• Journal of Mechanical Science and Technology
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• v.18 no.8
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• pp.1375-1387
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• 2004

A solution is given for the elastodynamic problem of a crack perpendicular to the graded interfacial zone in bonded materials under the action of anti plane shear impact. The interfacial zone is modeled as a nonhomogeneous interlayer with the power-law variations of its shear modulus and mass density between the two dissimilar, homogeneous half-planes. Laplace and Fourier integral transforms are employed to reduce the transient problem to the solution of a Cauchy-type singular integral equation in the Laplace transform domain. Via the numerical inversion of the Laplace transforms, the values of the dynamic stress intensity factors are obtained as a function of time. As a result, the influences of material and geometric parameters of the bonded media on the overshoot characteristics of the dynamic stress intensities are discussed. A comparison is also made with the corresponding elastostatic solutions, addressing the inertia effect on the dynamic load transfer to the crack tips for various combinations of the physical properties.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2004.04a
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• pp.232-236
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• 2004

The fracture characteristics of unidirectional composite single-lap bonded joints were investigated experimentally and numerically. The effects of bonding method, surface roughness, bondline thickness and the existence of fillet on the failure characteristics and strength of bonded single-lap joints were evaluated experimentally. The failure process, failure mode and the behavior of load-displacement curve was apparently different according to bonding method. The failure load of the specimen co-cured without adhesive was definitely superior to other types of specimens but the specimens co-cured with adhesive film had a less strength than secondary bonded specimens. In the secondary bonded specimens, the lower value of surface roughness and existence of fillet improved the strength of specimens. The strain energy release rates calculated by geometric nonlinear finite element analyses and Virtual Crack Closure Technique for the secondary bonded specimens considering the three types of initial cracks - comer crack, edge crack and delamination crack - were consistent with the test results.

• Journal of Welding and Joining
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• v.22 no.2
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• pp.38-45
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• 2004

Ultrasonic signals transmitted through adhesively bonded plates were used to evaluate parameters related to attenuation and frequency in the adhesively bonded joint. The kinds of bonding materials with a different bonding thickness of constant pressure were used. And ultrasonic diagnosis was evaluated by p-wave sensor of 10MHz. FFT has been performed to determine bond-layer parameters such as effective thickness and frequency for adhesively bonded joint of A16061 plates in comparison with measured to theoretical ratios. When variable thickness exists, the ultrasonic spectrum was changed the frequency wave. The more materials thickness and the higher the frequency, the larger shift was observed. Measured ratios for cases of bond thickness and variety bonding materials are then used to determine bond parameters. The results show that the technique can be applied to the characterization of adhesively bonded joint.

• Tribology and Lubricants
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• v.19 no.4
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• pp.203-210
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• 2003

In order to enhance the thermal stability of binder materials of bonded type solid lubricants, several metal-alkoxide based sol-gel materials such as methyltrimethoxysilane(MTMOS), titaniumisopropoxide (Ti(Opr$\^$i/)$_4$), zirconiumisopropoxide (Zr(Opr$\^$i/)$_4$) and aluminumbutoxide (Al(Obu$\^$t/)$_4$) were modified chemically by both epoxy and acrylic silane compounds. Friction and wear characteristics of the bonded solid lubricants, whose binders were of several hybrid ceramic materials, were tested with a reciprocating tribo-tester. Wear life was evaluated with respect to the heat-curing temperature, friction temperature, type of supplement lubricants, and ratio of binder materials. Test results showed that the Si-Zr hybrid ceramic materials modified by epoxy-silane compounds had a higher wear life compared to others. Sb$_2$O$_3$ was the most effective supplement lubricants in the high temperature, and BUS analyses revealed that it was caused mainly by a strong anti-oxidation effect to MoS$_2$ particles. The higher heat-curing temperature resulted in the higher wear life, and the higher friction temperature resulted in the lower wear life.

