• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.10a
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• pp.458-461
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• 1997

We have developed a human-sized BWR(biped walking robot) driven by a new actuator based on the ball screw which has high strength and high gar ratio. Each leg of the robot is composed of three pitch joints and one roll joint. In all, a 10 degree-of-freedom robot with two balancing joints was developed. For the purpose of autonomous walking and higher performance, we improved the previous developed BWR. We improved the motor drive efficiency, designed the ball screw actuator in a modular type, and simplified the electric wires. Through this modification, we achieved better performance in walking.

• Journal of Institute of Control, Robotics and Systems
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• v.8 no.6
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• pp.484-491
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• 2002

We developed a new type of human-sized BWR (biped walking robot) driven by a new actuator based on the ball screw which has high strength and high gear ratio. Each leg of the robot is composed of three pitch joints and one roll joint. In all, a 10 degree-of-freedom robot with two balancing joints was developed. A new type of actuator for the robot is proposed, which is composed of four bar link mechanism driven by the ball screw. The robot overcomes the limit of the driving torque of conventional BWRs. The BWR was designed to walk autonomously by adapting small DC motors for the robot actuators and has a space to board DC battery and controllers. In the performance test, the BWR performed sitting-up and down motion, and walking motion. Through the test, we found the possibility of a high performance biped-walking.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.33 no.8
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• pp.760-766
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• 2009

In the manufacturing process of HDD, ball swaging method is commonly used to joint the Head Gimbal Assembly(HGA) with the arm of the actuator. The hub on the HGA is placed into the hole of the actuator arm, and the hub and arm is bonded by the pressure of steel ball. The pressure for plastic deformation on the baseplate causes the undesirable deformation on HGA, such as tilting, flying height change of head. After obtaining the key parameters that have large sensitivity on the swaging process, the optimal shape of baseplate is proposed to increase the static performance during swaging process. Contribution of the proposed design for the swaging performance is verified by contact simulation with elasto-plastic deformation.

• Journal of the Korean institute of surface engineering
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• v.35 no.1
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• pp.47-52
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• 2002

Intermetallic compound on the soldered interface plays important role on the bondability and mechanical properties of soldered joint. The formation of intermetallic compounds are influenced by many factors such as temperature, holding time, base metals and so on. On this study the effect of number of reflow times on the intermetallic growth was investigated. For the experimental materials, Sn-3.5Ag-0.7Cu solder ball of 0.3mm diameter and RMA-type flux were used. Thickness of intermetallic compound of solder ball by 2nd reflow showed nearly 60% higher than that of 1st reflow, and shear strength showed 10% higher value. Thickness and shear strength according to the position of interface such as upper side or lower side between two substrates were also investigated.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.69-74
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• 2015

With difficulties during the cleaning of reflow flux residues due to the decrease of the part size and interconnection pitch in the advanced electronic devices, the need for the no-clean solder paste is increasing. In this study, an epoxy curable solder paste was made with SAC305 solder powder and the curable flux of which the main ingredient is epoxy resin and its reflow solderability, flux residue corrosivity and solder joint mechanical properties was investigated with comparison to the commercial rosin type solder paste. The fillet shape of the cured product around the reflowed solder joint revealed that the curing reaction occurred following the fluxing reaction and solder joint formation. The copper plate solderability test result also revealed that the wettability of the epoxy curable solder paste was comparable to those of the commercial rosin type solder pastes. In the highly accelerated temperature and humidity test, the cured product residue of the curable solder paste showed no corrosion of copper plate. From FT-IR analysis, it was considered to be resulted from the formation of tight bond through epoxy curing reaction. Ball shear, ball pull and die shear tests revealed that the adhesive bonding was formed with the solder surface and the increase of die shear strength of about 15~40% was achieved. It was considered that the epoxy curable solder paste could contribute to the improvement of the package reliability as well as the removal of the flux residue cleaning process.

