• Journal of Korea Foundry Society
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• v.17 no.4
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• pp.356-364
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• 1997

In order to study effects of Cu and Be on the microstructure and tensile properties of rapidly solidified Al-Mg alloys, Al-Mg-Cu-Be alloys have been rapidly solidified by inert gas atomization process. Microstructure of rapidly solidified Al-Mg-Cu-Be powders exhibited refinement and good dispersion of Be particles as increasing of solidification rate. Solidification rate of atomized powders was estimated to be about $5{\times}10^{3{\circ}}C/s$. Inert gas atomized Al-Mg-Cu-Be powders were hot-processed by vacuum hot pressing at $450^{\circ}C$ under 100 MPa and hot extruded with reduction ratio in area of 25: 1 at $450^{\circ}C$. The extruded Al-Mg-Cu-Be powders consisted of recrystallized fine Al grains and homogeneously dispersed fine Be particles, and exhibited improved tensile properties with increase in Cu content. $Al_2CuMg$ compounds precipitated in grain and grain boundaries of Al-Mg-Cu-Be alloys with aging heat treatment after solution treatment. Hardness and tensile properties were improved by increasing Cu content and Be addition. Compared with extruded Al-Mg-Cu powders, the extruded Al-Mg-Cu-Be powders exhibited finer recrystallized grains and improved tensile properties by dispersion hardening of Be and subgrain boundaries pinned by fine Be particles. After aging treatment, hardness and tensile properties were improved due to restricted precipitation by increasing of dislocation density around Be particles in matrix.

• Journal of Sensor Science and Technology
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• v.21 no.1
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• pp.34-38
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• 2012

We have developed a cost effective test socket for ball grid array(BGA) integrated circuit(IC) packages using BeCu metal sheet as a test probe. The BeCu furnishes the best combination of electrical conductivity and corrosion resistance. The probe of the test socket was designed with a BeCu cantilever. The cantilever was designed with a length of 450 ${\mu}m$, a width of 200 ${\mu}m$, a thickness of 10 ${\mu}m$, and a pitch of 650 ${\mu}m$ for $11{\times}11$ BGA. The fabrication of the test socket used techniques such as through-silicon-via filling, bonding silicon wafer and BeCu metal sheet with dry film resist(DFR). The test socket is applicable for BGA IC chip.

• Clean Technology
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• v.8 no.3
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• pp.111-117
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• 2002

Catalytic decomposition and reduction of NO have been carried out on copper loaded mordenites in a packed bed flow reactor. For the decomposition of NO, $Cu^{\circ}/HM$ exhibited higher activities than CuO/HM at high copper content, which may be related to the difference in the amount of $Cu^{2+}$ ions and the reducibility of CuO between $Cu^{\circ}/HM$ and Cuo/HM. However, $Cu^{\circ}/HM$ showed higher reduction activities than CuO/HM at low copper content. This result may be dependent on the difference in the amount of high-reducibility CuO between $Cu^{\circ}/HM$ and CuO/HM.

• Journal of the Korean Ceramic Society
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• v.32 no.1
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• pp.83-89
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• 1995

YBa2Cu3O7-$\delta$, Y2BaCuO5, and binary compounds in the Ba-Cu-O system with the nominal composition of Ba2CuO3, BaCuO2, Ba3Cu4O7, Ba3Cu5O8 were synthesized to investigate the heat evolutions and crystalline phases in the hydration reaction of orthorhombic YBa2Cu3O7-$\delta$ phase. The observed crystalline phases were YBa2Cu3O7-$\delta$, Y2BaCuO5, and BaCuO2, or Ba2Cu3O5＋x, and some amount of noncrystalline phase in the Ba-Cu system comounds. In contact with distilled water, YBa2Cu3O7-$\delta$ and Y2BaCuO5 did not have considerable heat liberation, but in the binary compounds of the Ba-Cu-O system, the amount of total heat liberation was increased with respect to the Cu content. It might be that the reaction of high temperature superconductor YBa2Cu3O7-$\delta$ with water and/or moisture originated from the unusual oxidation state of Cu ion and the presence of amorphous Ba-Cu oxide compound. The degradation of high Tc superconductor by moisture and water could be controlled by restricting the heterogeneous distribution of Tc comlposition and the formation of second phase, such as stable Y2BaCuO5, and the resulting unstable Ba-Cu oxide compound.

• Journal of Powder Materials
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• v.7 no.3
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• pp.154-160
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• 2000

In order to enhance sinterability of W-Cu composites used for heat sink materials, mechanical alloying process where both homogeneous mixing of component powders and fine dispersion of minor phase can be easily attained was employed. Nanostructured W-Cu powders prepared by mechanical alloying showed W grain size ranged of 20-50 nm and were able to be efficiently sintered owing to the fine particle size as well as uniform distribution of Cu phase. The thermal properties such as electrical resistivity, coefficient of thermal expansion and thermal conductivity were evaluated as functions of temperature and Cu content. It was found that the coefficient of thermal expansion could be controlled by changing Cu content. The measured electrical resistivities and thermal diffusivities were also varied with Cu content. The thermal conductivities calculated from the values of resistivities and diffusivities showed similar tendency as a function of temperatures. However, this is in contradiction with thermal conductivities of pure W and Cu which decrease with increasing temperature.

