• Structural Engineering and Mechanics
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• v.57 no.2
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• pp.295-313
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• 2016

In this study, the three-dimensional finite element method is used to determine the stress intensity factor in Mode I and Mixed mode of a centered crack in an aluminum specimen repaired by a composite patch using contour integral. Various mesh densities were used to achieve convergence of the results. The effect of adhesive joint thickness, patch thickness, patch-specimen interface and layer sequence on the SIF was highlighted. The results obtained show that the patch-specimen contact surface is the best indicator of the deceleration of crack propagation, and hence of SIF reduction. Thus, the reduction in rigidity of the patch especially at adhesive layer-patch interface, allows the lowering of shear and normal stresses in the adhesive joint. The choice of the orientation of the adhesive layer-patch contact is important in the evolution of the shear and peel stresses. The patch will be more beneficial and effective while using the cross-layer on the contact surface.

• Journal of the Korean institute of surface engineering
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• v.54 no.5
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• pp.207-212
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• 2021

The mechanical and electrical characteristics can be improved in 3D stacked IC technology which can accomplish the ultra-high integration by stacking more semiconductor chips within the limited package area through the Cu direct bonding method minimizing the performance degradation to the bonding surface to the inorganic compound or the oxide film etc. The surface was treated in a ultrasonic washer using a diamond abrasive to remove other component substances from the prepared cast plate substrate surface. FE-SEM was used to analyze the bonding characteristics of the bonded copper substrates, and the cross section of the bonded Cu conjugates at the sintering junction temperature of 100 ℃, 150 ℃, 200 ℃, 350 ℃ and the pressure of 2303 N/cm² and 3087 N/cm². At 2303 N/cm², the good bonding of copper substrate was confirmed at 350 ℃, and at the increased pressure of 3087 N/cm², the bonding condition of Cu was confirmed at low temperature junction temperature of 200 ℃. However, the recrystallization of Cu particles was observed due to increased pressure of 3087 N/cm² and diffusion of Cu atoms at high temperature of 350 ℃, which can lead to degradation in semiconductor manufacturing.

• Korean Journal of Metals and Materials
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• v.49 no.11
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• pp.910-915
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• 2011

The microstructures and mechanical properties of roll-bonded STS439/Al1050/STS304 clad materials were investigated after an annealing process at various temperatures. Interfacial layer was developed at the STS439/Al1050 and Al1050/STS304 interfaces at $550^{\circ}C$. STS439/Al1050/STS304 clad metals fractured suddenly in a single step and the fracture decreased with increasing annealing temperatures at $450^{\circ}C$. After annealing at $550^{\circ}C$, samples fractured in three steps with each layer fracturing independently. Interfacial layers formed at $550^{\circ}C$ with a high Vickers microhardness were found to be brittle. During tensile testing, periodic parallel cracks were observed at the interfacial reaction layer. Observed micro-void between Al1050 and the interfacial layer was found to weaken the Al1050/reaction layer interface, leading to the total separation between Al1050 and the reaction layer.

• Transactions of Materials Processing
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• v.31 no.4
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• pp.179-185
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• 2022

The influence of post-roll bonding heat treatment conditions such as temperature and time on the variation in the diffusion layer, generated at the bonding interface and the subsequent mechanical properties of the roll-bonded Ti grade 1/Al1050/Ti grade 1 sheets, was systematically investigated. The intermetallic compound (IMC) phase generated by post heat treatment conditions adopted in this study was obviously indexed as monolithic TiAl₃. Whereas the thickness of IMC layer generated by annealing at 500 ℃ was approximately 100 nm scale, it drastically increased above 1.5 ㎛ when annealed at 600 ℃. Uniaxial tensile and peel tests were then performed to compare mechanical properties. As a result, the bonding strength drastically increased above 7.9 N/mm by annealing at 600 ℃, which implies that proper annealing condition was a prerequisite, to improving interface bonding strength as well as global elongation properties for Ti/Al/Ti 3-ply sheet.

• Computers and Concrete
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• v.22 no.4
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• pp.395-405
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• 2018

In this paper, the performance of post-installed adhesive bonded anchor embedded in concrete is assessed using numerical simulations. This study aims at studying the influence of parameters on the performance of a chemically bonded anchorage system. Non-linear finite element modelling and simulations are carried out by properly using the material properties and phenomenon. Materials parameters such as characteristic length, fracture energy, damage criteria, tension retention and crack width of concrete and interface characteristics are carefully assigned so as to obtain a most realistic behaviour of the chemical anchor system. The peak strength of two different anchor systems obtained from present numerical studies is validated against experimental results. Furthermore, validated numerical models are used to study the load transferring mechanism and damage progression characteristics of various anchors systems where strength of concrete, strength of epoxy, and geometry and disposition of anchors are the parameters. The process of development of strain in concrete adjacent to the anchor and energy dissipated during the course of damage progression are analysed. Results show that the performance of the considered anchorage system is, though a combined effect of material and geometric parameters, but a clear distinction could be made on the parameters to achieve a desired performance based on strength, slip, strain development or dissipated energy. Inspite the increase in anchor capacity with increase in concrete strength, it brings some undesirable performance as well. Furthermore, the pullout capacity of the chemical anchor system increases with a decrease in disparity among the strength of concrete and epoxy.

