• Proceedings of the KWS Conference
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• 2002.10a
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• pp.555-560
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• 2002

Brazing of Al to Cu using AI-Si-Mg-Bi brazing alloy has been carried out in the vacuum furnace. In the bonded interlayer, there were two kinds of intermetallic compounds. One of these intermetallic compounds was e phase and the other was b phase. The growth of b phase was controlled by diffusion Al into Cu. Deformation behavior of Al-Cu brazing joint was brittle without deformation of the base metal. Shear strength of the joint was only about 20MPa. The shear specimen broken in the intermetallic compound, which was mainly e phase. Shear strength did not depend on the bonding temperature.

• The Korean Journal of Ceramics
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• v.4 no.3
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• pp.222-226
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• 1998

$Cu_3N$ film deposited on silicon oxide substrate by r.f. reactive sputtering technique. Synthesis and properties of copper nitride film were investigated for its possible application to Cu metallization as adhesive interlayer between copper and $SiO_2. Cu_3N$ film was synthesized at the substrate temperature ranging from $100^{\circ}C$ to $200^{\circ}C$ and at nitrogen gas ratio above $X_{N2}=0.4. Cu_3N, CuN_x$, and FGM-structured $Cu/CuN_x$ films prepared in this work passed Scotch-tape test and showed improved adhesion property to silicon oxide substrate compared with Cu film. Electrical resistivity of copper nitride film had a dependency on its lattice constant and was ranged from 10-7 to 10-1 $\Omega$cm. Copper nitride film was, however, unstable when it was annealed at the temperature above $400^{\circ}C$.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.442-442
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• 2011

Electronic and magnetic properties of bilayer zigzag graphene nanoribbon (bZGNR) are studied using pseudopotential density functional method. The edge atoms in the top and bottom layers of bZGNR make a weak hybridization, which leads to electronic structures different from monolayer ZGNR. For asymmetric bZGNR, where the top and bottom layers have different widths, one edge is pinched by the interlayer bonding and the other sustains antiferromagnetic ordering. A small amount of charge transfer occurs from narrower to wider layer, producing spin-polarized electron and hole pockets. External electric field produces asymmetric energy-gap opening for each spin component, inducing half-metallicity in bZGNR.

• Macromolecular Research
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• v.10 no.1
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• pp.24-33
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• 2002

Interfacial and microfailure properties of carbon fiber/epoxy composites were evaluated using both tensile fragmentation and compressive Broutman tests. A monomeric and two polymeric coupling agents were applied via the electrodeposition (ED) and the dipping applications. A monomeric and a polymeric coupling agent showed significant and comparable improvements in interfacial shear strength (IFSS) compared to the untreated case under both tensile and compressive tests. Typical microfailure modes including cone-shaped fiber break, matrix cracking, and partial interlayer failure were observed under tension, whereas the diagonal slipped failure at both ends of the fractured fiber appeared under compression. Adsorption and shear displacement mechanisms at the interface were described in terms of electrical attraction and primary and secondary bonding forces.

• Journal of Welding and Joining
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• v.7 no.2
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• pp.12-24
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• 1989

천이액상확산접합법은 접합계면에 일시적으로 액상이 형성되기 때문에, 고상확산접합법과 비교 하여 비교적 쉽게 금속결합을 이룰 수 있을 뿐만 아니라, 정밀하게 표면을 가공할 필요가 없으 며, 접합압력이 거의 필요 없다는 것이 잇점이라고 할 수 있다. 도한, 접합온도에서 등온응고되 기 때문에, 브레이징법과 비교하여 접합계면에 취약한 금속간화합물(Metallic Compound)이 생 성되지 않으므로, 기계적성질 및 내식성이 우수한 접합이음부를 얻을 수 있다는 잇점이 있다. 따라서, 본 접합법은 원리적으로 모재(Base Metal)와 거의 같은 정도의 물리적, 화학적, 기계적 성질을 갖는 접합이음부(Joint or Bonded Interlayer)를 얻을 수 있는 접합법이라고 생각되어진 다. 본 해설에서는 천이액상확산접합법의 기본원리, 접합기구, 접합인자 및 실용된 예에 대해서 서술하고자 한다.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.20 no.8
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• pp.52-59
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• 2021

In this study, we experimentally evaluated the mechanical properties and geometric form accuracy in FDM 3D printing processes based on the printing direction, building direction, and layer thickness. The specimen test results showed that the tensile strength increased by over 33% in the printing direction compared to the direction perpendicular to printing and the tensile strength becomes larger as the layer thickness decreased. Furthermore, the tensile and impact strengths in the building direction were significantly reduced due to the difference in the interlayer joining and bonding strengths of the fused material. Additionally, shrinkage of the material due to phase change induced curl distortion especially in thin and long 3D-printed products, which increased as the layer thickness increased.

