specimen was filled with Z-250(shade A3) and was cured for 40s. The second layer of specimen was filled with same composite(shade A1) and was cured for 40s. The first layer of specimens for each group were prepared by methods as followings. Control(curing in atmospheric air), Group1(curing against Mylar strip), Group2(scrubbed with a acetone-soaked cotton), Group3(using Tescera light cup), Group4(using Tescera heat cup), Group5(stored in disti1led water for 30days at $37^{\circ}C$), Group6 (using bonding agent). The results were as follows: 1. There was no statistically significant different shear bond strength between control and group 1(p>0.05). 2. Group 2 showed significantly lower shear bond strength than control and group 1(p<0.05). 3. The observation of the fracture surface leads to the evidence that a major difference occurs in the case of control, group1 and group 3 samples which break mainly cohesively while the other groups break in majority adhesively. 4. The results of FTIR showed that the degree of conversion was the highest in group 2 and the lowest in control group(p<0.05). It can be concluded that an OIL is not necessary for bonding with composite resin. But if a reduced critical amount of the unreacted monomer is present, it was detrimental to bonding additional layers of composite. Further study, such as the quantitative analysis of the unreacted monomer are required.

MEMS Fabrication of Microchannel with Poly-Si Layer for Application to Microchip Electrophoresis (마이크로 칩 전기영동에 응용하기 위한 다결정 실리콘 층이 형성된 마이크로 채널의 MEMS 가공 제작)

  • Kim, Tae-Ha;Kim, Da-Young;Chun, Myung-Suk;Lee, Sang-Soon
    • Korean Chemical Engineering Research
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    • v.44 no.5
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    • pp.513-519
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    • 2006
  • We developed two kinds of the microchip for application to electrophoresis based on both glass and quartz employing the MEMS fabrications. The poly-Si layer deposited onto the bonding interface apart from channel regions can play a role as the optical slit cutting off the stray light in order to concentrate the UV ray, from which it is possible to improve the signal-to-noise (S/N) ratio of the detection on a chip. In the glass chip, the deposited poly-Si layer had an important function of the etch mask and provided the bonding surface properly enabling the anodic bonding. The glass wafer including more impurities than quartz one results in the higher surface roughness of the channel wall, which affects subsequently on the microflow behavior of the sample solutions. In order to solve this problem, we prepared here the mixed etchant consisting HF and $NH_4F$ solutions, by which the surface roughness was reduced. Both the shape and the dimension of each channel were observed, and the electroosmotic flow velocities were measured as 0.5 mm/s for quartz and 0.36 mm/s for glass channel by implementing the microchip electrophoresis. Applying the optical slit with poly-Si layer provides that the S/N ratio of the peak is increased as ca. 2 times for quartz chip and ca. 3 times for glass chip. The maximum UV absorbance is also enhanced with ca. 1.6 and 1.7 times, respectively.

Evaluation of Interlayer Shear Properties and Bonding Strengths of a Stress-Absorbing Membrane Interlayer and Development of a Predictive Model for Fracture Energy (덧씌우기 응력흡수층에 대한 전단, 부착강도 평가 및 파괴에너지 예측모델 개발)

  • Kim, Dowan;Mun, Sungho;Kwon, Ohsun;Moon, Kihoon
    • International Journal of Highway Engineering
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    • v.20 no.1
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    • pp.87-95
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    • 2018
  • PURPOSES : A geo-grid pavement, e.g., a stress-absorbing membrane interlayer (SAMI), can be applied to an asphalt-overlay method on the existing surface-pavement layer for pavement maintenance related to reflection cracking. Reflection cracking can occur when a crack in the existing surface layer influences the overlay pavement. It can reduce the pavement life cycle and adversely affect traffic safety. Moreover, a failed overlay can reduce the economic value. In this regard, the objective of this study is to evaluate the bonding properties between the rigid pavement and a SAMI by using the direct shear test and the pull-off test. The predicted fractural energy functions with the shear stress were determined from a numerical analysis of the moving average method and the polynomial regression method. METHODS : In this research, the shear and pull-off tests were performed to evaluate the properties of mixtures constructed using no interlayer, a tack-coat, and SAMI with fabric and without fabric. The lower mixture parts (describing the existing pavement) were mixed using the 25-40-8 joint cement-concrete standard. The overlay layer was constructed especially using polymer-modified stone mastic asphalt (SMA) pavement. It was composed of an SMA aggregate gradation and applied as the modified agent. The sixth polynomial regression equation and the general moving average method were utilized to estimate the interlayer shear strength. These numerical analysis methods were also used to determine the predictive models for estimating the fracture energy. RESULTS : From the direct shear test and the pull-off test results, the mixture bonded using the tack-coat (applied as the interlayer between the overlay layer and the jointed cement concrete) had the strongest shear resistance and bonding strength. In contrast, the SAMI pavement without fiber has a strong need for fractural energy at failure. CONCLUSIONS : The effects of site-reflection cracking can be determined using the same tests on cored specimens. Further, an empirical-mechanical finite-element method (FEM) must be done to understand the appropriate SAMI application. In this regard, the FEM application analy pavement-design analysis using thesis and bonding property tests using cored specimens from public roads will be conducted in further research.

Effect of additional coating of bonding resin on the microtensile bond strength of self-etching adhesives to dentin (접착레진의 추가도포가 자가부식형 접착제의 상아질에 대한 미세인장접착강도에 미치는 영향)

  • Jung, Moon-Kyung;Cho, Byeong-Hoon;Son, Ho-Hyun;Um, Chung-Moon;Han, Young-Chul;Choung, Sae-Joon
    • Restorative Dentistry and Endodontics
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    • v.31 no.2
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    • pp.103-112
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    • 2006
  • This study investigated the hypothesis that the dentin bond strength of self-etching adhesive (SEA) might be improved by applying additional layer of bonding resin that might alleviate the pH difference between the SEA and the restorative composite resin. Two SEAs were used in this study; Experimental SEA (Exp, pH: 1.96) and Adper Prompt (AP, 3M ESPE, USA, pH: 1.0) In the control groups they were applied with two sequential coats In the experimental groups, after applying the forst coat of assigned SEAs, the D/E bonding resin of All-Bond 2 (Bisco Inc., USA, pH: 6.9) was applied as the intermediate adhesive. Z-250 (3M ESPE, USA) composite resin was built-up in order to prepare hourglass-shaped specimens . The microtensile bond strength (MTBS) was measured and the effect of the Intermediate layer on the bond strength was analyzed for each SEA using t-test. The fracture mode of each specimen was inspected using stereomicroscope and Field Emission Scanning Electron Microscope (FE-SEM). When D/E bonding resin was applied as the second coat, MTBS was significantly higher than that of the control groups . The incidence of the failure between the adhesive and the composite or between the adhesive and dentin decreased and that of the failure within the adhesive layer increased. According to the results , applying the bonding resin of neutral pH can increase the bond strength of SEAs by alleviating the difference in acidity between the SEA and restorative composite resin.