• Proceedings of the KSME Conference
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• 2003.04a
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• pp.346-351
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• 2003

In this paper, an evaluation method of fracture toughness on interface cracks has been investigated under various mixed-mode conditions of the bonded scarf joints. Two types of the bonded scarf joints with an interface crack were prepared to analyze the stress intensity factors using boundary element method(BEM) and to perform the fracture toughness test. From the results of fracture toughness experiments and BEM analysis, an evaluation method of fracture toughness on interface cracks in the bonded components of dissimilar materials has been proposed and discussed.

• Transactions of the Korean Society of Automotive Engineers
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• v.11 no.4
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• pp.110-116
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• 2003

In this paper, an evaluation method of fracture toughness on interface cracks has been investigated under various mixed-mode conditions of the bonded scarf joints. Two types of the bonded scarf joints with an interface crack were prepared to analyze the stress intensity factors using boundary element method(BEM) and to perform the fracture toughness test. From the results of fracture toughness experiments and BEM analysis, an evaluation method of fracture toughness on interface cracks in the bonded dissimilar materials has been proposed and discussed.

• Journal of Mechanical Science and Technology
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• v.18 no.8
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• pp.1375-1387
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• 2004

A solution is given for the elastodynamic problem of a crack perpendicular to the graded interfacial zone in bonded materials under the action of anti plane shear impact. The interfacial zone is modeled as a nonhomogeneous interlayer with the power-law variations of its shear modulus and mass density between the two dissimilar, homogeneous half-planes. Laplace and Fourier integral transforms are employed to reduce the transient problem to the solution of a Cauchy-type singular integral equation in the Laplace transform domain. Via the numerical inversion of the Laplace transforms, the values of the dynamic stress intensity factors are obtained as a function of time. As a result, the influences of material and geometric parameters of the bonded media on the overshoot characteristics of the dynamic stress intensities are discussed. A comparison is also made with the corresponding elastostatic solutions, addressing the inertia effect on the dynamic load transfer to the crack tips for various combinations of the physical properties.

• Proceedings of the KSME Conference
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• 2001.06a
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• pp.286-291
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• 2001

Applications of bonded dissimilar materials such as IC package, ceramic/metal and resin/metal bonded joints, are very increasing in various industry fields. It is very important to analyze the thermal stress and stress singularity at interface edges in bonded joints of dissimilar materials. In orer to understand the package crack emanating from the edge of Die pad and Resin, fracture mechanics of bonded dissimilar materials and material properties are obtained. In this paper, the thermal stress and its singularity index for the IC package were analyzed using 2-dimensional elastic boundary element method. Crack propagation angle and path by thermal stress were numerically simulated with boundary element method.

• Proceedings of the KSME Conference
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• 2003.11a
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• pp.1109-1114
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• 2003

The initial crack often occurs on the bonded interface and it is the general cause of the interface fracture. It is very significant to establish the measurement method of interfacial crack by applying the ultrasonic technology into the interface of bonded dissimilar materials. In this paper, the interfacial crack length was measured by ultrasonic attenuation coefficient in the Al/Epoxy bonded dissimilar materials of double-cantilever beam(DCB). The energy release rate, G, was obtained by the experimental and Ripling's equation measurement of compliance. The experimental results represent that the relation between interfacial crack length for the ultrasonic attenuation coefficient and energy release rate is increased proportionally. From the experimental results, a measurement method of the interfacial crack length by the ultrasonic attenuation coefficient was proposed and discussed.

• Transactions of the Korean Society of Automotive Engineers
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• v.16 no.3
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• pp.15-22
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• 2008

Applications of bonded dissimilar materials such as integrated circuit(IC) packages, ceramics/metal and resin/metal bonded joints, are very increasing in various industry fields. It is very important to analyze the thermal stress and stress singularity at interface edge in bonded joints of dissimilar materials. In order to investigate the IC package crack propagating from the edge of die pad and resin, the fracture parameters of bonded dissimilar materials and material properties are obtained. In this paper, the thermal stress and its singularity index for the IC package were analyzed using 2-dimensional elastic boundary element method(BEM). From these results, crack propagation direction and path by thermal stress in the IC package were numerically simulated with boundary element method.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.42 no.10
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• pp.809-815
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• 2014

The co-bonded dissimilar composite under a wide range of temperature change shows thermal distortion due to the differences in thermal expansion characteristics of the composite materials. Analysis of the thermal expansion characteristics of each composite is required for the design of co-bonded dissimilar composite structure with considering the shape distortion during the manufacturing process. In this work, digital image correlation (DIC) technique is introduced for measuring the thermal distortion characteristics of co-bonded dissimilar composite specimen, carbon/epoxy and silica/phenolic. The thermal distortion of co-bonded dissimilar composite specimen is numerically estimated and compared with the experiments. The estimated results is successfully validated using the measured results.

• Transactions of the Korean Society of Automotive Engineers
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• v.12 no.2
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• pp.182-189
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• 2004

The application of adhesively bonded components is increasing in various industries such as automobile, aircraft, IC packages, and soldering techniques. In spite of such wide application in adhesively bonded components, nondestructive test techniques applying to adhesively bonded components have not been clearly established yet. In this paper, characteristics of ultrasonic test on interfaces of adhesively bonded components have been investigated by calculating transmission coefficient theoretically and experimentally. From the experimental results, the optimum conditions to establish frequencies for adhesively bonded homogeneous and dissimilar components are 4∼6 MHz and 2∼4 MHz, respectively.

• Journal of the Korean Society for Precision Engineering
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• v.16 no.10
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• pp.152-163
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• 1999

The problem of eigenvalue and eigenvector for v-notched cracks in pseudo-isotropic and anisotropic dissimilar materials was obtained to discuss stress singularities from traction free boundary and perfect bonded interface conditions assuming like the form of complex stress function for v-notched cracks in an isotropic material. Eigenvalues were solved by a commercial numerical program, MATHEMATICA. The relation between wedged angle and material property for eigenvalue, ${\lambda}$ indicating stress singularities of v-notched cracks in pseudo-isotropic and anisotropic dissimilar materials was examined.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.157-158
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• 2010