• Title/Summary/Keyword: Ball size

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Particle Morphology Change and Quantitative Input Energy Variation during Stirred Ball Milling Process by DEM Simulation on Various Experimental Conditions (교반볼밀을 이용한 밀링공정에서 각종실험조건에 따른 구리분말의 입자형상 변화 및 DEM 시뮬레이션에 의한 정량적 에너지 변화)

  • Bor, Amgalan;Batjargal, Uyanga;Jargalsaikhan, Battsetseg;Lee, Jehyun;Choi, Heekyu
    • Korean Journal of Materials Research
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    • v.28 no.3
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    • pp.148-158
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    • 2018
  • This study investigated the effect of the grinding media of a ball mill under various conditions on the raw material of copper powder during the milling process with a simulation of the discrete element method. Using the simulation of the three-dimensional motion of the grinding media in the stirred ball mill, we researched the grinding mechanism to calculate the force, kinetic energy, and medium velocity of the grinding media. The grinding behavior of the copper powder was investigated by scanning electron microscopy. We found that the particle size increased with an increasing rotation speed and milling time, and the particle morphology of the copper powder became more of a plate type. Nevertheless, the particle morphology slightly depended on the different grinding media of the ball mill. Moreover, the simulation results showed that rotation speed and ball size increased with the force and energy.

Experimental Study on the Regenerative Oxy-Fuel Combustion System with Ceramic Ball (세라믹 볼 축열체를 이용한 순산소 축열연소시스템에 대한 실험적 연구)

  • Hong, Sung Kook;Noh, Dong Soon;Lee, Eun Kyung
    • Journal of Energy Engineering
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    • v.22 no.2
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    • pp.169-174
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    • 2013
  • An experimental study has been conducted for the design of the regenerative oxy-fuel combustion system with ceramic ball. Various design parameters are considered such as ball size, regenerator weight, and combustion load. Regenerative system with a pair of oxygen burners and regenerators is set up and the temperature of oxygen and exhaust gas passing through ball regenerator is measured. It is shown that the temperature distributions with time are affected by ball diameter and regenerator weight, and the significant temperature change is observed by combustion load. As the ball size decreases and the regenerator weight increases, the regenerating temperature efficiency increases. It is found that the heat recovery ratio is low despites of high regeneration temperature efficiency.

Refinement of Crystalline Boron and the Superconducting Properties of $MgB_2$ by Attrition Ball Milling (어트리션 볼 밀링에 의한 보론 분말의 미세화 및 $MgB_2$의 초전도특성)

  • Lee, J.H.;Shin, S.Y.;Jun, B.H.;Kim, C.J.;Park, H.W.
    • Progress in Superconductivity
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    • v.10 no.1
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    • pp.23-28
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    • 2008
  • We report refinement of crystalline boron by an attrition ball milling system and the superconducting properties of the $MgB_2$ pellets prepared from the refined boron. In this work, we have conducted the ball milling with only crystalline boron powder, in order to improve homogeneity and control the grain size of the $MgB_2$ that is formed from it. We observed that the crystalline responses in the ball-milled boron became broader and weaker when the ball-milling time was further increased. On the other hand, the $B_{2}O_{3}$ peak became stronger in the powders, resulting in an increase in the amount of MgO within the $MgB_2$ volume. The main reason for this is a greater oxygen uptake. From the perspective of the superconducting properties, however, the sample prepared from boron that was ball milled for 5 hours showed an improvement of critical current density ($J_c$), even with increased MgO phase, under an external magnetic field at 5 and 20 K.

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Fabrication of Core-Shell Structure of Ni/Au Layer on PMMA Micro-Ball for Flexible Electronics

  • Hong, Sung-Jei;Jeong, Gyu-Wan;Han, Jeong-In
    • Current Photovoltaic Research
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    • v.4 no.4
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    • pp.140-144
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    • 2016
  • In this paper, core-shell structure of nickel/gold (Ni/Au) conductive layer on poly-methyl-methacrylate (PMMA) micro-ball was fabricated and its conduction property was investigated. Firstly, PMMA micro-ball was synthesized by using dispersion polymerization method. Size of the ball was $2.8{\mu}m$ within ${\pm}7%$ deviation, and appropriate elastic deformation of the PMMA micro-ball ranging from 31 to 39% was achieved under 3 kg pressure. Also, 200 nm thick Ni/Au conductive layer was fabricated on the PMMA micro-ball by uniformly depositing with electroless-plating. Adhesion of the conductive layer was optimized with help of surface pre-treatment, and the layer adhered without peeling-off despite of thermal expansion by collision with accelerated electrons. Composite paste containing core-shell structured particles well cured at low temperature of $130^{\circ}C$ while pressing the test chip onto the substrate to make electrical contact, and electrical resistance of the conductive layer showed stable behavior of about $6.0{\Omega}$. Thus, it was known that core-shell structured particle of the Ni/Au conductive layer on PMMA micro-ball was feasible to flexible electronics.