• Journal of the Korean Chemical Society
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• v.21 no.4
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• pp.246-255
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• 1977

The adsorption of methylmethacylate on layer silicates containing various interlayer cations has been studied by means of infrared spectroscopy and X-Ray. Several characteristic carbonyl bands of adsorbed methylmethacrylate appeared differently at the region of 1723∼1547$cm^{-1}$depending on the species of cation and the dehydration temperature. The carbonyl stretching band shifted about 190$cm^{-1}$ to lower frequencies has been observed only for polyvalent cations, which has been attributed to $>C=O{\cdot}{\cdot}{\cdot}M^{n+}$ complex formation. The band appeared at 1703∼1640$cm^{-1}$ is responsible for hydrogen bonding between carbonyl oxygen and cationic water or cationic hydroxyl group, and the degree of shift indicates good correlation with the polarizing power of the interlayer cations. However, the band appeared at 1723$cm^{-1}$ has not been correlated with the species of cation but assigned to the carbonyl stretching which reacted with the surface hydroxyl group. On the basis of interlamellar spacing, it is suggested that the molecular plane of MMA molecule is parallel to silicate layers.

• Composites Research
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• v.36 no.4
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• pp.275-280
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• 2023

Because polymer-based composites are lightweight and have excellent properties, their demand is growing rapidly as a way to fulfill properties that are difficult to achieve with a single material. As a result, there has been a lot of research on polymer nanocomposites, which are made by dispersing particles with a size of 1-100 nm in a polymer matrix. In addition, many nanocomposites using thermoplastic resins as matrix materials are being studied. In this study, poly(ethylene terephthalate) (PET)-based nanocomposites containing organic nanoclays modified with cetyltrimethylammonium bromide (CTAB) as interlayer materials were prepared. Among various nanoclays, vermiculite (VMT) has been studied to increase the mechanical and thermal properties of polymeric materials due to its low cost, abundant reserves and unique properties. However, the strong interlayer bonding of VMT has limited its utilization due to its poor exfoliation and dispersion performance within polymer matrices. In this study, the mechanical properties of the VMT content were confirmed by tensile tests, the dispersion of VMT particles in the PET matrix was evaluated by TEM cross-sectional images, and the nitrogen gas barrier properties were evaluated.

• Journal of the Korean Vacuum Society
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• v.7 no.4
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• pp.368-373
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• 1998

As device dimensions approach submicrometer size in ULSI, the demand for interlayer dielectric materials with very low dielectric constant is increased to solve problems of RC delay caused by increase in parasitic resistance and capacitance in multilevel interconnectins. Fluorinated amorphous carbon in one of the promising materials in ULSI for the interlayer dielectric films with low dielectric constant. However, poor thermal stability and adhesion with Si substrates have inhibited its use. Recently, amorphous hydrogenated carbon (a-C:H) film as a buffer layer between the Si substrate and a-C:F has been introduced because it improves the adhesion with Si substrate. In this study, therfore, a-C:F/a-C:H films were deposited on p-type Si(100) by ECRCVD from $C_2F_6, CH_4$and $H_2$gas source and investigated the effect of forward power and composition on the thickness, chemical bonding state, dielectric constant, surface morphology and roughness of a-C:F films as an interlayer dielectric for ULSI. SEM, FT-IR, XPS, C-V meter and AFM were used for determination of each properties. The dielectric constant in the a-C:F/a-C:H films were found to decrease with increasing fluorine content. However, the dielectric constant increased after furnace annealing in $N_2$atomosphere at $400^{\circ}C$ for 1hour due to decreasing of flurorine content. However, the dielectric constant increased after furnace annealing in $N_2$atmosphere at $400^{\circ}C$ for 1hour due to decreasing of fluorine concentration.

• Journal of Welding and Joining
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• v.21 no.3
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• pp.78-84
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• 2003

The changes of microstructure and hardness of TLP bonds of directionally solidified Ni base superalloy, GTD-111, with variation of homogenizing and aging treatment were investigated. The specimens were bonded at 1403K for 7.2ks using different insert metals such as MBF-50, MBF-80 and MBF-90 and they were homogenized at 1393K with various holding time. At center of bonded interlayer homogenized for hold time 30h, the contents of aluminum and titanium were approximately 90% and 95% of base metal, respectively. In this study, aging was performed at three different kinds : one step aging ; 1113K $\times$ 16h, two step aging ; 1113K $\times$ 10h ⇒ 1103K $\times$ 10h, three step aging ; 1113K $\times$ 10h ⇒ 1103K $\times$ 8h ⇒ 922K $\times$ 24h. ${\gamma}$' volume fraction and hardness of joints were high in the sequence of one step, two step and three step aging, whereas ${\gamma}$' volume fraction and hardness of joints obtained by three step aging treatment were higher than those of raw material. Tensile properties of joints bonded with MBF-80 and MBF-90, homogenized at 1393K for 30h and then three step aged became excellent than those of raw material, however, joint bonded with MBF-50 was poor.