• Composites Research
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• v.29 no.2
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• pp.85-89
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• 2016

This paper aims at estimating the fracture behavior at the bonded part of composite material. CFRP is manufactured as the type of TDCB. The static analysis of Mode 1 due to the configuartion factor of m is carried out. Four kinds of specimens have the configuartion factor(m) of 2, 2.5, 3 and 3.5. As the study result, the displacements at specimens are shown to be similar each other in these four cases. At m of 3.5, the reaction force becomes highest as 412 N and is shown to be improved as much as 14% by comparing m of 2. The data on defection of the bonded interface and reaction force are thought to be contributed to the structural design of CFRP and the safe design.

• International Journal of Highway Engineering
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• v.14 no.5
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• pp.31-45
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• 2012

PURPOSES: In Korea, rapid maintenance of distressed concrete pavement is required to prevent traffic jam of the highway. Asphalt concrete overlay has been used as a general maintenance method of construction for aged concrete pavement. AC overlay on existing concrete pavements experience various early distresses such as reflection crack, pothole and rutting, due to different physical characteristics between asphalt overlay and existing concrete pavement. Bonded concrete overlay(BCO) is a good alternative since it has advantages that can reduce various distresses during the service life since overlay material has similar properties with existing concrete pavements. Recently, BCO which uses the ultra rapid harding cement has been applied for maintenance of highway. BCO has advantage of structural performance since it does monolithic behave with existing pavement. Therefore, it is important to have a suitable bond strength criteria for securing performance of BCO. Bond strength criteria should be larger than normal tensile stress and horizontal shear stress occurred by traffic and environmental loading at bond interface. Normal tensile stress and horizontal shear stress need to estimated for the establishment of practical bond strength criteria. METHODS: This study aimed to estimate the bond stresses at the interface of BCO using the three dimensional finite element analysis. RESULTS: As a result of this study, major failure mode and maximum bond stress are evaluated through the analysis of normal tensile stress and horizontal shear stress for various traffic and environmental load conditions. CONCLUSIONS: It was known that normal tensile stresses are dominated by environmental loading, and, horizontal shear stresses are dominated by traffic loading. In addition, bond failure occurred by both of normal tensile stresses and horizontal shear stresses; however, normal tensile stresses are predominated over horizontal shear stresses.

• Journal of Adhesion and Interface
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• v.5 no.2
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• pp.22-36
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• 2004

Several in-situ testing methods of adhesively bonded joints under static short-time tensile loading are critically analyzed in terms of experimental procedure and data evaluation. Due to its rather homogeneous stress state across the glue line, the tensile-shear test with thick single-lap specimens, according to ISO 11003-2, has become the most important test process for the determination of realistic materials parameters. This basic method, which was improved in both, the experimental part by stepped adherends and easily attachable extensometers and the evaluation procedure by numeric substrate deformation correction and test simulation based on the finite element method (FEM), is therefore demonstrated by application to several kinds of adhesives and metallic adherends. Multi-axial load decreases the strength of a joint. This effect, which is illustrated by an experimental comparison, impedes the derivation of realistic mechanical characteristics from measured force-displacement curves. It is shown by numeric modeling that tensile-shear tests with thin plate substrates according to ISO 4587, which are widely used for quick industrial quality assurance, reveal an inhomogeneous stress state, especially because of relatively large adherend deformation. Complete experimental determination of the elastic properties of bonded joints requires independent measurement of at least two characteristics. As the thick-adherend tensile-shear test directly yields the shear modulus, the tensile butt-joint test according to ISO 6922 represents the most obvious complement of the test programme. Thus, validity of analytical correction formulae proposed in literature for the derivation of realistic materials characteristics is verified by numeric simulation. Moreover, the influence of the substrate deformation is examined and a FEM correction method introduced.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.111-118
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• 2018

In order to develop a local stiffness-variant stretchable substrate with the soft PDMS/hard PDMS/FPCB configuration consisting of two stiffness-different polydimethylsiloxane (PDMS) parts and flexible printed circuit board, a FPCB was bonded to PDMS using the acrylic-silicone double-sided tape and the interfacial adhesion of the PDMS/FPCB was evaluated. The pull strength of the FPCB, which was bonded to the fully cured PDMS using the silicone adhesive of the double-sided tape, was 259 kPa and the delamination during the pull test occurred at the interface between the PDMS and the silicone adhesive. On the contrary, the bonding process, for which the FPCB was bonded using the silicone adhesive to the PDMS partially cured for 15~20 minutes at $60^{\circ}C$ and then the PDMS was fully cured for 12 hours at $60^{\circ}C$, exhibited the remarkably enhanced pull strength of 1,007~1,094 kPa. With the above mentioned bonding process, the delamination during the pull test was observed at the interface between the FPCB and the acrylic adhesive of the acrylic-silicone double sided tape.

• Composites Research
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• v.35 no.2
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• pp.86-92
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• 2022

This study was conducted to determine the effect of molecular formation of adhesive on interface characterization of thermoplastic composites. Carbonfiber/polyetherketoneketone (CF/PEKK) thermoplastic composites were fusion bonded and PEEK, PEI adhesive bonded using a high-temperature oven welding process. In addition, lap shear strength test and fracture surface analysis using a digital optical microscope and a scanning electron microscope (SEM), and Fourier transform infrared spectroscopy (FTIR) were performed. As a result, the adhesive bonding method improved adhesion strength with interphase having increased molecular formation of ether groups, ketone groups, and imide groups which mainly constitutes the CF/PEKK and adhesives. Furthermore, it was found that the use of PEEK containing more ether groups and ketone groups forms a more strongly bonded interphase and enhances the adhesive force of the CF/PEKK composites.