Effect of Composition and Microstructure of Si$_3$N$_4$ Ball OH Rolling fatigue Life under Boundary Lubrication (경제윤활하에서 질화규소몰의 미세구조 및 조성이 구름피로수명에 미치는 영향)

  • 최인혁;송복한;신동우
    • Tribology and Lubricants
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    • v.16 no.6
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    • pp.477-483
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    • 2000
  • Rolling contact fatigue (RCF) tests were performed for two kinds of commercial silicon nitride balls using 4-Ball rolling contact fatigue life tester under EHL condition (Λ=8.9) and boundary lubrication condition (Λ=0.2). All the test balls were finished up to the dimensional accuracy of Grade 5 defined in KS B 2001 (Steel Balls for Ball Bearings) with a size of 8.731 mm. RCF tests were then conducted under the initial theoretical maximum contact stress 6.63 GPa and the spindle speed 10,000 rpm. All the test balls were not failed until 3.75 $\times$ 107 contact cycles and wear tracks of test balls were not conspicuous under EHL condition (Λ= 8.9). In the operations of low lambda regime (Λ= 0.2), all the test balls were surface damaged and high rolling wear resistance was achievable in fully densified using MgO 1 wt% and HIPed balls. Rolling wear of silicon nitride balls under boundary lubrication condition depend mainly on grain size and intergranular phase content of silicon nitride balls.

Mechanical Behavior of Al/C60-fullerenes Nanocomposites (풀러렌이 분산된 알루미늄기지 나노복합재의 기계적 거동)

  • Choi, Hyun-Joo
    • Composites Research
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    • v.26 no.2
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    • pp.111-115
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    • 2013
  • Aluminum-based composites containing $C_{60}$-fullerenes are produced by hot rolling of ball-milled powder. The grain size of aluminum is effectively reduced to ~100 nm during ball-milling processes, leading to grain refinement strengthening of the composite. Furthermore, $C_{60}$-fullerenes are gradually dispersed during ball-milling processes and hence the strength of the composite increases with the volume of $C_{60}$-fullerenes. The composite containing 10 vol% $C_{60}$-fullerenes with a grain size of ~ 100 nm exhibits ~1 GPa of compressive strength.

Spark-Plasma Sintering of Mechanically-alloyed NiAl Powder and Ball-milled (Ni+Al) Powder Mixture (기계적합금화 NiAl 분말과 볼밀혼합된 (Ni+Al) 분말의 방전플라즈마소결)

  • 장영일;김지순;안인섭;김영도;권영순
    • Journal of Powder Materials
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    • v.7 no.3
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    • pp.161-167
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    • 2000
  • Mechanically-alloyed NiAl powder and ball-milled (Ni+Al) powder mixture were sintered by spark-plasma sintering(SPS) process. Mechanical alloying was performed in a horizontal attritor for 20 h with rotation speed of 600 rpm. (Ni+Al) powder mixtures were prepared by ball milling for 1 and 10 h with 120 rpm. Both powders were sintered at $1150^{\circ}C$ for 5 min under $10^{-3}$ torr vacuum with 50 MPa die pressure in a SPS facility. Sintered densities of 97% and 99% were obtained from mechanically-alloyed NiAl powder and (Ni+Al) powder mixture, respectively. The sintered compact of (Ni+Al) powder mixture showed large grain size by a very rapid grain growth, while the grain size of mechanically-alloyed NiAl powder compact after sintering was extremely fine(80 nm). The difference in densification behavior of both powders were discussed.

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Studies on the Synthesis of Potassium Hexatitanate and Manufacturing Thin Film Type Matrix (Potassium hexatitanate의 합성과 박막형 Matrix 제작에 관한 연구)

  • 심중표;이홍기;이주성
    • Journal of the Korean institute of surface engineering
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    • v.26 no.6
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    • pp.299-306
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    • 1993
  • The characteristic of synthesized potassium hexatitanate and manufacturing of thin film type matrix for battery was studied. After ball milled the mixture with 1:4 of $K_2CO_3$ and TiO2, mixsture was sintered at 85$0^{\circ}C$ and its product was confirmed with XRD. Adding the PTFE to the obtained potassium hexatitanate according to there various ball-mill time to control its particle size, thin film type matrix was manufactured. The high-est wettability of 50% was found with 12 hour ball milled powder containing 10w/o of PTFE and also it shown good mechanical properties. The matrix with $K_2O$$\cdot$$6TiO_2$ whisker shown 170% of wettability. Thed char-acteristics of matrix made by whisker and powder mixture were compared with the investigation of bubbled pressure and pore size distribution to improve its mechanical properties.

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Evaluation of Fracture Strength of Silicon Die with Surface Condition by Ball Breaker Test (볼브레이커시험에 의한 실리콘 다이의 표면조건에 따른 파단강도 평가)

  • Byeon, Jai-Won
    • Journal of the Korean Society for Heat Treatment
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    • v.26 no.4
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    • pp.178-184
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    • 2013
  • The effects of thickness and surface grinding condition on the fracture strength of Si wafer with a thickness under $100{\mu}m$ were investigated. Fracture strength was measured by ball breaker test for about 330 dies (size: $4mm{\times}4mm$) per each wafer. For statistical analysis of the fracture strength, scale factor was determined from Weibull plot. Ball breaker fracture strength was observed to increase with decreasing thickness of silicon die. For the silicon dies of different surface conditions, ball breaker fracture strength was high in the order of polished, ground (#4800), and ground (#320 grit) specimen. Probabilistic fracture strength (i.e., scale factor) increased with decreasing surface roughness of silicon die.