• Journal of the Microelectronics and Packaging Society
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• v.9 no.3
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• pp.31-36
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• 2002

The 2nd level solder joint reliability of 153 FC-BGA for high-speed SRAM (Static Random Access Memory) with the large chip on laminate substrate comparing to PBGA(Plastic Ball Grid Array) was studied in this paper. This work has been done to understand an influence as the mounting with single side or double sides, structure of package, properties of underfill, properties and thickness of substrate and size of solder ball on the thermal cycling test. It was confirmed that thickness of BT(bismaleimide tiazine) substrate increased from 0.95 mm to 1.20 mm and solder joint fatigue life improved about 30% in the underfill with the low young's modulus. And resistance against the solder ball crack became twice with an increase of the solder ball size from 0.76 mm to 0.89 mm in solder joints.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.11a
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• pp.67-73
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• 2001

To investigate the relationships of solder joint characteristics with solder composition and A:V ratio (solder volume per pad area), Sn-37Pb and Sn-4.0Ag-0.5Cu solder balls with 330, 400, 450 and $457{\mu}{\textrm}{m}$ size were reflowed on same substrate. Sn-37Pb and Sn-4.0Ag-0.5Cu was reflowed at $220^{\circ}C$ and $240^{\circ}C$ respectively by IR-type soldering machine. As a result of reflowed solder- ball diameter(D) and height(H) measurement, D/H was decreased with solder ball size increment in range of 330~450 ${\mu}{\textrm}{m}$. But, D/H was increased in the solder joint for 457 ${\mu}{\textrm}{m}$ size, it was caused possibly by decrement of solder ball height increment compared with solder volume increment. As a result of shear and pull test, joint strength with A:V ratio was high. Joint strength of Sn-4.0Ag-0.5Cu was higher than Sn-37Pb. However, Sn-37Pb had more stable solder joint of small standard deviation. A thick and clean scallop type Ni-Cu-Sn intermetallic compound layer was formed in high A:V ratio and Sn-4.0Ag-0.5Cu solder joint interface.

• Journal of Welding and Joining
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• v.20 no.2
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• pp.90-94
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• 2002

FC-BGA has advantages over other interconnection methods including high I/O counts, better electrical performance, high throughput, and low profile. But, FC-BGA has a lot of reliability issues. The 2nd level solder joint reliability of the FC-BGA with large chip on laminate substrate was studied in this paper. The purpose of this study is to discuss solder joint failures of 2nd level thermal cycling test. This work has been done to understand the influence of the structure of package, the properties of underfill, the properties and thickness of bismaleimide tiazine substrate and the temperature range of thermal cycling on 2nd level solder joint reliability. The increase of bismaleimide tiazine substrate thickness applied to low modulus underfill was improve of solder joint reliability. The resistance of solder ball fatigue was increased solder ball size in the solder joints of FC-BGA.

• Journal of Welding and Joining
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• v.21 no.3
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• pp.92-98
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• 2003

This paper describes the numerical prediction of the thermal fatigue life of a $\mu$BGA(Micro Ball Grid Array) solder joint. Finite element analysis(FEA) was employed to simulate thermal cycling loading for solder joint reliability. Strain values, along with the result of mechanical fatigue tests for solder alloys were then used to predict the solder joint fatigue life using the Coffin-Manson equation. The results show that Sn-3.5mass%Ag solder had the longest thermal fatigue life in low cycle fatigue. Also a practical correlation for the prediction of the thermal fatigue life was suggested by using the dimensionless variable ${\gamma}$, which was possible to use several lead free solder alloys for prediction of thermal fatigue life. Furthermore, when the contact angle of the ball and chip has 50 degrees, solder joint has longest fatigue life.

• 제어로봇시스템학회:학술대회논문집
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• 2005.06a
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• pp.1814-1819
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• 2005

This paper describes the development of a Stewart platform-based robot force sensor with distinctive structure of ball joints. The number of ball joints is only a half of the similar style sensors, so it is possible to reduce size and weight of the sensor. The structure of ball joint is described and discussed. Furthermore, we use strain gauges, but not liner voltage differential transformers, as sensing elements, in order to reduce size and weight of the sensor. It is also proposed that beams are replaced with pipes as sensing elements of the sensor. The ball joints and sensing elements with pipes can effectively reduce the error of the sensor. A geometric analysis model is also proposed. The external force and its moment can be measured with this model. Moreover, the performance of this sensor was tested. The test results conducted to evaluate the sensing capability of the sensor is reported and discussed.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2013.05a
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• pp.969-970
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• 2013

• Journal of Korean Association for Spatial Structures
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• v.7 no.6
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• pp.61-68
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• 2007

The hole for the insertion of the pin in the shank is exist at ball joint connection of the space frame. It brings about the brittle fracture caused by stress concentration. Consequently it cannot expect the deformation performance or energy absorption performance from ball joint connection. In this study we developed a new connection details which will increase the plastic deformation performance at ball joint connection and can absorb the error in construction, which expect the plastic deformation performance at the reduced shank without brittle fracture at the screw of bolt and pin. Also it's capacity is verified by the performance in numerical analysis and test. We confirmed bolt's plastic deformantion performance through controled shank and pin's area.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.1
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• pp.705-713
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• 2018

An automotive ball joint connects the suspension system to the steering system and helps to enable rotational and linear motion between the two elements for steering. This study examines a ball joint used in medium and large-sized pickup trucks. Ball joints consist of a stud, socket, bearing, and plug. The main structural performance metrics of ball joints are the pull-out strength and push-out strength. These structural parameters must meet certain criteria to avoid serious accidents. Test and simulation methods are used to investigate the design requirements, but tests are time-consuming and costly. In this study, we modeled ball joints in SolidWorks and performed a finite element analysis in Abaqus to predict structural performance. The analysis was used to obtain the structural performance required for the static analysis of a 2D axisymmetric model. The uncertainties in the manufacturing of the ball joint were assumed to be the manufacturing tolerances, and the dimensional design variables were identified through case studies. The manufacturing tolerances at each level were defined, and the results were compared with experimental results.

• Tribology and Lubricants
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• v.19 no.3
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• pp.123-132
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• 2003

The effect of surface texture on elastohydrodynamic lubrication (EHL) point contact of a ball Joint mechanism in small reciprocating compressors is studied numerically by using multigrid method. Pressure and film thickness profiles have been calculated for surface roughness with waviness of different orientations and transverse ridge and dent at minimum and maximum Hoes M parameter conditions. The influence of the amplitude and the wavelength of the surface roughness was also studied. Results show that the oblique waviness with orientation angle of 30$^{\circ}$generates the smallest minimum film thickness as compared with those of longitudinal, transverse, and other oblique roughness. The influence of transverse waviness on the minimum film thickness is smaller than for the longitudinal waviness case.

• Journal of Applied Reliability
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• v.12 no.3
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• pp.165-176
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• 2012

Hydrostatic bearing improves performance and life time of a product by avoiding solid friction and reducing viscosity friction with the help of creating pressure equilibrium between two faces doing relative motion. This study suggests failure analysis and test evaluation for a ball joint that adopts the hydrostatic bearing and introduces the entire process to improve reliability of the product by design improvement. A typical failure is growth of friction torque by solid friction, and its failure cause is determined and the improvement is proposed. Finally, reliability improvement is established by analysis of the results of before and after acceleration test.