• Journal of Computational Design and Engineering
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• v.1 no.1
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• pp.55-66
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• 2014

A knee joint's longevity depends on the proper integration of structural components in an axial alignment. If just one of the components is abnormally off-axis, the biomechanical system fails, resulting in arthritis. The complexity of various failures in the knee joint has led orthopedic surgeons to select total knee replacement as a primary treatment. In many cases, this means sacrificing much of an other-wise normal joint. Here, we review novel computational approaches to describe knee physiotherapy by introducing a new dimension of foot loading to the knee axis alignment producing an improved functional status of the patient. New physiotherapeutic applications are then possible by aligning foot loading with the functional axis of the knee joint during the treatment of patients with osteoarthritis.

• Tribology and Lubricants
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• v.26 no.1
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• pp.44-51
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• 2010

A miniature shear testing machine was designed and developed, adopting a piezoelectric actuator with mechanical advantage using 4 levers in order to investigate shear behavior of a small solder ball. The final output displacement was initially expected to be 2.88 mm without load resistance, considering the lever ratio of 24 and the piezo displacement of 0.12 mm with an exciting voltage of 10 V. However, the final plunger displacement ${\Delta}{\upsilon}$ can be expected as ${\Delta}{\upsilon}=2.88-3.04{\times}10^{-4}F$ as a function of piezoelectric force F due to the stiffness of various levers and connectors and piezo actuator. The shear behavior of lead-free solder ball in diameter of $760{\mu}m$ was successfully investigated in a speed range of 2 mm/s~0.0035 mm/s using this designed device.

• Journal of Welding and Joining
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• v.19 no.3
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• pp.311-316
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• 2001

This paper presents that the affecting factors to the solderability and initial reliability. It is the factor that the coefficient of thermal expansion between package and PCB(Printed Circuit Board), the quantity of solder paste and reflow condition, and Au thickness of the solder ball pad on polyimide tape. As the reflow soldering condition for 48 ${\mu}BGA$ is changed, it is estimated that the quantity of Au diffusion at eutectic Sn-Pb solder surface and initial bonding strength of eutectic Sn-Pb solder and lead free solder. It is the result that quantitative measurement of Au diffusion quantity is difficult, but the shear strength of eutectic Sn-Pb solder joint is 842 mN at first reflow and increases 879 mN at third reflow. The major failure mode in solder is judged solder fracture. So, Au diffusion quantity is more affected by reflow temperature than by the reflow times.

• Proceedings of the KWS Conference
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• 2006.05a
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• pp.30-32
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• 2006

The interfacial reaction and reliability of eutectic Sn-Pb and Pb-free eutectic Sn-Ag ball-grid-array (BGA) solders with an immersion Ag-plated Cu substrate were evaluated following isothermal aging at $150^{\circ}C$. During reflowing, the topmost Ag layer was dissolved completely into the molten solder, leaving the Cu layer exposed to the molten solder for both solder systems. A typical scallop-type Cu-Sn intermetallic compound (IMC) layer was formed at both of the solder/Cu interfaces during reflowing. The thickness of the Cu-Sn IMCs for both solders was found to increase linearly with the square root of isothermal aging time. The growth of the $Cu_3Sn$ layer for the Sn-37Pb solder was faster than that for the Sn-3.5Ag solder, In the case of the Sn-37Pb solder, the formation of the Pb-rich layer on the Cu-Sn IMC layer retarded the growth of the $Cu_6Sn_5$ IMC layer, and thereby increased the growth rate of the $Cu_3Sn$ IMC layer. In the ball shear test conducted on the Sn-37Pb/Ag-plated Cu joint after aging for 500h, fracturing occurred at the solder/$Cu_6Sn_5$ interface. The shear failure was significantly related to the interfacial adhesion strength between the Pb-rich and $Cu_6Sn_5$ IMC layers. On the other hand, all fracturing occurred in the bulk solder for the Sn-3.5Ag/Ag-plated Cu joint, which confirmed its desirable joint reliability.

• Proceedings of the Korea Society of Costume Conference
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• 2005.10a
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• pp.168-169
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• 2005