• Journal of the Korean Society for Precision Engineering
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• v.13 no.2
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• pp.76-83
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• 1996

We have developed the unconventional robot arm which is composed of the two main parts, one is a ball screw and the other is a robot arm. The dynamic systems of the robot arm and ball screw are unstable systems coupled with each other. The ball screw mechanism is unstable system but controllable system. The robot arm's dynamics is quasi stable system when ball screw's angular position is zero, else, unstable system. Our system has the duality between stability and controllability at the view point of control. This duality causes difficulty to control of the robot arm using normal control law. We have investigated the location of the characteristic roots of the dynamic equation. And we have found out that the best condition for the control of the arm is quasi stable state. In this paper, we have proposed multiple control laws which are consist of three components to guarantee the stability and controllability simultaneously. The computer simulations were carried out based on VSC about the angular position control of the robot arm, and it is confirmed that the good performances could be obtained by using new controller.

• Journal of Welding and Joining
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• v.20 no.4
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• pp.505-509
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• 2002

Pb is considered to be eliminated from solder, due to its toxicity. However, melting temperatures of most Pb-free solders are known higher than that of Sn37Pb. Therefore, there is a difficulty to apply Pb-free solders to electronic industry. Since Sn3Ag8Bi5In has relatively lower melting range as $188~200^{\circ}C$, on this study. Wettability and soldering characteristics of Sn3Ag8Bi5In solder in BGA were investigated to solve for what kind of problem. Zero cross time, wetting time, and equilibrium force of Sn3Ag8Bi5In solder for Cu and plated Cu such as Sn, Ni, and Au/Ni-plated on Cu were estimated. Plated Sn on Cu showed best wettability for zero cross time, wetting time and equilibrium farce. Shear strength of the reflowed joint with Sn3Ag8Bi5In ball in BGA was investigated. Diameter of the ball was 0.5mm, UBM(under bump metallurgy) was $Au(0.5\mu\textrm{m})Ni(5\mu\textrm{m})/Cu(18\mu\textrm{m})$ and flux was RMA type. For the reflow soldering, the peak reflow temperature was changed in the range of $220~250^{\circ}C$, and conveyor speed was 0.6m/min.. The shear strength of Sn3Ag8Bi5In ball showed similar level as those of Sn37Pb. The soldered balls are aged at $110^{\circ}C$ for 36days and their shear strengths were evaluated. The shear strength of Sn3Ag8Bi5In ball was increased from 480gf to 580gf by aging for 5 days.

• Journal of Advanced Marine Engineering and Technology
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• v.37 no.6
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• pp.603-610
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• 2013

Finite element analysis is performed to evaluate stress and deformation of a wrinkle-type dust cover for the ball joints of tie rods of automotive steering system. Results of the analysis for assembly and operation condition show that sealing capability is good and the maximum stress on the body is smaller than the tensile strength. An optimal shape of the dust cover is obtained using the Taguchi method to reduce the maximum stress. The maximum stress of the optimal design under the operation condition is reduced by 22 per cent of that of the initial design. Results of the research show that performance evaluation and design of the dust covers can be effectively done using the proposed method.

• Tribology and Lubricants
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• v.27 no.3
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• pp.140-146
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• 2011

A miniature pendular type impact testing machine was designed and developed, adopting a magnetic powder brake in order to investigate tensile and shear behavior of a small solder ball at high speed. In this testing system, the potential energy of the pendulum is transferred into the impact energy during its drop. Then, the impact energy is transmitted through the striker which is connected to the push rods to push the specimen for tensile loading. The tensile behavior of lead-free solder ball in diameter of 760 ${\mu}m$ was successfully investigated in a speed range of 0.15 m/s~1.25 m/s using this designed device. The maximum tensile strength of the solder joint decreases with the loading speed in the testing condition. The maximum tensile strength of the joint was 56 MPa in the low speed region.

• Journal of Korean Association for Spatial Structures
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• v.3 no.2 s.8
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• pp.91-99
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• 2003

The purpose of this study is to analyze the characteristics of the connector having an influence on the elasto-plastic buckling load of ball-jointed single layer latticed domes. As an analytic model, domes are composed of tubular member elements, balls and connectors. The joint system of members in single layer latticed domes has influence on the buckling load. Therefore, in this paper, the variation of the elasto-plastic buckling load by effects of the connectors characteristics is analyzed. The structural behavior of the connector is investigated by following points: (1) the length of rigid zone, (2) looseness of screw and (3) the diameter of connector. In addition, the elasto-plastic buckling analysis is carried out through the variation of the connectors section of yielding part, and then the buckling mode of the dome is examined. As a result, it is emphasized that the characteristics of the connector have significant effects on the buckling load of latticed domes.