• Journal of Welding and Joining
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• v.3 no.2
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• pp.27-34
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• 1985

The mechanical properties and bonding mechanism of aluminum, copper and mild steel have been determined in cold pressure welding. The brittle cover layer to be established by scratch-brushing plays an important role in bond strength and has an influence on the threshold of deformation. The cold pressure welding was achieved at 54% of height reduction in A1-A1, 75% in Cu-Cu, 56% in Al-Cu, and 74% in Cu-steel. The height reduction at which the bond strength of weld interface was the same as the tensile strength of base metal should be over 76% in Al-Al, 82% in Cu-Cu, and 78% in Al-Cu.

• Journal of the Korean institute of surface engineering
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• v.39 no.6
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• pp.255-262
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• 2006

Pd-Cu alloy membrane for hydrogen separation was fabricated by sputtering and Cu reflow process. At first, the Pd and Cu was continuously deposited by sputtering method on oxidized Si support, the Cu reflow process was followed. Microstructure of the surface and permeability of the membrane was investigated depending on various reflow temperature, time, Pd/cu composition and supports. With respect to our result, Pd-Cu thin film (90 wt.% Pd/10 wt.% Cu) deposited by sputtering process with thickness of $2{\mu}m$ was heat-treated for Cu reflow The voids of the membrane surface were completely filled and the dense crystal surface was formed by Cu reflow behavior at $700^{\circ}C$ for 1 hour. Cu reflow process, which is adopted for our work, could be applied to fabrication of dense Pd-alloy membrane for hydrogen separation regardless of supports. Ceramic or metal support could be easily used for the membrane fabricated by reflow process. The Cu reflow process must result in void-free surface and dense crystalline of Pd-alloy membrane, which is responsible for improved selectivity oi the membrane.

• Journal of Korea Foundry Society
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• v.15 no.4
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• pp.351-359
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• 1995

The effects of In and Be additions on the aging behaviors and mechanical properties in the Al-Cu-Li alloy were investigated using the transmission electron microscope, the scanning electron microscope, hardness and tensile strength measurement. The aging is promoted and the double hardness peak is appeared by the addition of In and Be in the Al-Cu-Li alloy. The strength is increased, but the elongation and toughness are decreased by the addition of In in the Al-Cu-Li alloy. And the Al-Cu-Li-In-Be alloy has good combination with the strength, the elogation and toughness than Al-Cu-Li-In alloy.

• Journal of the Korean institute of surface engineering
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• v.51 no.6
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• pp.360-364
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• 2018

A facile method to fabricate freestanding CuO nanoleaves and CuO nanowires-based films was demonstrated. $Cu(OH)_2$ nanoleaves and nanowires were prepared by a hydrolysis reaction in aqueous solution including pyridine and NaOH with the tailored concentrations at room temperature. The films of freestanding CuO nanoleaves and CuO nanowires can be successfully obtained via the simple vacuum infiltration following a thermal dehydration reaction. The morphologies and crystallinity of the $Cu(OH)_2$ nanoleaves/nanowires and CuO nanoleaves/nanowires were characterized by XRD, SEM, TEM and FT-IR. The films fabricated with freestanding CuO nanoleaves and nanowires in this study may be applicable for building high-efficiency organic binder-free devices, such as gas sensors, batteries, photoelectrodes for water splitting and so on.

• Journal of the Korean Ceramic Society
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• v.35 no.1
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• pp.55-65
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• 1998

The oxidation behavior of Ag-36.8a%Cu-7.4at%Ti alloy brazed on Si3N4 substrate was investigated at 400, 500 and 600$^{\circ}C$ in air. Under this experimental condition Si3N4 and Ag were not oxidized whereas Cu and Ti among the brazing alloy components were oxidizied obeying the parabolic oxidation rate law. The activation energy of oxidation was found to be 80kj/ mol which was smaller than that of pure Cu owing to the presence of oxygen active element of Ti. The outer oxide scale formed from the initial oxidation state was always composed of Cu oxides which were known to be growing by the outward diffusion of Cu ions. As the oxidation progressed the concentration gradient occurred due to the continuous consumption of Cu as Cu oxides and consequently build-up of an Ag-enriched layer below the Cu oxides resulted in the formation of multiple oxide scales composed of Cu oxide (CuO) /Ag-enriched layer/Cu oxide (Cu2O) /Ag-enriched layer. Also the inward diffusing of oxygen through Cu oxide and Ag-enriched layers led to the formation of internal oxides of TiO2.