참고문헌
- J. D. Wu, C. Y. Huang and C. C. Liao : Microelectronics Reliab., 43 (2003) 269. https://doi.org/10.1016/S0026-2714(02)00314-1
- H. H. Jiun and G. Omar : Microelectronics Reliab., 46 (2006) 836. https://doi.org/10.1016/j.microrel.2005.07.110
- Z. Chen, J. B. Han and N. X. Tan : Journal of Electronic Packaging, 125 (2003) 115.
- Y. K. Min and J. W. Byeon : J. Microelectron. Packag. Soc., 18 (2011) 15.
- J. N. Calata, J. G. Bai, X. Liu, S. Wen and G. Q. Lu : IEEE Transactions on Advanced Packaging, 28 (2005) 404. https://doi.org/10.1109/TADVP.2005.852837
- P. A. Wang : IEEE Proceedings of the Fourth World Conference on Photovoltaic Energy Conversion, (2006) 1179.
- N. M. Lellan, N. Fan, S. Liu, K. Lau and J. Wu : ASME J Electron. Packag., 126 (2004) 110. https://doi.org/10.1115/1.1647123
- J. Paul, B. Majeed, K. M. Razeeb, and J. Barton : Acta Materiallia, 54 (2006) 3991. https://doi.org/10.1016/j.actamat.2006.04.032
- G. Omar, N. Tamaldin, M. R. Muhamad, and T. C. Hock : IEEE, Semiconductor Electronics Proceedings ICSE International Conference (2000) 147.
- M. Y. Tsai, and C. H. Chen : Microelectronics Reliab., 48 (2008) 933. https://doi.org/10.1016/j.microrel.2008.03.003
- P. H. DeHoff, K. J. Anusavice, and P. W. Hathcock : J. Dent. Res., 61 (1982) 1066. https://doi.org/10.1177/00220345820610090801
- T. K. Woo, Y. H. Kim, H. S. Ahn, and S. I. Kim : J. Microelectron. Packag. Soc., 16 (2009) 61.
- M. K. Choi, and E. K. Kim : J. Microelectron. Packag. Soc., 15 (2008) 63.
- Y. Desmond, R. Chong, W. E. Lee, and B. K. Lim : IEEE Inter. Society Conference on Thermal Phenomena (2004) 203.
- ASTM C 1161-02C (1990).