• 한국자동차공학회논문집
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• 제4권3호
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• pp.112-121
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• 1996

Applications of bonded dissimilar materials such as metal/ceramics and resin/metal joints, are very increasing in various industry fields. It is required to find crack propagation direction and path applying to the fracture mechanics on the bonded joint of dissimilar meterials. In this paper, crack propagation direction and path were simulated numerically by using boundary element method. Crack propagation angle is able to easily determine based on the maximum stress concept. Fracture tests of Al/Epoxy dissimilar materials with an interface crack are carried out under various mixed mode conditions by using the specimens of bonded scarf joints. It is found that the experimental results are well coincide with the analysis results of boundary element method.

• 한국세라믹학회지
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• 제47권6호
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• pp.529-533
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• 2010

Porous frit-bonded alumina ceramics were fabricated using alumina and frit as raw materials. The effects of frit content and sintering temperature on microstructure, porosity, and flexural strength were investigated at low temperature of $750{\sim}850^{\circ}C$. Increased addition of frit content or higher sintering temperature resulted in improved flexural strength of porous frit-bonded alumina ceramics. It was possible to produce frit-bonded alumina ceramics with porosities ranging from 35% to 40%. A maximum strength of 52MPa was obtained at a porosity of ~38% when 90 wt% alumina and 10 wt% frit powders were used.

• 한국생산제조학회지
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• 제7권2호
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• pp.100-107
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• 1998

Diamond wheels with fine grains and multi-porous structures are newely trial developed for smoothing and mirror finishing materials. Grinding wheel must have performed both to remove tool marks efficienitly and to contact elastically with curved surfaces, that are employed for ultra precision and high performance grinding of difficult-to materials such as tungsten carbide alloy using tool and die materials, Diamond grains are bonded by a melamine resin to prevent the decrease of machining efficiency due to grain sinking within the bond materials. Also, highly foamed structures are developed to increase the flexibility of the grinding wheel, and to induce self-sharpening by increasing contact pressure between the grinding wheel and workpiece surfaces. In this paper, melamine-bonded diamond wheels try to manufacture, then the forming method of grinding wheel are suggested, and the grinding characteristics of melamine-bonded diamond grinding wheel are also illustrated.

• 대한기계학회논문집A
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• 제21권9호
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• pp.1357-1363
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• 1997

Currently it is increasing to use th bonded dissimilar materials in the various field of advanced engineering such as the highly rigid and lighter vehicle, plastic molding LSI package and metal/ceramic bonded joint. In spite of such a wide application of the bonded dissimilar materials, the evaluation method of the bonding strength has not been established yet. Therefore in this paper we analyze the interface crack problem by introducing fracture mechanics parameters as the basic research about estimating of the strength of adhesive joints. The variation of stress intensity factor according to the elastic modulus of adherend and thickness of bonded layer are investigated. Numerical results are based on the results of boundary element analysis of four different type butt joints subjected to uniaxial tension loading.

• 한국표면공학회지
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• 제41권6호
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• pp.325-330
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• 2008

Al6061 and Sus304 materials are bonded by using thermal bonding technology. Al6061, Sus304 and thermal bonded Al6061/Al6061 and Al6061/Sus304 materials are characterized by using mechanical and electrical measurement. Especially the experimental characteristic data of thermal bonded Al6061/Al6061 and Al6061/Sus304 are not well known until today. We have investigated on Al6061, Sus304 and thermal bonded material. The thermal bonded material Al6061/Al6061 and Al6061/Sus304 can be used for the LCD frame and the other electrical products. For the future, we expect that the more various experiments should be needed to carry out for the data accumulation in the bonded new materials.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2003년도 춘계학술대회
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• pp.346-351
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• 2003

In this paper, an evaluation method of fracture toughness on interface cracks has been investigated under various mixed-mode conditions of the bonded scarf joints. Two types of the bonded scarf joints with an interface crack were prepared to analyze the stress intensity factors using boundary element method(BEM) and to perform the fracture toughness test. From the results of fracture toughness experiments and BEM analysis, an evaluation method of fracture toughness on interface cracks in the bonded components of dissimilar materials has been proposed and discussed.

• 한국안전학회지
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• 제11권3호
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• pp.20-24
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• 1996

Indentation fracture method and 4-point bending test are carried out to measure the residual stresses and the bending strength, and to investigate the mechanism of fracture mechanics in the bonded interface of ceramic and metal. The results obtained are as follows ; 1) The fracture patterns of bonded materials shows that the delamlnatlon fracture of Interfaces is stablely developed from the interfaces of ceramic/active metallic bonded materials at the specimen center, and the fracture is unstablely generated through a refraction on the middle ceramic. 2) Distribution of residual stresses is quantitatively investigated on the ceramic side of bonded materials. 3) It Is found that the residual stresses of interface vertical direction are concentrated on the bonded interface at the ceramic side.

• 한국자동차공학회논문집
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• 제11권4호
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• pp.110-116
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• 2003

In this paper, an evaluation method of fracture toughness on interface cracks has been investigated under various mixed-mode conditions of the bonded scarf joints. Two types of the bonded scarf joints with an interface crack were prepared to analyze the stress intensity factors using boundary element method(BEM) and to perform the fracture toughness test. From the results of fracture toughness experiments and BEM analysis, an evaluation method of fracture toughness on interface cracks in the bonded dissimilar materials has been proposed and discussed.

• 한국세라믹학회지
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• 제45권5호
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• pp.285-289
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• 2008

Porous self-bonded silicon carbide (SiC) ceramics were fabricated at temperatures ranging from 1750 to $1850^{\circ}C$ using SiC, silicon (Si), and carbon (C) powders as starting materials. The effect of the Si:C ratio on porosity and strength was investigated as a function of sintering temperature. It was possible to produce self-bonded SiC ceramics with porosities ranging from 36% to 43%. The porous ceramics showed a maximal porosity when the Si:C ratio was 2:1 regardless of the sintering temperature. In contrast, the maximum strength was obtained when the ratio was 5:1.

• Journal of Magnetics
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• 제1권1호
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• pp.19-23
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• 1996

In the present study, the $Sm_2Fe_{17}N_x$-type interstitial materials have been prepared by reaction between Nb-free or Nb-containing $Sm_2Fe_{17}$-type alloy and $N_2$ gas. Nitrogenation behaviour of the $Sm_2Fe_{17}N_x$-type material and disproportionation characteristics of the nitrogenated materials have been studied by means of differential thermal analysis (DTA) and thermopiezic analysis (TPA). Magnetic properties of the produced $Sm_2Fe_{17}N_x$-type interstitial materials were characterised in vibrating sample magnetometer (VSM) or thermomagnetic analyser (TMA). Epoxy-bonded or Zn-bonded $Sm_2Fe_{17}N_x$-type magnets were prepared, and their magnetic properties were investigated. It has been found that nitrogenation kinetics of the Sm2Fe17Nx-type alloy is improved significantly by the Nb-substitution for Fe in the alloy. The Nb-substitution is also found to enhance thermal stability of the $Sm_2Fe_{17}N_x$-type interstitial material. Hard magnetic properties of the interstitial materials produced from Nb-free orNb-containing alloy is high enough (intrinsic coercivity : over 7 kOe) for application as bonded permanent magnets. The good hard magnetic properties of the interstitial material are maintained in the epoxy-bonded magnet. Intrinsic coercivity of the Zn-bonded magnets is improved significantly as post-bonding annealing time increases.