• Title/Summary/Keyword: Board combination

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Development of a Optimum Inward Design Software for Corrugated Board (Corrugated Board의 최적내형설계 소프트웨어 개발)

  • Park, Jong-Min
    • KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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    • v.10 no.1
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    • pp.27-36
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    • 2004
  • Software summarized packaging technology related is needed for low cost and high efficiency in production and packaging design of corrugated board, and in development of these softwares, distribution and packaging environment of one's country must be reflected, well. In domestic occasion, software related to corrugated board packaging dont's exist nearly, and in many industrial fields, the more higher role and importance of packaging in various industrial field is, the more higher necessity of that is. In this study, on the base of preceeding studies (Park, 2001; 2003; 2003), software to optimize board combination that is most importance and sensitivity in composition of cost elements in production and packaging design of corrugated board was developed. This software was composed of input module, output module, database and management module, and calculation module, and efficiency of this software was analyzed on the both sides of sensitivity in design result and effectiveness in a case analyse. In the inward design results having same strength, board combination balance, bursting strength, box weight, and cost were greatly different. Therefore, optimum inward design according to user's design specifications is possible, and in a case analysis for actual products, obtained the more profitable results than before design.

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Buckling Analysis of Corrugated Board using Finite Element Method (유한요소법에 의한 Corrugated Board의 휨 발란스 해석)

  • 박종민
    • Journal of Biosystems Engineering
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    • v.28 no.2
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    • pp.127-136
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    • 2003
  • The top-to-bottom compression strength of corrugated board box is the most important mode of loading during it's no, and it depends largely on the edgewise compression strength of the corrugated board in the cross-machine direction and to a considerable extent on the flexural stiffness in both principal directions (CD; cross-machine direction, MD; machine direction) of the corrugated board. Corrugated board is a sandwich structure with an orthotropic property. The purpose of this study was to elucidate the principal design parameters for board combination of corrugated board from the viewpoint of bending strength through the finite element analysis [FEA] fur the various corrugated board. In general, the flexural stiffness [FS] in the MD was 2-3 times larger than that in the CD, and the effect of liner for the FS of corrugated board was much bigger than that of corrugating medium. The flexural stiffness index [FSI] was high when the stiffness of liner was in the order of inner, outer, and middle liner in double-wall corrugated board [DW], and the effect of the stiffness arrangement or itself reinforcement of corrugating medium on the FSI was not high. In single-wall corrugated board [SW] with DW. the variation of FSI with itself stiffness reinforcement of liner was much bigger than that with stiffness arrangement of liner. The highest FSI was at the ratio of about 2:1:2 for basis weight distribution of outer, middle, and inner liner if the stiffness of liner and total basis weight of corrugated board were equal in DW Secondarily. basis weight was in the order of inner, outer, and middle liner. However, the variation of FSI with basis weight distribution between liner and corrugating medium was much bigger than that with itself basis weight distribution ratio of liner and corrugating medium respectively in both DW and SW. md the FSI was high as more total basis weight was divided into liner. These phenomena fur board combination of corrugated board based on the FEA were well verified by experimental investigation.

Manufacturing Characteristics of Cement-Bonded Wood Composite Board as Sound Absorption Type-Noise Barrier

  • Suh, Jin-Suk;Kang, Eun-Chang;Park, Jong-Young
    • Journal of the Korean Wood Science and Technology
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    • v.32 no.6
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    • pp.50-56
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    • 2004
  • This study was conducted to investigate the performance of sound absorption type-noise barriers manufactured with a combination of wood particles used for particleboard, recycled waste newspaper, and cement. An average density of wood-combined cement board was in the range from 0.83 to 0.96 g/cm3, showing relatively low-density board. Regardless of types of cement bonded board or wooden board, the board with concave holes(凹)-formed surfaces showed greater sound absorption coefficient compared to those of flat surface boards. The board density was not related with those coefficients. Accordingly, it was concluded that concave or deep corrugated surface structure has played an important role in sound absorption for the application of sound absorption type-noise barrier.

Characteristics of a Home Panel Board with Surge Protection Device (서-지차단장치 내장형 단위세대 분전반의 특성)

  • 이종혁;송재용;이종호;홍경민;길경석
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2000.05a
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    • pp.480-483
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    • 2000
  • We developed a home electric panel board with surge protection device to protect home electric appliances from transient overvoltages and electromagnetic(EM) noise. In this paper, electrical characteristics of the home electric panel board are described. From the performance test using a combination surge generator standardized in IEC 610004-5, it is confirmed that the proposed home panel board has an excellent surge protection performance. Also, EM noise reduction characteristics of the panel board in ranges from 150 kHz to 30 MHz is estimated by using a network analyser, and the results showed that the panel board has an over 20 45 noise reduction performance.

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Risk Management Functions and Audit Report Lag among Listed Saudi Manufacturing Companies

  • OMER, Waddah Kamal Hassan;ALJAAIDI, Khaled Salmen;AL-MOATAZ, Ehsan Saleh
    • The Journal of Asian Finance, Economics and Business
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    • v.7 no.8
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    • pp.61-67
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    • 2020
  • This paper examines whether the combination of risk management and audit committee functions are associated with audit report lag. Audit report lag is considered an important aspect of the financial reporting. The financial reports are the main source of information for shareholders through which they make their decisions and it assists in reducing the information asymmetry. As the internal control mechanisms substitute the external ones, the internal board committees formed by the board of directors can reduce the audit work and, consequently, reduces the audit report lag. A key committee is the risk management committee. This paper examines whether the combination of risk management and audit committee functions are associated with audit report lag. We posit that a combination of such functions in one committee refereed as audit committee affects the audit report delay. Data were obtained from 198 manufacturing companies listed on the Saudi Stock Exchange (Tadawul) for the years 2016-2018. A pooled OLS regression analysis shows that a combination of risk management and audit committee functions in a stand-alone committee named "audit committee" is associated with longer audit report lag. The outcomes suggest companies should prioritize the establishment of standalone risk management committee with activities separated from those of audit committees.

