• 제어로봇시스템학회:학술대회논문집
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• 1996.10b
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• pp.109-112
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• 1996

The more integrated and smaller SMD are needed, new solder joints packaging technologies are developed in these days such as BGA(Ball Grid Array), Flip Chip, J-lead etc. But, it's unable to inspect solder joints in those devices by visual inspection methods, because they are hided by it's packages. To inspect those new SMD packages, an X-ray system for acquiring a cross-sectional image of a arbitrary plane is necessary. In this paper, an analysis for designing X-ray cross sectional imaging system is presented including the way for correcting the distortion of image intensifier. And we show computer simulation of that system with a simple PCB model to show it's usefulness in applying PCB solder joint inspection.

• Earthquakes and Structures
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• v.23 no.6
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• pp.535-547
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• 2022

Handball sport, as its name postulates, is a team sport which highly physical workout. During a handball play, several ball impacts are applied on the hands resulting vibration in the forearm, upper arm, shoulders and in general in whole body. Hand has important role in the handball's game. So, understanding about the dynamics and some issues that improve the stability of the hand is important in the sport engineering field. Ulna and radius are two parallel bones in lower arm of human hand which their ends are located in elbow and wrist joint. The type of the joint provides the capability of rotation of the lower arm. These two bones with their ends conditions in the joints constructs a 4-link frame. The ulna is slightly thinner than radius. So, understanding about hand kinematics in handball's game is an important thing in the engineering field. So, in the current work with the aid of a multi-physics simulation, dynamic stability analysis of the ulna and radius bones will be presented in detail.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.2
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• pp.35-41
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• 2011

Recently, board level solder joint reliability performance of IC packages during drop impact becomes a great concern to semiconductor and electronic product manufacturers. The handheld electronic products are prone to being dropped during their useful service life because of their size and weight. The IC packages are susceptible to solder joint failures, induced by a combination of printed circuit board (PCB) bending and mechanical shock during impact. The board level drop testing is an effective method to characterize the solder joint reliability performance of miniature handheld products. In this paper, applying the JEDEC (JESD22-B111) standard present a finite element modeling of the FBGA. The simulation results revealed that maximum stress was located at the outermost solder ball in the PCB or IC package side, which consisted well with the location of crack initiation observed in the failure analysis after drop reliability tests.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2006.05a
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• pp.211-214
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• 2006

The outer race of the constant velocity(CV) joint is an important load-supporting automotive part, which transmits torque between the transmission and the wheel. The outer race is difficult to forge, because its shape is very complex and the required dimensional tolerances are very stringent. Therefore, the internet based shape inspection system is developed in this study to provide quick and accurate data through the easy control from users. Proposed system uses mechanical displacement sensors to measure the shape of CV joint that has six inner ball grooves, and commercially available Lab-View program is used to process measured data into the dimensional shape. Developed program provides a simple user interface that enables users real-time access of data measured from industrial production lines. Furthermore, it can exchange measured data via the internet between users and forging system operators. A java applet helped the system connection via internet. A data, IP access, is transmitted to the packet by TCP/IP. Our proposed system has many advantages over current measuring systems including fast and efficient data processing by real-time control, and system flexibility.

• Journal of the Korean Society of Safety
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• v.30 no.6
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• pp.7-11
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• 2015

The present study investigates the impact shear strength of thermal aged Sn-3Ag-0.5Cu lead-free solder joints at impact speeds ranging from 0.5 m/s to 2.5 m/s. The specimens were thermal aged for 24, 100, 250 and 1000 hours at $100^{\circ}C$. The experimental results demonstrate that the shear strength of the solder joint decreases with an increase in the load speed and aging time. The shear strength of the solder joint aged averagely decreased by 43% with an increase in the strain rate. For the as-reflowed specimens, the mode II stress intensity factor ($K_{II}$) of interfacial IMC between Sn-3.0Ag-0.5Cu and a copper substrate also was found to decrease from $1.63MPa.m^{0.5}$ to $0.97MPa.m^{0.5}$ in the speed range tested here. The degradations in the shear strength and fracture toughness of the aged solder joints are mainly caused by the growth of IMC layers at the solder/substrate interface.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.138-141
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• 2002

There are continuous efforts in the electronics industry to a reduced electronic package size. Reducing the size of electronic packages can be achieved by a variety of means, and for ball grid array(BGA) packages an effective method is to decrease the pitch between the individual balls. Chip scale package(CSP) and BGA are now one of the major package types. However, a reduced package size has the negative effect of reducing board-level reliability. The reliability concern is for the different thermal expansion rates of the two-substrate materials and how that coefficient CTE mismatch creates added stress to the BGA solder joint when thermal cycled. The point of thermal fatigue in a solder joint is an important factor of BGA packages and knowing at how many thermal cycles can be ran before failure in the solder BGA joint is a must for designing a reliable BGA package. Reliability of the package was one of main issues and underfill was required to improve board-level reliability. By filling between die and substrate, the underfill could enhance the reliability of the device. The effect of underfill on various thermomechanical reliability issues in $\mu$BGA packages is studied in this paper.

