Browse > Article
http://dx.doi.org/10.5695/JKISE.2008.41.6.325

An Experimental Study on Electrical and Mechanical Characteristics of Al6061/Al6061 and Al6061/Sus304 by Using Thermal Bonding Technology  

You, Chung-Jun (Dept. of Mechanical System Engineering, Kyonggi University)
Jung, Won-Chae (Dept. of Electronic Engineering, Kyonggi University)
Publication Information
Journal of the Korean institute of surface engineering / v.41, no.6, 2008 , pp. 325-330 More about this Journal
Abstract
Al6061 and Sus304 materials are bonded by using thermal bonding technology. Al6061, Sus304 and thermal bonded Al6061/Al6061 and Al6061/Sus304 materials are characterized by using mechanical and electrical measurement. Especially the experimental characteristic data of thermal bonded Al6061/Al6061 and Al6061/Sus304 are not well known until today. We have investigated on Al6061, Sus304 and thermal bonded material. The thermal bonded material Al6061/Al6061 and Al6061/Sus304 can be used for the LCD frame and the other electrical products. For the future, we expect that the more various experiments should be needed to carry out for the data accumulation in the bonded new materials.
Keywords
Bonded material; Al6061/Sus304; FESEM; EDAX; Bonding strength; Hardness; LCR meter;
Citations & Related Records
연도 인용수 순위
  • Reference
1 Wayne E. Baily, "Silicon-on-Insulator Technology and Devices", Proceeding of the Fifths International Symposium, (1992), 5
2 W. Beith, K.-H. Kuettner, "Duden Taschenbuch fuer den Maschinenbau", Springer-Verlag, (1990)
3 W.-C. Jung, Y.-D. Lim, "A Study on Al/Sus and Al/Al by Using Thermal Bonding Technology", Proceeding of the KIEEME Annual Fall Conference, (2006), 382-383
4 Frank P. Incropera and David P. Dewitt, "Introduction to Heat Transfer", John Wiley & Sons, 3rd Edition, (2001), 89
5 William F. Smith, "Principles of Materials Science and Engineering", McGraw Hill, 3rd Edition, (1996), 249