• Korean Journal of Materials Research
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• v.11 no.3
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• pp.184-184
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• 2001

The effect of neutral ligand(L) on the precursor characteristics of (hfac)Cu(I)-L and on Cu MOCVD Process was studied. The neutral ligands of (hac)Cu(I)-L$_{x}$, such as ATMS(allytrimethylsilane), VTMS(vinyltrimethylsilane), VCH(vinylcyclohexane), MP(4-methyl-1-pentene), ACP(allylcyclopentane), and DMB(3,3-dimethyl-1-butene) were investigated. When the dissociation temperature of Cu(I)-L bond is low, low temperature deposition below $100^{\circ}C$ is possible and the resistivity of the film is low. But thermal stability of the precursor is low in this case. The resistivity is almost the same regardless of L at the deposition temperature range of $125~175^{\circ}C$. The resistivity is increased as the molecular weight of L becomes higher above $225^{\circ}C$ The vapor pressure of the precursor was closely related to the boiling point of L, the lower the boiling point of L, the higher the vapor pressurere.

• Korean Journal of Materials Research
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• v.11 no.3
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• pp.185-190
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• 2001

The effect of neutral ligand(L) on the precursor characteristics of (hfac)Cu(I)-L and on Cu MOCVD Process was studied. The neutral ligands of (hac)Cu(I)-L$_{x}$, such as ATMS(allytrimethylsilane), VTMS(vinyltrimethylsilane), VCH(vinylcyclohexane), MP(4-methyl-1-pentene), ACP(allylcyclopentane), and DMB(3,3-dimethyl-1-butene) were investigated. When the dissociation temperature of Cu(I)-L bond is low, low temperature deposition below $100^{\circ}C$ is possible and the resistivity of the film is low. But thermal stability of the precursor is low in this case. The resistivity is almost the same regardless of L at the deposition temperature range of $125~175^{\circ}C$. The resistivity is increased as the molecular weight of L becomes higher above $225^{\circ}C$ The vapor pressure of the precursor was closely related to the boiling point of L, the lower the boiling point of L, the higher the vapor pressurere.

• Journal of the Korean Society for Marine Environment & Energy
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• v.17 no.1
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• pp.8-12
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• 2014

Reduced pressure evaporation applies the principle of lowering water's boiling point by reducing the pressure. It uses the relation between temperature and pressure to reduce energy consumption needed for elevating temperature. As the result, the highest evaporation was observed at $80^{\circ}C$ and -40 cmHg applying saturated vapor pressure depending on different seawater temperature. It was found that the higher concentration in the factor test experiment depending on seawater concentration induced the higher evaporation. Also, in the factor test experiment, the amount of evaporation increased as the pressure decreased. It is concluded that the most important factor of evaporation was concentration, the second important factor was temperature, and the least important factor was pressure. Through this experiment, optimized conditions of desalination with reduced pressure evaporation device were verified.

• Applied Biological Chemistry
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• v.32 no.3
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• pp.255-264
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• 1989

The minimum concentrations of organic solvents inducing phytotoxicity were investigated after spraying or flooding solvent solutions to annual plants. In the foliar treatment of upland test, solvents with high-boiling point or low-polarity induced severe phytotoxicity. Especially, aromatic solvents induced severe phytotoxicity. The most sensitive plant to phytotoxicity was soybean. In the pre-emergence treatment of upland test, the solvents with high-boiling point only induced phytotoxicity at high concentration. The degree of phytotoxicity induced by foliar spray in the condition of paddy field was similiar to that of upland test, but in the pre-emergence test, the former was more severe than the latter. Among 6 treatments, phytotoxicity induced by solvents was most severe in the pre-emergence test under the condition of flooding paddy field. Generally, alcohols induced severe phytotoxicity, especially, ethanol at 0.001%.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.45-50
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• 2021

As the difficulty of flip chip products increases, there is a growing interest in the material of flux, which is safe from the solder wetting and reliability. In the case of no clean flux, there is merit in terms of process efficiency because there is no cleaning process. But Cu migration and delamination can be occurred if the residue remains after the reflow process. In this study, major element materials, solvent and activator, are changed and confirmed effect of non-wet and reliability in the package environment. Stability of materials were secured through storage stability evaluation, and we found out non-wet zero materials through the application of two types of solvent and activator with different boiling point and the increase of activator content. After reliability test, no delamination was found in the plane analysis, which secured the final composition of low residue flux.

