• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.763-768
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• 2005

Bare-chip packaging becomes more popular along with the miniaturization of IT components. In this paper, we have studied flip-chip process, and developed automated bonding system. Among the several bonding method, NCP bonding is chosen and batch-type equipment is manufactured. The dual optics and vision system aligns the chip with the substrate. The bonding head equipped with temperature and force controllers bonds the chip. The system can be easily modified for other bonding methods such as ACF In bonding process, the bonding forte and temperature are known as the most dominant bonding parameters. A parametric study is performed for these two parameters. For the test sample, we used standard flip-chip test kit which consists of FR4 boards and dummy flip-chips. The bonding test was performed fur two types of flip-chips with different chip size and lead pitch. The bonding temperatures are chosen between $25^{\circ}C\;to\;300^{\circ}C$. The bonding forces are chosen between 5N and 300N. The bonding strength is checked using bonding force tester. After the bonding force test, the samples are examined by microscope to determine the failure mode. The relations between the bonding strength and the bonding parameters are analyzed and compared with bonding models. Finally, the most suitable bonding condition is suggested in terms of temperature and force.

• Journal of Korean Society for Quality Management
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• v.49 no.3
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• pp.255-268
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• 2021

Purpose: We sought to understand why a high-speed rotating projectile featuring a fuze-and-body assembly sometimes exhibited airburst, and we intended to improve the flight stability by eliminating airburst. Methods: We performed characteristic factor analysis, structural mechanics modeling, and dynamic modeling and simulation; and we scheduled firing tests to discover the cause of airburst. We used a step-by-step procedure to analyze the reliability function for selecting the bonding force standard that prevents airburst. Results: The 00MM high-speed rotating projectile features a fuze bonded to a body assembly; the bonding sometimes can break on firing. The resulting contact force, vibration and roll damping during flight generated yaw. Flight became unstable; fuze operation triggered an airburst. Our reliability test improved the bonding force standard (the force was increased). When the bonding force was at least the minimum required, a firing test revealed that airburst/flight instability disappeared. Conclusion: Analysis and identification of the causes of flight instability and airburst render military training safer and enhance combat power. Ammunition must perform as designed. Our method can be used to set standards that improve the performances of similar types of ammunition.

• The korean journal of orthodontics
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• v.44 no.1
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• pp.20-27
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• 2014

Objective: The aims of this study were to evaluate the relationship between the detachment force and bonding resin surface are and to determine the resin bonding surface area that would provide adequate bonding strength with minimum resin volume. Methods: One hundred and sixty human premolars were randomly divided into 4 groups of 40 teeth each. The diameter of the resin surface area in each group was as follows: group 1, 1.5 mm; group 2, 2.5 mm; group 3, 3.5 mm; and group 4, 4.5 mm. Respond Dead Soft straight (length 0.0175 inch) was used to fabricate the retainers, and $Transbond^{TM}$ XT was used to fix the retainers to the tooth surfaces. A pair of teeth was embedded in acrylic blocks for each specimen. Thus, each group comprised 20 samples. Fixed retainers were bonded to the teeth, and vertical force was applied at the middle of wire. The force was measured using a universal testing machine. Results: The mean value of detachment force was the highest for group 4 ($102.38{\pm}2.92N$), followed by group 3 ($63.54{\pm}2.21N$), group 2 ($51.95{\pm}1.61N$), and group 1 ($24.14{\pm}1.38N$). Conclusions: The detachment force of lingual fixed retainers was significantly affected as the area of the resin bonding surface increased. Considering the minimum bonding strength of brackets, a resin bonding surface area with a diameter of 3.5 mm would provide adequate bonding strength.

• Design & Manufacturing
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• v.14 no.3
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• pp.23-30
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• 2020

Laser Assisted Thermo-Compression Bonding (LATCB) has been proposed to improve the "chip tilt due to the difference in solder bump height" that occurs during the conventional semiconductor chip bonding process. The bonding module of the LATCB system has used a piezoelectric actuator to control the inclination of the compression jig on a micro scale, and the piezoelectric actuator has been directly coupled to the compression jig to minimize the assembly tolerance of the compression jig. However, this structure generates a lateral force in the piezoelectric actuator when the compression jig is tilted, and the stacked piezoelectric element vulnerable to the lateral force has a risk of failure. In this paper, the optimal design of the flexure hinge was performed to minimize the lateral force generated in the piezoelectric actuator when the compression jig is tilted by using the displacement difference of the piezoelectric actuator in the bonding module for LATCB. The design variables of the flexure hinge were defined as the hinge height, the minimum diameter, and the notch radius. And the effect of the change of each variable on the stress generated in the flexible hinge and the lateral force acting on the piezoelectric actuator was analyzed. Also, optimization was carried out using commercial structural analysis software. As a result, when the displacement difference between the piezoelectric actuators is the maximum (90um), the maximum stress generated in the flexible hinge is 11.5% of the elastic limit of the hinge material, and the lateral force acting on the piezoelectric actuator is less than 1N.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.2
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• pp.11-15
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• 2013