• International Journal of Control, Automation, and Systems
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• v.3 no.3
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• pp.453-460
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• 2005

In this paper, a prototype Cartesian Parallel Manipulator (CPM) is demonstrated, in which a moving platform is connected to a fixed frame by three PRRR limbs. Due to the orthogonal arrangement of the three prismatic joints, it behaves like a conventional X-Y-Z Cartesian robot. However, because all the linear actuators are mounted at the fixed frame, the manipulator may be suitable for applications requiring high speed and accuracy. Using a geometric method and the practical assumption that three revolute joint axes in each limb are parallel to one another, a simple forward kinematics for an actual model is derived, which is expressed in terms of a set of linear equations. Based on the error model, two calibration methods using full position and length measurements are developed. It is shown that for a full position measurement, the solution for the calibration can be obtained analytically. However, since a ball-bar is less expensive and sufficiently accurate for calibration, the kinematic calibration experiment on the prototype machine is performed by using a ball-bar. The effectiveness of the kinematic calibration method with a ball-bar is verified through the well­known circular test.

• Transactions of Materials Processing
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• v.16 no.2 s.92
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• pp.132-137
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• 2007

A double roll rotary forming equipment is presented in this paper. The equipment is developed for joining the socket with the ball of a concave piston assembly with its geometrical tolerance requirements satisfied. The equipment is composed of a lathe, a double roll system and a roll pressing unit driven by the hydraulic system. The workpiece rotates by spindle chuck of the lathe while the double roll system approaches perpendicularly to the central line of the workpiece. The equipment is successfully applied to precision joining of the ball and the socket fur the concave piston assembly of a high pressure hydraulic pump.

• Journal of Advanced Marine Engineering and Technology
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• v.27 no.2
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• pp.238-245
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• 2003

To overcome the weakness in the load capacity of conventional robot manipulators actuated by motors with the speed reducer such as the harmonic driver, we proposed a new closed-chain type of the robot actuator which is composed of the four-bar-link mechanism driven by the ball screw. The robot manipulator is revolute-jointed and composed of four axes. The base axis is actuated by the lineal actuator such as the ball screw, and the others are actuated by the proposed actuator. We analyzed the mechanism of the actuators of the robot joints, and developed the dynamics model. The dynamics are expressed in the joint coordinates and then they are mapped into the sliding coordinates of the ball screw. We performed fundamental tests on the structure of the robot.

• Steel and Composite Structures
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• v.20 no.6
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• pp.1323-1343
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• 2016

This paper presents the results of an extensive numerical analysis program devoted to the investigation of the mechanical behaviour of bolted ball-cylinder joints. The analysis program is developed by means of finite element (FE) models implemented in the non-linear code ABAQUS. The FE models have been accurately calibrated on the basis of available experimental results. It is indicated that the FE models could be used effectively to describe the mechanical performance of bolted ball-cylinder joints, including failure modes, stress distributions and load-displacement curves. Therefore, the proposed FE models could be regarded as an efficient and accurate tool to investigate the mechanical behavior of bolted ball-cylinder joints. In addition, to develop a further investigation, parametric studies were performed, varying the dimensions of hollow cylinders, rectangular tubes, convex washers and ribbed stiffener. It is found that the dimensions of hollow cylinders, rectangular tubes and ribbed stiffener influenced the mechanical behaviour of bolted ball-cylinder joints significantly. On the contrary, the effects of the dimensions of convex washers were negligible.

• Journal of Welding and Joining
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• v.20 no.2
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• pp.77-81
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• 2002

Many kinds of Pb-free solder have been investigated because of the environmental concerns. Sn-Ag-Cu system is well blown as most competitive Pb-free solder. However, since Sn-Ag-Cu system has relatively high melting point compared to Sn-Pb eutectic, it may a limitation, the some application. In this study, Bi and In contained solder of $Sn_3Ag_8Bi_5In$ which has relatively lower melting point, $188~204^{\circ}C$, was investigated. $Sn_3Ag_8Bi_5In$ solder ball of $500\mu\textrm{m}$ diameter was set on the Ni/Cu/Cr-UBM and reflow soldered in the range of $220~240^{\circ}C$ for 5~15s. The maximum shear strength of the solder ball was around 170mN by reflowing at $240^{\circ}C$ for 10s. Intermetallic compound formed on the UBM of Si-wafer was analysed by SEM(scanning electron microscope) and XRD(X-ray diffractometer).