• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.26 no.4
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• pp.275-277
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• 2013

Thin-film transistors(TFTs) with silicon zinc tin oxide(SZTO) channel layer are fabricated by solution-process. The threshold voltage ($V_{th}$) shifted toward positive directly with increasing Si contents in SZTO system. Because the Si has a lower standard electrode potential (SEP) than Sn, Zn, thus degenerate the oxygen vacancy (VO). As a result, the Si act as carrier suppressor and oxygen binder in the SZTO as well as a $V_{th}$ controller.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.22 no.6
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• pp.1018-1024
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• 2013

In the process of draw die design for stamping automotive press panels, the addendum surfaces generated in metal forming simulation software cannot be used in downstream processes such as machining and making draw dies because simulation tools use simple discrete models for the surface geometry. The downstream processes require more precise and continuous geometric models such as NURBS surfaces. Generally, automotive die engineers manually regenerate the addendum surface geometry using the discrete model. This paper presents an automated geometric modeling process for generating addendum surfaces using draft surface models. The design parameters of the section curve for the addendum surfaces are extracted automatically from the draft geometry. Using the extracted design parameters, smooth addendum surfaces are generated automatically as NURBS surfaces. The generated surfaces are $G^1$ continuous with the part surface and the binder surface, and can be used in downstream processes.

• 한국신재생에너지학회:학술대회논문집
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• 2009.06a
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• pp.126-129
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• 2009

In this study, it was aimed to develop the re-use technology of ultra-fine silicon powders, by-products during the current production process of high purity poly-Si feedstock. For this goal, the compacts of the silicon powders were tried to fabricate by CIP (Cold Isostatic Pressing) method using silicon rubber mold without chemical binder materials. The density ratio of the silicon powder compacts reached 74%. In order to simulate the actual handling and charging conditions of feedstock material in casting process, a shaking test was carried out and mass loss measured. Finally, the silicon powder compacts were melted using a cold crucible induction melting method and the purity assessment was conducted by Hall effect measurement.

• Journal of the Korean Graphic Arts Communication Society
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• v.22 no.2
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• pp.123-138
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• 2004

The video phone tube (VPT) of monochrome CRT have utilized home door phone, fish-finder and the rear watch monitors. Phosphor screen formation is made by electrodeposition spin coating and thermal transfer methods etc. Recently, thermal transfer method was developed, as a novel method, to form the phosphor surface for mnonchrom VPT. This method have advantages of simple process, automatization, clean environment, saving raw material and saving running-cost. In this study, it was developed new phosphor of VPT, and tested about phosphor paste properties. An experimental studies of VPT as a new phosphor property and improved VPT's manufacturing process shortening and brightness. As thermal transper method is a paste processing, it is important that rheology of phosphor effects on the formation of phosphor screen. Hence this paper was studied rheology properties of phosphor paste and the formation of phosphor screen had looked most suitable condition. Experimented thermal separation properties of low calcination temperature resin and the result analyzed comparison by TGA. Also, examined calcination properties to reduce remaining binder phosphor.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.7
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• pp.606-610
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• 2001

Bi-2212 HTS tube was fabricated by centrifugal forming and partial melting processes. Bi-2212 bulk tube has been optimized to achieve smooth surface and uniform thickness. The slurry was prepared in the mixing ratio of 10:1 between Bi-2212 powder and binder and initially charged into the rotating mold under the speed of 300~450 rpm. Heat-treatment was performed at the temperature ranges of 860~89$0^{\circ}C$ in air for partial melting. the HTS tube fabricated by centrifugal forming process at 89$0^{\circ}C$ under the rotating speed of 450 rpm was highly densified and the plate-like grains with more than 20${\mu}{\textrm}{m}$ were well oriented along the rotating axis. The measured Tc and J$_{c}$ at 10K on specimen heat treated at 89$0^{\circ}C$ was around 85 K and 1,200 A/$\textrm{cm}^2$ respectively.y.

• Journal of the Korean Society for Precision Engineering
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• v.16 no.5 s.98
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• pp.98-103
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• 1999

The application field of porous mold is more and more expended. A mixture of alumina and cast iron is used for making porous mold using slip and vacuum casting method in this study. Slip casting is a process that slurry is poured into silicon rubber mold, dried in vacuum oven, debinded and sintered in furnace, In this procedure, slurry is composed of powder, binder, dispersion agent, and water. Vacuum casting is a technique for removing air bubbles existed in the slurry under vacuum condition. Since ceramics has a tendency of over-shrinkage after sintering, cast iron is used to compensate dimensional change. The results shows that sintering temperature has a great effect on characteristics of alumina-cast iron composite sintered parts. Finally ceramic-metal composite sintered mold can be used for aluminum alloy casting of shoe mold using this process.

• Journal of Powder Materials
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• v.9 no.4
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• pp.245-250
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• 2002

In this paper we presented numerical method for the simulation of powder injection molding filling process, which is one of the key processes in powder injection molding. Rheological properties of powder binder mixture such as slip phenomena and yield stress were introduced into the numerical analysis model of powder injection molding filling simulation. Numerical model can be classified into two types. One is 2.5D model which can be introduced to a arbitrary thin geometry and the other is full 3D model which can be applied to a general 3D shape. For 2.5D model we showed the validity of our CAE system with several verification examples. Finally we suggested flow analysis model for 3D powder injection molding filling simulation.

• Proceedings of the KAIS Fall Conference
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• 2001.05a
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• pp.91-94
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• 2001

Powder Metallurgy method have been used to fabricate TiC base composite with ferrous binder. TiC base composite has versatile hardness and is usable as sintered, or after heat treatment as required by the given applications. Smooth, round TiC grains impart high wear resistance and lubricity as well known characteristics of this composite. Annealed composite can be formed by conventional machining and be hardened up to 70 H$\_$R/C in vacuum. The optimizing fabrication process enables this composite to improve mechanical properties in heat, wear and corrosion environments. This study has examine the relationship between fabrication condition and mechanical property in TiC-Cr-Mo-Fe Composite.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09a
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• pp.24-25
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• 2006

High-Speed Centrifugal Compaction Process is one of slip-using compacting method originally developed for processing of oxide ceramics. In this study, we apply the HCP to ultra-fine (0.1 micron) WC powder. Organic liquid of heptane was chosen as dispersing media to avoid possible oxidation of WC. The mixing apparatus was a key to obtain dense compacts. Only the slips mixed by high energy planetary ball mill were packed up to 55% by the HCP, and sintered to almost full density at 1673 K without any sintering aids. This sintered compact marked Vickers hardness of Hv 2750 at maximum.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.270-273
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• 2000

For the well-preparation of the superconducting wire by electrophoresis, the control of the cracking on the YBCO, BSCCO superconductor deposited on Ag wire in acetone and buthanol solution with PEG(poly-ethylenglycol) was investigated with XRD and SEM analysis. After deposition, drying and heat treatment process, the cracks on the deposited surface of YBCO and BSCCO samples was clearly removed and decreased, which was perpared in suspension with addition of PEG from 1 to 3ml. However, in the case of the addition rate of PEG in acetone suspension was exceeded in 3ml, BSCCO superconductor deposited on Ag wire was slightly melted at 90$0^{\circ}C$ which was the same heat treatment condition of other samples with different additin rate of PEG. In the process of electrophoretic deposition, drying and heat treatment, PEG added into the suspension solution as a binder was very useful to prepare the crack-free thick film-wire of YBCO and BSCCO.