• Journal of the Korean Ceramic Society
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• v.46 no.5
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• pp.488-492
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• 2009

Porous frit-bonded SiC ceramics were successfully prepared at a temperature as low as $800^{\circ}C$ from SiC, frit, and microbeads (glass or polymer). The effects of SiC starting particle size and microbead addition on microstructure, porosity, and flexural strength were investigated. The addition of hollow glass microbead improved the strength of frit-bonded SiC ceramics without the loss of porosity by acting additional binder phase between SiC grains. The 65 ${\mu}m$-sized SiC resulted in lower porosity and higher strength than 50 ${\mu}m$-sized SiC because of higher packing density. Typical flexural strengths of frit-bonded SiC were 23 MPa at 46% porosity and 19 MPa at 49% porosity.

• Journal of Mechanical Science and Technology
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• v.15 no.10
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• pp.1386-1397
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• 2001

In this paper, the plane elasticity equations are used to investigate the in-plane normal (mode I) and shear (mode II) behavior of a crack perpendicular to and terminating at the interface in bonded media with a graded interfacial zone. The interfacial Bone is treated as a nonhomogeneous interlayer with the continuously varying elastic modulus between the two dissimilar, homogeneous semi-infinite constituents. For each of the individual loading modes, based on the Fourier integral transform technique, a singular integral equation with a Cauchy kernel is derived in a separate but parallel manner. In the numerical results, the values of corresponding modes of stress intensity factors are illustrated for various combinations of material and geometric parameters of the bonded media in conjunction with the effect of the material nonhomogeneity within the graded interfacial zone.

• Proceedings of the KSME Conference
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• 2001.06a
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• pp.286-291
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• 2001

Applications of bonded dissimilar materials such as IC package, ceramic/metal and resin/metal bonded joints, are very increasing in various industry fields. It is very important to analyze the thermal stress and stress singularity at interface edges in bonded joints of dissimilar materials. In orer to understand the package crack emanating from the edge of Die pad and Resin, fracture mechanics of bonded dissimilar materials and material properties are obtained. In this paper, the thermal stress and its singularity index for the IC package were analyzed using 2-dimensional elastic boundary element method. Crack propagation angle and path by thermal stress were numerically simulated with boundary element method.

• Proceedings of the KSME Conference
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• 2003.11a
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• pp.1109-1114
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• 2003

The initial crack often occurs on the bonded interface and it is the general cause of the interface fracture. It is very significant to establish the measurement method of interfacial crack by applying the ultrasonic technology into the interface of bonded dissimilar materials. In this paper, the interfacial crack length was measured by ultrasonic attenuation coefficient in the Al/Epoxy bonded dissimilar materials of double-cantilever beam(DCB). The energy release rate, G, was obtained by the experimental and Ripling's equation measurement of compliance. The experimental results represent that the relation between interfacial crack length for the ultrasonic attenuation coefficient and energy release rate is increased proportionally. From the experimental results, a measurement method of the interfacial crack length by the ultrasonic attenuation coefficient was proposed and discussed.

• Transactions of the Korean Society of Automotive Engineers
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• v.16 no.3
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• pp.15-22
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• 2008

Applications of bonded dissimilar materials such as integrated circuit(IC) packages, ceramics/metal and resin/metal bonded joints, are very increasing in various industry fields. It is very important to analyze the thermal stress and stress singularity at interface edge in bonded joints of dissimilar materials. In order to investigate the IC package crack propagating from the edge of die pad and resin, the fracture parameters of bonded dissimilar materials and material properties are obtained. In this paper, the thermal stress and its singularity index for the IC package were analyzed using 2-dimensional elastic boundary element method(BEM). From these results, crack propagation direction and path by thermal stress in the IC package were numerically simulated with boundary element method.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1998.03a
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• pp.220-226
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• 1998

In this pater, a method of strength evaluation applying fracture mechanics in adhesively bonded joints of A1/A1 materials was investigated. Various adhesively bonded joints of double-cantilever beam with a interfacial crack in its adhesive layer were prepared for the fracture toughness test of comprehensive mixed mode conditions from nearly pure mode I to mode II. The experiment of fracture toughness was carried out under various mixed mode conditions with an interfacial crack and critical energy release rate, Gc by the experimental measurements of compliances was determined. From the results, fracture toughness on mixed mode with an interfacial crack is well characterized by strain energy release rate and a method of strength evaluation by the fracture toughness in adhesively bonded joints of A1/A1 materials was discussed.