• 마이크로전자및패키징학회지
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• 제9권3호
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• pp.31-36
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• 2002

PBGA에 비해 상대적으로 큰 칩을 실장하는 고속 SRAM용 153 FC-BGA을 대상으로 2차 솔더접합부의 신뢰성을 평가하였다. 실험은 열사이클 시험에서 발생하는 단면과 양면 실장, 패키지 구조, 언더 필 재료, 기판의 종류와 두께, 솔더 볼의 크기에 따른 영향을 분석하였다. BT기판의 두께가 0.95mm에서 1.20mm로 증가하고, 낮은 영률 의 언더 필 재료에서 솔더접합부의 피로 수명이 30% 향상됨을 확인하였다. 또한 솔더 볼의 크기가 0.76 mm에서 0.89mm로 증가하면, 솔더접합부에서 균열에 대한 저항성은 2배 정도 증가하였다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 추계 기술심포지움
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• pp.67-73
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• 2001

To investigate the relationships of solder joint characteristics with solder composition and A:V ratio (solder volume per pad area), Sn-37Pb and Sn-4.0Ag-0.5Cu solder balls with 330, 400, 450 and $457{\mu}{\textrm}{m}$ size were reflowed on same substrate. Sn-37Pb and Sn-4.0Ag-0.5Cu was reflowed at $220^{\circ}C$ and $240^{\circ}C$ respectively by IR-type soldering machine. As a result of reflowed solder- ball diameter(D) and height(H) measurement, D/H was decreased with solder ball size increment in range of 330~450 ${\mu}{\textrm}{m}$. But, D/H was increased in the solder joint for 457 ${\mu}{\textrm}{m}$ size, it was caused possibly by decrement of solder ball height increment compared with solder volume increment. As a result of shear and pull test, joint strength with A:V ratio was high. Joint strength of Sn-4.0Ag-0.5Cu was higher than Sn-37Pb. However, Sn-37Pb had more stable solder joint of small standard deviation. A thick and clean scallop type Ni-Cu-Sn intermetallic compound layer was formed in high A:V ratio and Sn-4.0Ag-0.5Cu solder joint interface.

• Journal of Welding and Joining
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• 제20권2호
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• pp.90-94
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• 2002

FC-BGA has advantages over other interconnection methods including high I/O counts, better electrical performance, high throughput, and low profile. But, FC-BGA has a lot of reliability issues. The 2nd level solder joint reliability of the FC-BGA with large chip on laminate substrate was studied in this paper. The purpose of this study is to discuss solder joint failures of 2nd level thermal cycling test. This work has been done to understand the influence of the structure of package, the properties of underfill, the properties and thickness of bismaleimide tiazine substrate and the temperature range of thermal cycling on 2nd level solder joint reliability. The increase of bismaleimide tiazine substrate thickness applied to low modulus underfill was improve of solder joint reliability. The resistance of solder ball fatigue was increased solder ball size in the solder joints of FC-BGA.

• Journal of Welding and Joining
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• 제21권3호
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• pp.92-98
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• 2003

This paper describes the numerical prediction of the thermal fatigue life of a $\mu$BGA(Micro Ball Grid Array) solder joint. Finite element analysis(FEA) was employed to simulate thermal cycling loading for solder joint reliability. Strain values, along with the result of mechanical fatigue tests for solder alloys were then used to predict the solder joint fatigue life using the Coffin-Manson equation. The results show that Sn-3.5mass%Ag solder had the longest thermal fatigue life in low cycle fatigue. Also a practical correlation for the prediction of the thermal fatigue life was suggested by using the dimensionless variable ${\gamma}$, which was possible to use several lead free solder alloys for prediction of thermal fatigue life. Furthermore, when the contact angle of the ball and chip has 50 degrees, solder joint has longest fatigue life.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2005년도 ICCAS
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• pp.1814-1819
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• 2005

This paper describes the development of a Stewart platform-based robot force sensor with distinctive structure of ball joints. The number of ball joints is only a half of the similar style sensors, so it is possible to reduce size and weight of the sensor. The structure of ball joint is described and discussed. Furthermore, we use strain gauges, but not liner voltage differential transformers, as sensing elements, in order to reduce size and weight of the sensor. It is also proposed that beams are replaced with pipes as sensing elements of the sensor. The ball joints and sensing elements with pipes can effectively reduce the error of the sensor. A geometric analysis model is also proposed. The external force and its moment can be measured with this model. Moreover, the performance of this sensor was tested. The test results conducted to evaluate the sensing capability of the sensor is reported and discussed.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2013년도 춘계학술대회 논문집
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• pp.969-970
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• 2013

