• 대한기계학회:학술대회논문집
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• 대한기계학회 2003년도 춘계학술대회
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• pp.346-351
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• 2003

In this paper, an evaluation method of fracture toughness on interface cracks has been investigated under various mixed-mode conditions of the bonded scarf joints. Two types of the bonded scarf joints with an interface crack were prepared to analyze the stress intensity factors using boundary element method(BEM) and to perform the fracture toughness test. From the results of fracture toughness experiments and BEM analysis, an evaluation method of fracture toughness on interface cracks in the bonded components of dissimilar materials has been proposed and discussed.

• 한국자동차공학회논문집
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• 제11권4호
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• pp.110-116
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• 2003

In this paper, an evaluation method of fracture toughness on interface cracks has been investigated under various mixed-mode conditions of the bonded scarf joints. Two types of the bonded scarf joints with an interface crack were prepared to analyze the stress intensity factors using boundary element method(BEM) and to perform the fracture toughness test. From the results of fracture toughness experiments and BEM analysis, an evaluation method of fracture toughness on interface cracks in the bonded dissimilar materials has been proposed and discussed.

• Journal of Mechanical Science and Technology
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• 제18권8호
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• pp.1375-1387
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• 2004

A solution is given for the elastodynamic problem of a crack perpendicular to the graded interfacial zone in bonded materials under the action of anti plane shear impact. The interfacial zone is modeled as a nonhomogeneous interlayer with the power-law variations of its shear modulus and mass density between the two dissimilar, homogeneous half-planes. Laplace and Fourier integral transforms are employed to reduce the transient problem to the solution of a Cauchy-type singular integral equation in the Laplace transform domain. Via the numerical inversion of the Laplace transforms, the values of the dynamic stress intensity factors are obtained as a function of time. As a result, the influences of material and geometric parameters of the bonded media on the overshoot characteristics of the dynamic stress intensities are discussed. A comparison is also made with the corresponding elastostatic solutions, addressing the inertia effect on the dynamic load transfer to the crack tips for various combinations of the physical properties.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2001년도 춘계학술대회논문집A
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• pp.286-291
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• 2001

Applications of bonded dissimilar materials such as IC package, ceramic/metal and resin/metal bonded joints, are very increasing in various industry fields. It is very important to analyze the thermal stress and stress singularity at interface edges in bonded joints of dissimilar materials. In orer to understand the package crack emanating from the edge of Die pad and Resin, fracture mechanics of bonded dissimilar materials and material properties are obtained. In this paper, the thermal stress and its singularity index for the IC package were analyzed using 2-dimensional elastic boundary element method. Crack propagation angle and path by thermal stress were numerically simulated with boundary element method.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2003년도 추계학술대회
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• pp.1109-1114
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• 2003

The initial crack often occurs on the bonded interface and it is the general cause of the interface fracture. It is very significant to establish the measurement method of interfacial crack by applying the ultrasonic technology into the interface of bonded dissimilar materials. In this paper, the interfacial crack length was measured by ultrasonic attenuation coefficient in the Al/Epoxy bonded dissimilar materials of double-cantilever beam(DCB). The energy release rate, G, was obtained by the experimental and Ripling's equation measurement of compliance. The experimental results represent that the relation between interfacial crack length for the ultrasonic attenuation coefficient and energy release rate is increased proportionally. From the experimental results, a measurement method of the interfacial crack length by the ultrasonic attenuation coefficient was proposed and discussed.

• 한국자동차공학회논문집
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• 제16권3호
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• pp.15-22
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• 2008

Applications of bonded dissimilar materials such as integrated circuit(IC) packages, ceramics/metal and resin/metal bonded joints, are very increasing in various industry fields. It is very important to analyze the thermal stress and stress singularity at interface edge in bonded joints of dissimilar materials. In order to investigate the IC package crack propagating from the edge of die pad and resin, the fracture parameters of bonded dissimilar materials and material properties are obtained. In this paper, the thermal stress and its singularity index for the IC package were analyzed using 2-dimensional elastic boundary element method(BEM). From these results, crack propagation direction and path by thermal stress in the IC package were numerically simulated with boundary element method.

• 한국항공우주학회지
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• 제42권10호
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• pp.809-815
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• 2014

큰 온도 변화를 받는 이종 접합 복합재는 재료의 서로 다른 열팽창 특성으로 인해 열에 의한 형상 왜곡이 발생되기 쉽다. 성형 과정에서 이종 접합 복합재 구조물의 제작 공정 중의 형상 왜곡 현상을 고려하기 위해서 구성하는 각각의 복합재료들에 대한 열팽창 특성 분석이 우선적으로 요구된다. 본 논문에서는 Carbon/Epoxy와 Silica/Phenolic의 이종접합 복합재료 시편의 열변형 특성을 측정하기 위해 디지털 영상 상관 기법(DIC)을 활용하였다. 이종 접합 복합재 시편의 열변형에 대해 수치 해석을 수행하였고 이를 실험 결과와 비교하였다. 수치해석을 통한 예측 결과는 실험을 통하여 입증되었다.

• 한국자동차공학회논문집
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• 제12권2호
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• pp.182-189
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• 2004

The application of adhesively bonded components is increasing in various industries such as automobile, aircraft, IC packages, and soldering techniques. In spite of such wide application in adhesively bonded components, nondestructive test techniques applying to adhesively bonded components have not been clearly established yet. In this paper, characteristics of ultrasonic test on interfaces of adhesively bonded components have been investigated by calculating transmission coefficient theoretically and experimentally. From the experimental results, the optimum conditions to establish frequencies for adhesively bonded homogeneous and dissimilar components are 4∼6 MHz and 2∼4 MHz, respectively.

• 한국정밀공학회지
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• 제16권10호
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• pp.152-163
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• 1999

The problem of eigenvalue and eigenvector for v-notched cracks in pseudo-isotropic and anisotropic dissimilar materials was obtained to discuss stress singularities from traction free boundary and perfect bonded interface conditions assuming like the form of complex stress function for v-notched cracks in an isotropic material. Eigenvalues were solved by a commercial numerical program, MATHEMATICA. The relation between wedged angle and material property for eigenvalue, ${\lambda}$ indicating stress singularities of v-notched cracks in pseudo-isotropic and anisotropic dissimilar materials was examined.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2010년도 춘계학술대회 논문집
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• pp.157-158
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• 2010