Browse > Article

Evaluation of Flaws in Adhesively Bonded Joint using Ultrasonic Signal Analysis  

Hwang, Yeong-Taik (Dept. of Precision Mechanical Engineering, Samcheok National University)
Oh, Seung-Kyu (Safety System R&D Dept. Hyundai Mobis)
Han, Jun-Young (Dept. of Automation of Industrial Installation, Incheon Polytechnic College)
Jang, Chul-Sup (Dept. of Industrial Installation, Seoul Information Polytechnic College)
Yun, Song-Nam (Dept. of Mechanical Engineering, SoongSil University Graduate)
Yi, Won (Dept. of Mechanical Engineering, SoongSil University)
Kim, Hwan-Tae (Korea Institute of Science and Technology Information)
Publication Information
Journal of Welding and Joining / v.22, no.2, 2004 , pp. 38-45 More about this Journal
Abstract
Ultrasonic signals transmitted through adhesively bonded plates were used to evaluate parameters related to attenuation and frequency in the adhesively bonded joint. The kinds of bonding materials with a different bonding thickness of constant pressure were used. And ultrasonic diagnosis was evaluated by p-wave sensor of 10MHz. FFT has been performed to determine bond-layer parameters such as effective thickness and frequency for adhesively bonded joint of A16061 plates in comparison with measured to theoretical ratios. When variable thickness exists, the ultrasonic spectrum was changed the frequency wave. The more materials thickness and the higher the frequency, the larger shift was observed. Measured ratios for cases of bond thickness and variety bonding materials are then used to determine bond parameters. The results show that the technique can be applied to the characterization of adhesively bonded joint.
Keywords
Ultrasonic wave; Waveform analysis; Adhesively bonded joint; Attenuation coefficient;
Citations & Related Records
연도 인용수 순위
  • Reference
1 Waveform analysis of ultrasonic wave reflected from bonding interface and its application to nondestructive evaluation of bonding strength /
[ Kato Kna, Shindairo ] / Nondestructive Resting
2 /
[ J.D.Achenbach ] / Wave-Propagation In Elastic Solids
3 Enaluation of the cohesive properties of adhesive joints using ultrasonic spectroscopy /
[ C.Guyott;P.Cawley ] / NDT International
4 Thickness Assessment of Adhesive Layer in Inhomogeneous Layer by Gyided Wave /
[ Y.H.Cho;H.S.Han;H.H.Choi ] / J. of the Korena Society for Nondestructive Testing
5 Acoustoultrasonic technique for assuring adhesive bond quality /
[ A.Tiwari;E.Ⅱ.Henneke;J.Duke ] / J. of Adhesion   DOI
6 Application of higher order crossing feature to non-destructive evaluation - A sample demonstration of sensitivity to thy condition of adhesive joints /
[ P.Dickstein;J.Spelt;A.Sinclair ] / Ultrasonics   DOI   ScienceOn
7 Sound and Structural Vibration Radiation /
[ F.Fahy ] / Transmission and Reponse
8 Ultrasonic Signal Processing Concepts fro Measuring the Thickness of Thin Layer /
[ J.L.Rose;P.A.Meyer ] / Mater. Eval.
9 Assessment of Fatigue Damage of Adhesively Bonded Composite-Metal Jonints by Acousto-Ultrasonics and Acoustic Emission /
[ O.Y.Kwon;K.J.Lee ] / J. of the Korena Society for Nodestructive Testing
10 /
[ 랑암전웅;高木賢志郞 ] / 超音波技術
11 Effects of Ruvver Loading on the Ultrasonic Backward Radiation Profile of Leaky Lamb Wave /
[ Y.H.Kim;S.D.Kwon;S.J.Song;M.H.Jung ] / J. of the Korean Society for Nondestructive Testing
12 Quantitative Nondestructive Evaluation of Bonded Jonits utilizing Pulse-Echo Ultrasonic Test /
[ S.K.Oh;Y.T.Hwang;W.Yi ] / Journal of the Korea Society of Precision Engineering