• Title/Summary/Keyword: Bonded Materials

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Status of Mongolian dentistry viewed from information resources and selection of adhesive dental restorative materials and continuing education (접착성 치과수복재료에 대한 정보습득과 선택 및 평생교육을 통해 본 몽골 치과계의 현황)

  • Kim, Hye-Jeong;Puntsag, Oyunenkh;Kim, Jin-Woo;Park, Se-Hee;Cho, Kyung-Mo
    • Journal of Dental Rehabilitation and Applied Science
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    • v.31 no.4
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    • pp.329-339
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    • 2015
  • Purpose: To investigate the information acquisition, selection criteria and selection methods of Mongolian dentists regarding adhesive agents for bonded restorations, and to provide future direction for continuing education. Materials and Methods: One hundred Mongolian dentists were interviewed and asked to complete a questionnaire containing 7 questions on general information about the responder, 8 questions on information acquisition and selection of bonded restoration agents, and 10 questions on continuing education. Results: Objective and credible information regarding bonded restoration materials were not being acquired, and logical material selection was not being made. The extent of continuing education was inadequate and not enough information regarding education was being acquired. The participants responded positively to online supplementary education. Conclusion: A systemized approach needs to be established in Mongolian dentistry to enable organized delivery of evidence-based guidelines and information, and logical selection of the numerous and various bonded restoration agents. Furthermore, the education of dentists, through various means, is required to enable proper use of the selected materials.

Surface Grinding of Tungsten Carbide for High Quality Unign Diamond Wheel

  • Seoung-Jung Heo
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.4 no.3
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    • pp.12-24
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    • 1995
  • Various surface grinding experiments using resin bonded diamond abrasive wheels are carried out for tungsten carbide materials in order to minimize the damage on the ground surface and to purse the precise dimension compared to conventional grinding machine. When grinding quality is constant, theoretical grinding effect is changed according to the speed of workpiece. Accordingly, grinding forces, which are Fn, Ft, were analyzed for the machining processes of tungsten-carbide material to obtain optimum grinding conditions. Brief investigation is carried out to decrease the dressing efficiency of resinoid bonded diamond grinding wheel to grind tungsten-carbide. Truing is also carried out to provide a desired shape on a wheel or to correct a dulled profile. High quality in dimensional accuracy and surface are often required as a structural components, therefore 3-points bending test is carried out to check machining damage on the ground surface layer, which in one of sintered brittle material. From this experimental study, some useful machining data and information to determine proper machining condition for grinding of tungsten-carbide materials are obtained.

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A Study on the Effect of Electrolytic In-process Dressing in Slot Grinding (미세홈 가공시 전해 인프로세스 드레싱의 영향에 관한 연구)

  • Yu, Jeong-Bong;Lee, Seok-U;Jeong, Hae-Do;Choe, Heon-Jong
    • Journal of the Korean Society for Precision Engineering
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    • v.16 no.1 s.94
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    • pp.18-25
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    • 1999
  • Chipping is an unavoidable phenomenon in the slot grinding process of hard and brittle materials. However, it should be reduced for the improvement of surface integrity in the manufacture of optical and semiconductor components. Electrolytic In-process Dressing (ELID) technique for metal bonded superabrasive grinding wheel has been developed for mirror surface grinding of hard and brittle materials. Electrically dressed wheel surface has sharply exposed abrasives and results in lower grinding force, higher grinding efficiency in grinding. The paper deals with a newly developed method for slot grinding using ELID and was implemented to improve grooved surface quality and decreases chipping size on the edge of the groove. As a result, we accomplished chipping-free grooves and obtained the clear ground surfaces on glass and WC.

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Effect of Electrolytic In-process Dressing in Slot Grinding (Slot Grinding시 전해 인프로세스 드레싱의 영향에 관한 연구)

  • 유정봉;정해도;최헌종
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1995.10a
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    • pp.48-52
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    • 1995
  • Chipping is an unavidable phenomean in the slot grinding process of hard and brittle materials. However,it should be reduced for the improvement of surface integrity in the manufacture of optical and semiconductor components. Electrolytic In-process Dressing (ELID) technique for metal bonded superabrasive grinding wheel has been developed for mirror surface grinding of hard and brittle materials. Electrically dressed wheel surface has sharply exposed abrasives and results in lower grinding force, higher grinding efficiency in grinding. The paper deals with a newly developed method for slot grinding using ELID and was implemented to improve grooved surface quality and decreases chipping size on the edge of the groove. As a result, we accomplished shipping-free grooves and obtained the clear ground sufaces on glass and tungsten carbide.

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Strain Analysis in GFRP Cross-Ply Laminates Using TR-EFPI Optical Fiber Sensor (광섬유 TR-EFPI 센서를 이용한 GFRP 직교 적층판의 변형률 해석)

  • 우성충;최낙삼;권일범
    • Proceedings of the Korean Society For Composite Materials Conference
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    • 2003.10a
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    • pp.150-153
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    • 2003
  • Longitudinal strains({$varepsilon}_x$) of the core and skin layers in glass fiber reinforced plastic(GFRP) cross-ply composite laminates have been studied using the embedded optical fiber sensor of totally-reflected extrinsic Fabry-Perot interferometer(TR-EFPI). Foil-type strain gauges bonded on both the upper and lower surfaces were used for the measurement of the surface strains. Both TR-EFPI sensor and strain gauge bonded on the specimen surface showed excellent agreement within -0.0086 ~ +0.0302% strain. It was shown that values of {$varepsilon}_x$ in the interior of the surface layer and the core layer measured by embedded TR-EFPI sensor was significantly higher than that of the specimen surface measured by strain gauges. The experimental results were ascertained with finite element analysis. Embedded TR-EFPI optical fiber sensor could measure accurately the internal strains which were different from the surface.