The analysis on the possibility of applying carbon board pattern design using the woodcut technique to Interior decorating materials (목판화 기법을 활용한 carbon board용 pattern design과 interior 장식재로서의 적용 가능성 분석)

  • Kim, Eun-Ju
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.21 no.1
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    • pp.27-33
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    • 2011
  • Carbon board, an electromagnetic shielding new material, is expected to be applied to the art wall by combining draft designs. When environment-friendly architecture materials are used as an interior wall, they are suitable as finishing materials. According to the increasing tendency of the application of carbon board, various styles could be made by decorating the whole or a part of a wall with tiles with module structure or by patterning the wall with panel-type woodcut or pictures or sculpture. And more graphic design based on diverse variation, and reconstruction and combination between other motif is being on the rise as a new expression. In this paper, make it possible to applying in MDF board and carbon board pattern design using the woodcut technique. The structural and physical properties were compared by usability of abrasion, toughness, stability. Samples are analyzed dependent on the hardness and relative density, change of detail pattern design and trimming technique. These results have shown that the possibility of applying of carbon board can be a high rank interior materials, capable of creating value of the living system, connects with MDF board, also can express humanism in a beautiful manner.

A Design of Embedded LED Display Board Module and Control Unit which the Placement of Pixels is Free (픽셀 배치가 자유로운 임베디드 LED 전광판 모듈 및 제어장치 설계)

  • Lee, Bae-Kyu;Kim, Jung-Hwa
    • Journal of the Institute of Electronics and Information Engineers
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    • v.50 no.10
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    • pp.135-141
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    • 2013
  • In this paper, we installed three high brightness red, green, and blue LED in one socket and made one pixel unit. And we also developed the full-color display board module and control unit which can express various images such as text, graphics, video image with the combination of pixel units and a number of modules. LED display driver module have a driver circuit within the combination of the RGB pixel dot on unit area. These modules of the existing form can be high priced because of implementation a fixed resolution in specific space and installation space. To overcome these shortcomings, we developed a LED driver and LED pixel modules free in array at random pitch intervals. Display board module of this paper enabled to display smoothly video image which have many data processing quantity through dragging data speed up 36 frames per second. Also there are an effect which is provided more clear image because of improving the flickering of the existing display board.

A novel hybrid LLC converter topology of on-board battery chargers for electric vehicles (전기자동차 온보드 충전기를 위한 새로운 하이브리드 LLC 공진 컨버터)

  • Ta, Le Anh Dao;Lee, Dong-Choon
    • Proceedings of the KIPE Conference
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    • 2018.11a
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    • pp.197-198
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    • 2018
  • This paper proposes a novel hybrid converter topology suitable for electric vehicle on-board battery chargers, which is a combination of the full-bridge (FB) and half-bridge (HB) LLC circuits. A full load controllability under wide output voltage range can be achieved with a small resonant inductance, which increases the efficiency and lowers the size and cost. Simulation results are shown to evaluate the dynamic performance of the proposed converter.

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Design and Fabrication of a Home-panel Board for Electromagnetic Compatibility (전자파 대응 단위세대 분전반의 설계 및 제작)

  • 길경석;송재용;이종혁;권장우;송동영
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.14 no.6
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    • pp.18-25
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    • 2000
  • This paper describes the design and fabrication of a home-panel board for electromagnetic compatibility which can protect home-electric appliances from transient voltages and power line noise. The proposed panel board include a transient voltage blocking device and a EMI filter which consisted of varistors, capacitors, and bus line inductance.A performance test of the prototype panel board, blocking characteristics to transient voltages and reduction characteristics to power line noise, are carried out by using a combination surge generator standardized in IEC and a network analyzer.The results showed that the proposed panel board is satisfied with the surge immunity level of IEC 61000-4-5, and has an over 20[dB] noise reduction performance in ranges from 150[kHz]∼30[MHz].

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A Study on the/ Correlation Between Board Level Drop Test Experiment and Simulation

  • Kang, Tae-Min;Lee, Dae-Woong;Hwang, You-Kyung;Chung, Qwan-Ho;Yoo, Byun-Kwang
    • Journal of the Microelectronics and Packaging Society
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    • v.18 no.2
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    • pp.35-41
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    • 2011
  • Recently, board level solder joint reliability performance of IC packages during drop impact becomes a great concern to semiconductor and electronic product manufacturers. The handheld electronic products are prone to being dropped during their useful service life because of their size and weight. The IC packages are susceptible to solder joint failures, induced by a combination of printed circuit board (PCB) bending and mechanical shock during impact. The board level drop testing is an effective method to characterize the solder joint reliability performance of miniature handheld products. In this paper, applying the JEDEC (JESD22-B111) standard present a finite element modeling of the FBGA. The simulation results revealed that maximum stress was located at the outermost solder ball in the PCB or IC package side, which consisted well with the location of crack initiation observed in the failure analysis after drop reliability tests.