• 제목/요약/키워드: Bonded interface

검색결과 419건 처리시간 0.026초

Effect of dentin surface roughness on the shear bond strength of resin bonded restorations

  • Koodaryan, Roodabeh;Hafezeqoran, Ali;Poursoltan, Sajjad
    • The Journal of Advanced Prosthodontics
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    • 제8권3호
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    • pp.224-228
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    • 2016
  • PURPOSE. This study aimed to investigate whether dentin surface preparation with diamond rotary instruments of different grit sizes affects the shear bond strength of resin-bonded restorations. MATERIALS AND METHODS. The buccal enamel of 60 maxillary central incisors was removed with a low speed diamond saw and wet ground with silicon carbide papers. The polished surfaces of the teeth were prepared with four groups of rotary diamond burs with super-coarse (SC), coarse (C), medium (M), and fine (F) grit sizes. Following surface preparation, 60 restorations were casted with nickel-chromium alloy and bonded with Panavia cement. To assess the shear bond strength, the samples were mounted on a universal testing machine and an axial load was applied along the cement-restoration interface at the crosshead speed of 0.5 mm/min. The acquired data was analyzed with one way ANOVA and Tukey post hoc test (${\alpha}=.05$). RESULTS. The $mean{\pm}SD$ shear bond strengths (in MPa) of the study groups were $17.75{\pm}1.41$ for SC, $13.82{\pm}1.13$ for C, $10.40{\pm}1.45$ for M, and $7.13{\pm}1.18$ for F. Statistical analysis revealed the significant difference among the study groups such that the value for group SC was significantly higher than that for group F (P<.001). CONCLUSION. Dentin surface roughness created by diamond burs of different grit sizes considerably influences the shear bond strength of resin bonded restorations.

전단하중하의 반도체 칩 접착계면의 특이응력 해석 (Analysis of Singular Stresses at the Bonding Interface of Semiconductor Chip Subjected to Shear Loading)

  • 이상순
    • 마이크로전자및패키징학회지
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    • 제7권4호
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    • pp.31-35
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    • 2000
  • 반도체 칩과 리드프레임을 접착하고 있는 얇은 접착제층에 전단하중이 가해질 때 발생하는 응력상태를 조사하고 있다. 계면 응력상태를 해석하기 위해서 경계요소법이 사용되고 있다. 선형 탄성이론을 적용하여 해석하면, 강체와 접착제의 계면이 자유 경 계면과 만나는 부분에서 $\gamma^{\lambda=1}$(0<1<1) 형태의 응력 특이성이 존재한다. 이러한 특이성으로 인해, 모서리 균열이나 계면 박리가 발생할 수 있다.

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$NbC_x-C_{1-x}/Y_2O_3$ 박막코팅을 이용한 $Al_2O_3/Ti$ 계면특성향상 -(2) 계면특성평가 (Enhanced $Al_2O_3/Ti$ Interfacial Properties Using $NbC_x-C_{1-x}/Y_2O_3$ Interlayers-(2) Determination of the Interfacial Properties)

  • 문철희
    • 한국세라믹학회지
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    • 제34권9호
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    • pp.921-926
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    • 1997
  • Two NbCx-C1-x/Y2O3/Ti sputter-coated Al2O3 substrates (L 5.5 cm$\times$W 0.5 cm) were diffusion bonded together using hot press method at 95$0^{\circ}C$ for 3 hours under 1 MPa of applied pressure. 4 points bending tests were used to evaluate the mechanical performance of these precracked laminate beams. Two types of mechanical responses were observed: crack penetration through the interface for x=0.75, 1 and crack deflection into an interface for x=0.25, 0.5. The Al2O3/NbCx-C1-x/Y2O3/Ti system suggested here has been proves to be effective for the thermokinetical stability and tailorability of the interfaces of Al2O3/Ti composites at 95$0^{\circ}C$.

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PSC 거더와 프리캐스트 바닥판간 부착 강도 평가를 위한 실험적 연구 (Experimental Study on Behavior of Bonding between PSC Girders and Precast Decks)

  • 김인규;정철헌;심창수;김성운
    • 한국콘크리트학회:학술대회논문집
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    • 한국콘크리트학회 2004년도 춘계 학술발표회 제16권1호
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    • pp.770-773
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    • 2004
  • The full-width, full-depth precast panel system is very efficient for the rehabilitation of deteriorated decks as well as for new bridge construction.. The horizontal bond strength at the interface between the two interconnected elements is of primary importance in order to achieve composite action. The strength of the bond between the two precast members should be high enough to prevent any progressive slip from taking place. However, the case when both of the interconnected elements are precast members bonded by means of grout, is not currently addressed by KBDC or AASHTO. This is the main impetus for this study. A total 43 push-off tests were performed to evaluate the horizontal bond strength and to recommend the best practice for the system. Test parameters included different interface surface conditions, different amount and different types of shear connectors. The presence of the shear keys at the top surface of the beam increased the interface bond capacity tremendously compared to the bond capacity with a different surface conditions.

