• 대한전기학회:학술대회논문집
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• 대한전기학회 1998년도 하계학술대회 논문집 F
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• pp.2030-2032
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• 1998

It is always necessary to high performance power supplies for the magnet system in the accelerator, especially when the number of power supplies are large. When have developed the compact power supply using switching technology instead of SCR phase control. We adopt the pulse width modulation(PWM) method with a half bridge DC/DC converter. In this way, we can make a compact system with light weight and small volume. Actual system we developed is 1.2kW, 35V/35A bipolar DC power supply current precision of +/-0.02%. It is possible to mount 10 unit in a conventional 19 rack. The built in controller has an RS422 protocol to drive 10 unit by one serial port up to 1.2km distance. If we adopt RS485 protocol, one serial port can control 32 power supplies. In this paper, we will report the design and performance of the prototype power supply.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.30-31
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• 2008

As the power density and switching frequency increase, thermal analysis of power electronics system becomes imperative. The analysis provides valuable information on the semiconductor rating, long-term reliability. In this paper, thermal distribution of the Non Punchthroug(NPT) Insulated Gate Bipolar Transistor with heatsink areas has been studied. For analysis of thermal distribution, we obtained results by using finite element simulator, ANSYS and compared with experimental data by thermocam.

• 전력전자학회논문지
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• 제21권2호
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• pp.117-125
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• 2016

In this paper, the inverter switch losses of BLDC motor for three types of PWM methods and power devices were analyzed. When the BLDC motor is driven at low currents, the inverter switch losses for MOSFET are low because MOSFET operates like resistance. However, the inverter switch losses for IGBT are higher than MOSFET due to its large turn-off losses. Moreover, synchronous rectification switching method is adaptable because MOSFET has 2-channel. So, MOSFET can be driven with more low impedance and losses. For low power inverter with MOSFET, the power losses of unified PWM are lower than that of unipolar and bipolar PWM. Proposed method and losses analysis results are verified by examination and simulation using Matlab/Simulink.

• ETRI Journal
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• 제35권4호
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• pp.603-609
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• 2013

In this paper, we present a 600-V reverse conducting insulated gate bipolar transistor (RC-IGBT) for soft and hard switching applications, such as general purpose inverters. The newly developed RC-IGBT uses the deep reactive-ion etching trench technology without the thin wafer process technology. Therefore, a freewheeling diode (FWD) is monolithically integrated in an IGBT chip. The proposed RC-IGBT operates as an IGBT in forward conducting mode and as an FWD in reverse conducting mode. Also, to avoid the destructive failure of the gate oxide under the surge current and abnormal conditions, a protective Zener diode is successfully integrated in the gate electrode without compromising the operation performance of the IGBT.

• 대한전기학회논문지
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• 제45권2호
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• pp.230-234
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• 1996

A new trenched Hybrid Schottky INjection Field Effect Transistor (HSINFET) is proposed and verified by 2-D semiconductor device simulation. The feature of the proposed structure is that the hybrid Schottky injector is implemented at the trench sidewall and p-n junction injector at the upper sidewall and bottom of a trench. Two-dimensional simulation has been performed to compare the new HSINFET with the SINFET, conventional HSINFET and lateral insulated gate bipolar transistor(LIGBT). The numerical results shows that the current handling capability of the proposed HSINFET is significantly increased without sacrificing turn-off characteristics. The proposed HSINFET exhibits higher latch-up current density and much faster switching speed than the lateral IGBT. The forward voltage drop of the proposed HSINFET is 0.4 V lower than that of the conventional HSINFET and the turn-off time of the trenched HSINFET is much smaller than that of LIGBT.

• 전력전자학회:학술대회논문집
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• 전력전자학회 2015년도 전력전자학술대회 논문집
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• pp.301-302
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• 2015

본 논문은 레독스 흐름 전지(Redox Flow Battery : RFB)용 양극성을 갖는 DC-DC 컨버터의 기본 동작 원리 및 최적 스위칭 기법에 관한 것이다. 양극성을 갖는 DC-DC 컨버터는 매우 낮은 배터리 전압에서도 완전 방전을 위해 고승압이 필요하고, 완전 방전 후 극성 반전이 되어 매우 낮은 전압에서도 충전이 가능하여야 한다. 본 논문에서는 이러한 동작이 요구되는 RFB용 DC-DC 컨버터의 스위칭 손실을 최소화하기 위한 스위칭 방법을 제안한다. 최종 발표 시 실험 결과를 제시하고자 한다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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• pp.147-148
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• 2005

As the power density and switching frequency increase, thermal analysis of power electronics system becomes imperative. The analysis provides valuable information on the semiconductor rating, long-term reliability and efficient heat-sink design. In this paper, thermal distribution of the Insulated Gate Bipolar Transistor Module has been studied with different conditions and heat sink materials. For analysis of thermal distribution, we obtained results by using finite element simulator, Ansys.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.172-173
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• 2007

As the power density and switching frequency increase, thermal analysis of power electronics system becomes imperative. The thermal analysis provides valuable information on the semiconductor rating, long-term reliability. In this paper, thermal distribution of the Non Punchthrough(NPT) Insulated Gate Bipolar Transistor has been studied. For analysis of thermal distribution, we obtained experimental and simulation results by using finite element simulator, Ansys and by using photographic infrared thermometer, we compared experimental date with simulation result. and got good agreement. Also this paper provided thermal distribution of IGBT connected to heat sinks. and this results will be good information to design optimal heat sink for IGBT.

• 한국화재소방학회논문지
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• 제10권2호
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• pp.28-39
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• 1996

A recently developed electro-thermal simulation methodology is used to analyze the behavior of a PWM(Pulse-Width-Modulated) voltage source inverter which uses IGBT(Insulated Gate Bipolar Transistor) as the switching devices. In the electro-thermal network simulation methdology, the simulator solves for the temperature distribution within the power semiconductor devices(IGBT electro-thermal model), control logic circuitry, the IGBT gate drivers, the thermal network component models for the power silicon chips, package, and heat sinks as well as the current and voltage within the electrical network. The thermal network describes the flow of heat form the chip surface through the package and heat sink and thus determines the evolution of the chip surface temperature used by the power semiconductor device models. The thermal component model for the device silicon chip, packages, and heat sink are developed by discretizing the nonlinear heat diffusion equation and are represented in component from so that the thermal component models for various package and heat sink can be readily connected to on another to form the thermal network.

• 전력전자학회논문지
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• 제27권1호
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• pp.9-17
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• 2022

The series-connected semiconductor devices structure is one way to achieve a high voltage rating. However, a problem with voltage imbalance exists in which different voltages are applied to the series-connected switches. This paper proposed a new voltage balancing technique that controls the turn-off delay time of the switch by adding one bipolar junction transistor to the gate turn-off path. The validity of the proposed method is proved through simulation and experiment. The proposed active gate driver not only enables voltage balancing across a variety of current ranges but also has a greater voltage balancing performance compared with conventional RC snubber methods.