• 한국공간구조학회논문집
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• 제7권6호
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• pp.61-68
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• 2007

대공간구조에서 접합부의 신뢰도는 매우 중요하다. 접합부에 사용되는 고력볼트의 나사부 유효단면적은 축부단면적보다 작고 볼트 축부에 락핀용 구멍이 있기 때문에 볼트 나사부 또는 락핀용 구멍에 응력집중 현상이 발생하여 취성 파단이 발생할 우려가 높다. 특히 접합부는 직렬형 구조로 이루어져 있다. 따라서 접합부에서의 극한상황시 파괴유형은 필히 취성파괴를 피해야 하며 연성파손으로 유도해야 한다. 따라서 본 연구에서는 볼 조인트 접합부의 소성변형능력을 향상시키고 현장에서 발생할 수 있는 시공오차의 흡수가 가능하도록, 볼트의 나사부나 핀부의 취성파단 없이 소성변형능력 향상을 목표로 하였다. 에너지흡수형 볼트를 사용함으로써 소성변형능력이 향상된 스페이스 프레임의 접합상세를 제안하였다.

• 한국산학기술학회논문지
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• 제19권1호
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• pp.705-713
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• 2018

자동차용 볼 조인트는 현가계와 조향계를 연결하는 부품으로 두 요소 사이에서 조향을 위해 회전 운동 및 직선운동이 가능하도록 돕는 기계 부품이다. 본 연구의 대상은 중대형 픽업 트럭에 사용되는 볼 조인트이다. 각 단품으로는 스터드(Stud), 소켓(Socekt), 시트(Bearing), 플러그(Plug)로 구성되어 있다. 볼 조인트의 주요 구조적 성능으로는 풀-아웃 강도 및 푸시-아웃 강도를 고려해야 한다. 이 구조적 성능들은 정해진 기준을 만족해야 하며 이를 만족시키지 못하면 보다 큰 사고를 유발할 수 있다. 볼 조인트의 설계 요구조건 만족 여부를 확인하기 위한 방법으로는 실험과 시뮬레이션 방법이 있으나 실험은 많은 시간과 비용이 소요된다. 본 연구에서는 볼조인트의 구조적 성능 예측을 위하여 모델링 소프트웨어로서 솔리드웍스(Solid Works)를, 유한요소해석 소프트웨어로서 아바쿠스(Abaqus)를 사용하였다. 유한요소해석은 2D 축대칭 모델의 정적 해석을 이용하여 요구되는 구조적 성능을 구하였다. 볼 조인트의 제작 시 발생되는 불확실한 요소를 제작 공차로 가정하였으며, 이에 따라 구조적 성능에 영향을 미치는 치수 설계 변수를 사례 연구를 수행해 파악하였다. 그리고 제작 공차를 수준 별로 정의 한 후, 사례연구를 이용해 구한 유한요소해석 결과값과 실험값을 비교하였다.

• Tribology and Lubricants
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• 제19권3호
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• pp.123-132
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• 2003

The effect of surface texture on elastohydrodynamic lubrication (EHL) point contact of a ball Joint mechanism in small reciprocating compressors is studied numerically by using multigrid method. Pressure and film thickness profiles have been calculated for surface roughness with waviness of different orientations and transverse ridge and dent at minimum and maximum Hoes M parameter conditions. The influence of the amplitude and the wavelength of the surface roughness was also studied. Results show that the oblique waviness with orientation angle of 30$^{\circ}$generates the smallest minimum film thickness as compared with those of longitudinal, transverse, and other oblique roughness. The influence of transverse waviness on the minimum film thickness is smaller than for the longitudinal waviness case.

• 한국신뢰성학회지:신뢰성응용연구
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• 제12권3호
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• pp.165-176
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• 2012

Hydrostatic bearing improves performance and life time of a product by avoiding solid friction and reducing viscosity friction with the help of creating pressure equilibrium between two faces doing relative motion. This study suggests failure analysis and test evaluation for a ball joint that adopts the hydrostatic bearing and introduces the entire process to improve reliability of the product by design improvement. A typical failure is growth of friction torque by solid friction, and its failure cause is determined and the improvement is proposed. Finally, reliability improvement is established by analysis of the results of before and after acceleration test.