The wafer bonding process becomes a flexible approach to material and device integration. The bonding strength in 3-dimensional process is crucial factor in various interface bonding process such as silicon to silicon, silicon to metals such as oxides to adhesive intermediates. A measurement method of bonding strength was proposed by utilizing AFM applied CNT probe tip which indicated the relative simplicity in preparation of sample and to have merit capable to measure regardless type of films. Also, New Tool was utilized to measure of tip radius. The cleaned $SiO_2$-Si bonding strength of SPFM indicated 0.089 $J/m^2$, and the cleaning result by RCA 1($NH_4OH:H_2O:H_2O_2$) measured 0.044 $J/m^2$, indicated negligible tolerance which verified the possibility capable to measure accurate bonding strength. And it could be confirmed the effective bonding is possible through SPFM cleaning.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2003.04a
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• pp.18-21
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• 2003

The effect of interface bonding strength on the recovery force of SMA wire reinforced polymer matrix composites was investigated by pullout test. Firstly, the recovery forces and transformation temperatures of various prestrained SMA wires were measured and 5% prestrained SMA wires were prepared for the reinforcements of composites. EPDM incorporated with 20vol% silicon carbide particles(SiCp) of 6, 12, $60{mutextrm{m}}$ size were used as matrix. Pullout test results showed that the interface bonding strength increased when the SiCp size decreased due to the increase of elastic modulus of matrix. Cyclic test of composites was performed through control of DC current at the constant displacement mode. The abrupt decrease of recovery force during cycle test at high current was occurred by thermal degradation of matrix. This was in good agreement with temperature related in the thermal degradation of matrix. The hysteresis of recovery force with respect to the temperature was compared between wire and composite and the hysterisis of composites was smaller than the wire due to less thermal conduction.

• Journal of the Korean institute of surface engineering
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• v.56 no.3
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• pp.180-184
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• 2023

Scholars have proposed wafer-level bonding and three-dimensional (3D) stacked integrated circuit (IC) and have investigated Cu-Cu bonding to overcome the limitation of Moore's law. However, information about quantitative Cu-Cu direct-bonding conditions, such as temperature, pressure, and interfacial adhesion energy, is scant. This study determines the optimal temperature and pressure for Cu-Cu bonding by varying the bonding temperature to 100, 150, 200, 250, and 350 ℃ and pressure to 2,303 and 3,087 N/cm². Various conditions and methods for surface treatment were performed to prevent oxidation of the surface of the sample and remove organic compounds in Cu direct bonding as variables of temperature and pressure. EDX experiments were conducted to confirm chemical information on the bonding characteristics between the substrate and Cu to confirm the bonding mechanism between the substrate and Cu. In addition, after the combination with the change of temperature and pressure variables, UTM measurement was performed to investigate the bond force between the substrate and Cu, and it was confirmed that the bond force increased proportionally as the temperature and pressure increased.

• Journal of the Korean Mathematical Society
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• v.61 no.3
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• pp.565-602
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• 2024

We study the collective behaviors of two second-order nonlinear consensus models with a bonding force, namely the Kuramoto model and the Cucker-Smale model with inter-particle bonding force. The proposed models contain feedback control terms which induce collision avoidance and emergent consensus dynamics in a suitable framework. Through the cooperative interplays between feedback controls, initial state configuration tends to an ordered configuration asymptotically under suitable frameworks which are formulated in terms of system parameters and initial configurations. For a two-particle system on the real line, we show that the relative state tends to the preassigned value asymptotically, and we also provide several numerical examples to analyze the possible nonlinear dynamics of the proposed models, and compare them with analytical results.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2008.10a
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• pp.414-417
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• 2008

A lid & frame used as the shield of electromagnetic waves in cellular phones are composed of frame, which is welded at their electric circuits, and lid, of which debonding and joining are available from the frame. Typical lid & frame were mechanically bonded by contact between the embossing of lid and the piercing of frame Bonding force of this part have to allow us to detach the lid from frame for exchange or fix of the electric part and have to be high enough to protect the electric part from external impacts. This study is designed to estimate the effect of design variable of lid & frame on its debonding force. Estimations were performed by finite element method.

• Transactions of Materials Processing
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• v.18 no.3
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• pp.245-250
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• 2009

A lid & frame used as the shield of electromagnetic waves in cellular phones are composed of frame, which is welded at their electric circuits, and lid, of which debonding and joining are available from the frame. Typical lid & frame were mechanically bonded by contact between the embossing of lid and the piercing of frame. Bonding force of this part has to allow us to detach the lid from frame for exchange or fix of the electric part and have to be high enough to protect the electric part from external impacts. This study is designed to estimate the effect of design variables of lid & frame on its debonding force. Estimations were performed by finite element method.