• Journal of the Korean Academy of Clinical Electrophysiology
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• v.5 no.2
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• pp.35-45
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• 2007

The purpose of this study was to examine spiral way movement of a trunk exerts on the movement ability. The details established to achieve for this article. This examination confirmed the weight, weight/height2 index, ratio of lumbar to pelvic, musculoskeletal quantity, push up for 2 minute, pitch a ball and voluntary isometric contraction with flexion and extension of knee joint of the subjects with spiral direct movement. Healthy eighteen subjects who understand fully the significance of procedure, consented to a plan, without neuromuscular disease were participated in two groups of experiment. The group were a spiral movement(9), rectilinear movement(9). Trunk movement tested 2 sessions of a spiral movement and rectilinear movement with a push up for 2 minute, 5days per a week, for the 4 weeks. This experiment tested 3 times with a sufficient rest for fatigue limitation. An analysis of the results used a paired samples t-test for difference from before and after experiment. The following results were obtained; At an internal change of the body, the musculoskeletal quantity was increased significantly to spiral movement group, but the weight was increased significantly, the musculoskeletal quantity was not significant to rectilinear movement. The movement ability evaluation for a external change was increased significantly in a push up for 2 minute, pitch a ball, isometric contraction with extension of knee joint of a spiral movement group, but a push up for 2 minute was increased significantly in a push up for 2 minute on the abdominal muscle training of a rectilinear movement group. As compared with a rectilinear movement, a spiral movement was more effect by cooperation with nerve and musculoskeletal system and an increase in movement ability was caused by learning acknowledgment, muscular reeducation. These results lead us to the conclusion that a spiral movement of trunk was more effect than a rectilinear movement, the coordination of nerve and musculoskeletal system was of importance of Multi-direction movement. Therefore, A further studies concerning the therapeutic exercise intervention and active-dynamic analysis could enhance the development of the most effect on the trunk.

• Korean Journal of Applied Biomechanics
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• v.16 no.4
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• pp.125-134
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• 2006

The purpose of this study was to analyze the Biomechanical elements by looking at the differences on the motions of the right and left spikes of right-handed offense volleyball players, using 3D image analysis and force platform. For that purpose, spike motions of six male university volleyball players were recorded three times each using two 16mm high speed cameras and the speed of recording was set at 60 frames/sec. The coordinated raw data was leveled as 6Hz using low pass filtering method and the calculation of 3D coordinates was done by using a DLT (Direct Linear Transformation) method. Also KWON 3D program was used to analyze the variables. Through the experiments and research, the following results were found: That is, in case of the right spike, the required time from the toss to the impact, which affected the success rate of offense showed as longer and on the take-off, the exact timing to touch the ball was longer because the pace between right and left feet was wider, and also after the jump, the distance between the feet indicated shorter, than the left. In addition, the degree of somersault and horizontal adduction of shoulder joint was smaller and the degree of medial rotation of shoulder joint showed bigger than the left, so it indicated that it was not centered on the body, but by the arm with an axis of shoulder using a swing motion. After the impact, the speed of the ball indicated slower compared to the left spike.

• Journal of the Korean Society of Physical Medicine
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• v.11 no.4
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• pp.147-156
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• 2016

PURPOSE: The purpose of this study was to investigate the effects of sensory motor training using ball exercise on shoulder range of motion, pain, dysfunction, and quality of life in Breast Cancer Women after Mastectomy. METHODS: A total of 26 patients from D University Hospital in Daejeon were included and randomly allocated to two groups (n=13 per group). The two groups performed the exercise five times a week for 4 weeks. A sensory motor training group (SMTG) received general physical treatment for 10 minutes and sensorimotor training for 20 minutes. A control group (CG) received general physical therapy for 30 minutes. Shoulder pain (the Visual Analog Scale), range of motion, disability (the shoulder pain and disability index) and quality of life (the Functional Assessment Cancer Therapy-Breast instrument) were measured in both groups before and after 4-weeks intervention. RESULTS: A significant difference was found in joint range of motion, shoulder pain, functional disability level, and quality of life within the two groups (p <.05). In addition, changes in joint range of motion, pain, functional disability level, and quality of life after then intervention were significantly different between the two groups (p <.05). CONCLUSION: These results suggest that a sensory motor training program is feasible, safe, and suitable exercise for shoulder functions and quality of life in Breast Cancer Women after Mastectomy.

• Journal of Korean Tunnelling and Underground Space Association
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• v.14 no.4
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• pp.321-336
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• 2012

The shear behavior at the particle/surface interface such as rock joint can determine the mechanical behavior of whole structure. Therefore, a fundamental understanding of the mechanisms governing its behavior and accurately estimation of the interface strength is essential. In this paper, PFC, a numerical analysis program of discrete element method was used to investigate the effects of the surface roughness crushing on interface strength. The surface roughness was characterized by smooth, intermediate, and rough surface, respectively. Particle shape was classified into one ball model of circular shape and 3 ball model of triangular shape. The surface shape was modelled by wall model of non-crushing surface and ball model of crushing surface. The results showed that as the bonding strength of ball model decreases, lower interface strength is induced. After the surface roughness crushing was occurred, the interface strength tended to converge and higher bonding strength induced lower surface roughness crushing. Higher friction angle was induced in wall model and higher surface roughness induced the higher friction angle. From these findings, it is verified that the surface roughness and surface roughness crushing effect on the particle/surface interface shear behavior.