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Effect of the Friction Characteristics of Sliding Contacts on Electrical Signal Transmission

  • Jang, Ho;Park, Hyung Kyu
    • KSTLE International Journal
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    • 제2권1호
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    • pp.22-28
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    • 2001
  • A resin bonded copper-graphite brush was investigated to evaluate the characteristics electrical signal transmission through a sliding contact as a function of the relative amount of graphite and copper in the brush. Particular attention was given to the correlation between electrical signal fluctuation and tribological properties in an electrical sliding contact system. A ring-on-block type tribotester was used for this experiment and the ring was made from pure copper. Results showed that a copper-graphite brush at a particular composition range exhibited the most stable frictional behavior with a minimum voltage drop. The amount of voltage drop at the friction interface was affected by the surface roughness, transfer film formation at the friction interface, and the real area of contact. Microscopic observations and the surface analysis showed a good agreement with the results from this experiment. The results also indicated that the electrical signal flunctuation was directly associated with the oscillation of the coefficient of friction during sliding by nanoscale variation of contacts at the friction interface.

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직교이방성 층과 반무한체 사이의 계면균열에 대한 좌굴 (Buckling for an Interface Crack Between an Orthotropic Layer and a Half-Space)

  • 정경문;범현규
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2001년도 춘계학술대회 논문집
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    • pp.815-818
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    • 2001
  • The buckling of an orthotropic layer bonded to an isotropic half-space with an interface crack subjected to compressive load under plane strain is considered. Basic stability equations derived from the mathematical theory of elasticity are applied to describe the buckling behavior. A system of homogeneous Cauchy-type singular integral equations of the second kind is solved numerically by utilizing Gauss-Chebyshev integral formulae. Numerical results for the buckling load are presented for various delamination geometries and material properties of both the layer and half-space.

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횡방향 등방성을 고려한 단섬유 인장 실험 모델링 (Modeling of Single Fiber Pull-Out Experiment Considering the Effects of Transverse Isotropy)

  • 설일찬;이춘열;채영석
    • 대한기계학회논문집A
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    • 제26권7호
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    • pp.1384-1392
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    • 2002
  • Single fiber pull-out technique has been commonly used to characterize the mechanical behavior of interface in fiber reinforced composite materials. An improved analysis considering the effects of transversely isotropic properties of fiber and the effects of thermal residual stresses in both radial and axial directions along the fiber/matrix interface is developed for the single fiber pull-out test. Although the stress transfer properties across the interface is not much affected by considering the transversely isotropic properties of fiber, interfacial debonding is notably encouraged by the effect. The interfacial shear stress that plays an important role in interfacial debonding is very much affected by the component of axial thermal residual stress in the bonded region, which can induce a two-way debonding mechanism.

표면실장 적용을 위한 Sn-Zn 무연 솔더의 신뢰성 연구 (Reliability study of Sn-Zn lead-free solder for SMT application)

  • 윤정원;정승부
    • 대한용접접합학회:학술대회논문집
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    • 대한용접접합학회 2005년도 추계학술발표대회 개요집
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    • pp.219-221
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    • 2005
  • Sn-9Zn solder balls were bonded to Cu, ENIG (Electroless Nickel/Immersion Gold) and electrolytic Au/Ni pads, and the effect of aging on their joint reliability was investigated. The interfacial products were different from the general reaction layer formed in a Sn-base solder. The intermetallic compounds formed in the solder/Cu joint were $Cu_{5}Zn_{8}$ and $Cu_{6}Sn_{5}$. After aging treatment, voids formed irregularly at the bottom side of the solder because of Sn diffusion into the $Cu_{5}Zn_{8}$ IMC. In the case of the solder/ENIG joint, $AuZn_{3}$ IMCs were formed at the interface. In the case of the Au/Ni/Cu substrate, an $AuZn_{3}$ IMC layer formed at the interface due to the fast reaction between Au and Zn. In addition, the $AuZn_{3}$ IMC layer became detached from the interface after reflow. When the aging time was extended to 100 h, $Ni_{5}Zn_{21}$ IMC was observed on the Ni substrate.

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폭약살포 높이에 따른 Al/steel 폭발 접합계면의 형상 및 조직 변화에 관한 연구 (A Study on the Shape and Microstructural Change of Explosion-Welding Al/Steel Interface with Explosive Thickness)

  • 김희진;강봉용
    • Journal of Welding and Joining
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    • 제14권4호
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    • pp.62-70
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    • 1996
  • Al or Al-alloy have been known to be able to be claded on various materials by using explosive welding process, however, the intermetallic layer frequently formed along the interface have made this process very complicated. In this study, it was focussed to select the process variables, which can get rid of interfacial layer in the Al-claded steel plate. As a result, it was demonstrated that there was a certain range of explosive thickness which did not form the intermetallic phase as well as the non-bonded area. On the other hand, ultasonic tests performed for identifying the presence of interfacial layer nondestructively showed that it could be applied for the intended purpose but its result was weakly related with the microstructural quality of interface.

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GFRP로 보강된 RC보의 계면박리파괴 해석모델 (An Analytical Model on the Interface Debonding Failure of RC Beams Strengthened by GFRP)

  • 김규선;심종성
    • 콘크리트학회논문집
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    • 제11권3호
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    • pp.69-80
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    • 1999
  • The strengthening of reinforced concrete structures by externally bonded GFRP has become increasingly common in resent years. However the analysis and design method for GFRP plate strengthening of RC beams is not well established yet. The purpose of present paper is, therefore, to define the failure mechanism and failure behavior of strengthened RC beam using GFRP and then to propose a resonable method for the calculation of interface debonding load for those beams. From the experimental results of beams strengthened by GFRP, the influence of length and thickness, width of plate on the interfacial debonding failure behavior of beam is studied and, on the basis of test results, the semi-empirical equation to predict debonding load is developed. The proposed theory based on nonlinear analysis and critical flexural crack width, predicts relatively well the debonding failure load of test beams and may be efficiently used in the analysis and design of strengthened RC beams using GFRP.