Journal of the Korean Society for Heat Treatment (열처리공학회지)

The Korean Society for Heat Treatment (한국열처리공학회)
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Evaluation of Fracture Strength of Silicon Die with Surface Condition by Ball Breaker Test

볼브레이커시험에 의한 실리콘 다이의 표면조건에 따른 파단강도 평가

  • Byeon, Jai-Won (Department of Materials Science & Engineering, Seoul National University of Science & Technology)
  • 변재원 (서울과학기술대학교 신소재공학과)
  • Received : 2013.05.27
  • Accepted : 2013.06.17
  • Published : 2013.07.30
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Abstract

The effects of thickness and surface grinding condition on the fracture strength of Si wafer with a thickness under $100{\mu}m$ were investigated. Fracture strength was measured by ball breaker test for about 330 dies (size: $4mm{\times}4mm$) per each wafer. For statistical analysis of the fracture strength, scale factor was determined from Weibull plot. Ball breaker fracture strength was observed to increase with decreasing thickness of silicon die. For the silicon dies of different surface conditions, ball breaker fracture strength was high in the order of polished, ground (#4800), and ground (#320 grit) specimen. Probabilistic fracture strength (i.e., scale factor) increased with decreasing surface roughness of silicon die.

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References

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