• Proceedings of the KSME Conference
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• 2001.06d
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• pp.208-213
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• 2001

The minimum heat flux conditions are experimentally investigated for the subcooled liquid film flow on the horizontal plate. The experimental results show that the minimum heat flux point temperature becomes higher with the increase of the velocity and the subcooling of the liquid film flow. However, the effect of distance from the leading edge of the heat transfer plate on the minimum heat flux is almost negligible. Also, the experimental results show that the propagation velocity of wetting front increase with increasing the velocity and the subcooling of the liquid film flow.

• International Journal of Air-Conditioning and Refrigeration
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• v.14 no.3
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• pp.118-123
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• 2006

A few commonly used correlation equations of the enthalpy of vaporization essential to the analysis of refrigeration cycles are reviewed. A new four-parameter correlation equation is proposed assuming that the enthalpy of vaporization could be represented with a linear form of the temperature and an additional function which slowly decreases as the temperature increases. It is not a common practice to measure the enthalpy of vaporization by experiment; therefore, performance of the new correlation is examined using numeric data from the ASHRAE tables for 22 pure substance refrigerants. The new correlation equation and other existing ones are fitted to the data optimizing the root mean squared deviation. All data points are weighted equally and NBP (normal boiling point) is used as a fixed point since the NBP is important for refrigeration application. The new four-parameter equation yields an average absolute deviation of 0.05% for 22 refrigerants which is smaller than those of other four-parameter equations, such as Guermouche-Vergnaud (0.08%), Aerebrot (0.13%), Radoz-Lyderson (0.08%), and Somayajulu four-parameter equation (0.08%).

• Textile Coloration and Finishing
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• v.7 no.3
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• pp.31-37
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• 1995

Effects of glycol pretreatment conditions such as concentration and molecular weight of glycols and dye types of different constitutions on the degree of transfer were investigated when transfer printed onto the cotton fabric with disperse dyestuffs. Obtained results are as follows ; 1. Although the degree of transfer increases linearly with temperature a time, above a certain critical point, they show decremental aspects for both of C.I. Disperse Orange 3 and C.I. Diperse Violet 1. 2. Degree of transfer increases with molecular weight of glycols, but PEG 200 which has a moleular weight 200 and boiling point of 300$^{\circ}C$ is more effcient than that of lower molecular weight. 3. Degree of tansfer for the C.I. Disperse Orange 3 having constitution of azo benzene type is somewhat higher than that of C.I. Disperse Violet 1 of amino anthraquinone.

• Journal of Advanced Marine Engineering and Technology
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• v.26 no.1
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• pp.132-137
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• 2002

Recently, impinging spray is used for atomization of diesel engine, but it bring on adhesion of fuel. Therefore, we studied about droplet behavior on high temperature plate changing the size of droplet, surface temperatures, and surface roughness of plate. In this study, We studied to confirm experimentally about mechanism of evaporation and ignition process of single fuel droplet. We observed evaporation time, evaporation appearance and ignition delay time by the photopraphs of 8mm video camera. Experimental results are summarized as follows: 1. The boiling point of fuel affect a evaporation and ignition process. 2. The surface roughness affect a evaporation time. 3. The ignition delay time relate to evaporation characteristic.

• Journal of Biomedical Engineering Research
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• v.10 no.2
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• pp.94-96
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• 1989

Explosive evaporative removal process of biological tissue by absorption of a CW laser has been simulated by using gelatin and a multimode Nd:YAG laser. Because the point of maximun temperature of laser-irradiated gelatin exists below the surface due to surface cooling, evaporation at the boiling temperature is made explosively from below the surface. The important parameters of this process are the conduction loss to laser power absorption (defined as the conduction-to-laser power parameter, Nk), the convection heat transfer at the surface to conduction loss (defined as Bi), dimensionless extinction coefficient (defined as Br.), and dimensionless irradiation time (defined as Fo). Dependence of Fo on Nk and Bi has been observed by experiment, and the results have been compared with the numerical results obtained by solving a 2-dimensional conduction equation. Fo and explosion depth (from the surface to the point of maximun temperature) are increased when Nk and Bi are increased.To find out the minimum laser power for explosive evaporative removal process, steady state analysis has been also made. The limit of Nk to induce evaporative removal, which is proportional to the inverse of the laser power, has been obtained.