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Thermal Stress Intensity Factors for Partially Insulated Interface Crack under Uniform Heat Flow (부분 열유동이 있는 접합 경계면균열의 열응력세기계수 결정)

  • 이강용;박상준
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.18 no.7
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    • pp.1705-1712
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    • 1994
  • Hilbert problems are derived to evaluate thermal stress intensity factors for a partially insulated crack subjected to vertically uniform heat flow in infinite bonded dissimilar materials. In case of fully insulated crack surface, the present solutions of thermal stress intensity factors are reduced into the same as the previous results. For the homogeneous material, mode II thermal stress intensity factor only exists. However, in the bonded dissimilar materials, both mode I and II thermal stress intensity factors are obtained. Specially, in this case, mode II thermal stress intensity factor is dominent. Also, thermal stress intensity factors are strongly influenced by the material properties. Thermal stress intensity factors decrease when the degree of insulation decreases.

$^1$Highly-crystalline $sp^3$-bonded 5H-BN prepared by plasma-packets assisted pulsed-laser deposition: a room-temperature UV light-emitter at 225nm

  • Komatsu, Shojiro
    • Proceedings of the Korea Crystallographic Association Conference
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    • 2003.05a
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    • pp.6-6
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    • 2003
  • Highly crystalline 5H-polytypic form of sp3-bonded boron nitride (BN) was grown by pulsed-laser-vaporization of BN, where synchronous reactive-plasma packets assisted the crystal growth in the vapor phase. The structure of the product crystallites (˙5 micrometers) was confirmed by using transmission electron diffraction and electron energy loss spectroscopy. This material proved to have a sharp and dominant band at 225 nm by cathode luminescence at room temperatures and corresponding monochromatic images revealed that they uniformly emitted the ultraviolet light. Considering that cubic BN has already been doped as p- and n- type semiconductors, this material may be applied to the light-emitting devices working at almost the deepest limit of the UV region that is functional without vacuum.

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A Study on the Shear Impact Characteristics of Adhesively Bonded Tubular Joints (접착 조인트의 전단 충격특성에 관한 연구)

  • Kim, Yong-Ha;Park, Sang-Kun;Kim, Dong-Ok;Ryu, Yong-Moon;Cheon, Seong-Sik
    • Composites Research
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    • v.25 no.1
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    • pp.14-18
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    • 2012
  • The structural adhesives have the advantage of improving automobile performances and are being applied to joining light weight materials like aluminium and composite. In order to characterize the impact behavior of structural adhesive, instrumented impact tests were performed with respect to pin-ring adhesively bonded joint specimens. Also dynamic FE analysis was carried out using LS-DYNA to compare the results with experiments.

Collective laser-assisted bonding process for 3D TSV integration with NCP

  • Braganca, Wagno Alves Junior;Eom, Yong-Sung;Jang, Keon-Soo;Moon, Seok Hwan;Bae, Hyun-Cheol;Choi, Kwang-Seong
    • ETRI Journal
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    • v.41 no.3
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    • pp.396-407
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    • 2019
  • Laser-assisted bonding (LAB) is an advanced technology in which a homogenized laser beam is selectively applied to a chip. Previous researches have demonstrated the feasibility of using a single-tier LAB process for 3D through-silicon via (TSV) integration with nonconductive paste (NCP), where each TSV die is bonded one at a time. A collective LAB process, where several TSV dies can be stacked simultaneously, is developed to improve the productivity while maintaining the reliability of the solder joints. A single-tier LAB process for 3D TSV integration with NCP is introduced for two different values of laser power, namely 100 W and 150 W. For the 100 W case, a maximum of three dies can be collectively stacked, whereas for the 150 W case, a total of six tiers can be simultaneously bonded. For the 100 W case, the intermetallic compound microstructure is a typical Cu-Sn phase system, whereas for the 150 W case, it is asymmetrical owing to a thermogradient across the solder joint. The collective LAB process can be realized through proper design of the bonding parameters such as laser power, time, and number of stacked dies.

Numerical simulations of progression of damage in concrete embedded chemical anchors

  • Sasmal, S.;Thiyagarajan, R.;Lieberum, K.H.;Koenders, E.A.B.
    • Computers and Concrete
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    • v.22 no.4
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    • pp.395-405
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    • 2018
  • In this paper, the performance of post-installed adhesive bonded anchor embedded in concrete is assessed using numerical simulations. This study aims at studying the influence of parameters on the performance of a chemically bonded anchorage system. Non-linear finite element modelling and simulations are carried out by properly using the material properties and phenomenon. Materials parameters such as characteristic length, fracture energy, damage criteria, tension retention and crack width of concrete and interface characteristics are carefully assigned so as to obtain a most realistic behaviour of the chemical anchor system. The peak strength of two different anchor systems obtained from present numerical studies is validated against experimental results. Furthermore, validated numerical models are used to study the load transferring mechanism and damage progression characteristics of various anchors systems where strength of concrete, strength of epoxy, and geometry and disposition of anchors are the parameters. The process of development of strain in concrete adjacent to the anchor and energy dissipated during the course of damage progression are analysed. Results show that the performance of the considered anchorage system is, though a combined effect of material and geometric parameters, but a clear distinction could be made on the parameters to achieve a desired performance based on strength, slip, strain development or dissipated energy. Inspite the increase in anchor capacity with increase in concrete strength, it brings some undesirable performance as well. Furthermore, the pullout capacity of the chemical anchor system increases with a decrease in disparity among the strength of concrete and epoxy.