Evaluation of Flaws in Adhesively Bonded Joint using Ultrasonic Signal Analysis
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Hwang, Yeong-Taik
(Dept. of Precision Mechanical Engineering, Samcheok National University)
Oh, Seung-Kyu (Safety System R&D Dept. Hyundai Mobis) Han, Jun-Young (Dept. of Automation of Industrial Installation, Incheon Polytechnic College) Jang, Chul-Sup (Dept. of Industrial Installation, Seoul Information Polytechnic College) Yun, Song-Nam (Dept. of Mechanical Engineering, SoongSil University Graduate) Yi, Won (Dept. of Mechanical Engineering, SoongSil University) Kim, Hwan-Tae (Korea Institute of Science and Technology Information) |
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Waveform analysis of ultrasonic wave reflected from bonding interface and its application to nondestructive evaluation of bonding strength
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2 |
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3 |
Enaluation of the cohesive properties of adhesive joints using ultrasonic spectroscopy
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4 |
Thickness Assessment of Adhesive Layer in Inhomogeneous Layer by Gyided Wave
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5 |
Acoustoultrasonic technique for assuring adhesive bond quality
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DOI |
6 |
Application of higher order crossing feature to non-destructive evaluation - A sample demonstration of sensitivity to thy condition of adhesive joints
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DOI ScienceOn |
7 |
Sound and Structural Vibration Radiation
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Ultrasonic Signal Processing Concepts fro Measuring the Thickness of Thin Layer
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Assessment of Fatigue Damage of Adhesively Bonded Composite-Metal Jonints by Acousto-Ultrasonics and Acoustic Emission
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11 |
Effects of Ruvver Loading on the Ultrasonic Backward Radiation Profile of Leaky Lamb Wave
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12 |
Quantitative Nondestructive Evaluation of Bonded Jonits utilizing Pulse-Echo Ultrasonic Test
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