• 제목/요약/키워드: Bake

검색결과 140건 처리시간 0.032초

석출강화형 극저탄소강의 특성에 대한 고찰 (Characteristics of Precipitation Hardened Extra Low Carbon Steels)

  • 윤정봉;김성일;김인배
    • 대한금속재료학회지
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    • 제46권10호
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    • pp.609-616
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    • 2008
  • Conventional bake-hardenable(BH) steels should be annealed at higher temperatures because of the addition of Ti or/and Nb which forms carbides and raises recrystallization start temperature. In this study, the development of new BH steels without Ti or Nb addition has been reviewed. The new BH steels have nearly same mechanical properties as the conventional BH steels even though it is annealed at lower temperature. The steels also show smaller deviation of the mechanical properties than that of the conventional BH steels because of the conarol of solute carbon content during steel making processes. The deviation of mechanical properties in conventional BH steels is directly dependent on the deviation of solute carbon which is greatly influenced by the amount of the carbide formers in conventional BH steels. Less alloy addition in the newly developed BH steels gives economical benefits. By taking the advantage of sulfur and/or nitrogen which scarenge in Interstitial-Free or conventional BH steels, fine manganese sulfides or nano size copper sulfides were designed to precipitate, and result in refined ferrite grains. Aluminum nitrides used as a precipitation hardening element in the developed steels were also and resull in fine and well dispersed. As a result, the developed steels with less production cost and reduced deviation of mechanical properties are under commercial production. Note that the developed BH steels are registered as a brand name of MAFE(R) and/or MAF-E(R).

포항가속기 저장링 Chamber의 용접변형 (Welding Deformation of The PLS Storage Ring Chamber)

  • 최만호;김효윤;한영진;최우천
    • Journal of Welding and Joining
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    • 제11권4호
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    • pp.36-43
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    • 1993
  • 1)sector chamber II에서 가장 우려되었던 J5, J8의 변형량이 $28\mu\textrm{m}$,$36\mu\textrm{m}$ 이었으므로 목표 값 $50\mu\textrm{m}$을 충분히 보증할 수 있다. 2) Helicoflex gasket type으로 제작된 초도품 챔버에서는 140.deg.C bake-out후 이온 펌프만 으로 20시간 진공배기한 후의 진공도는 2*$10^{-9}$ Torr에 도달하였으며, 용접 type으로 제 작된 챔버에서는 2*$10^{-10}$ Torr에 도달하여서 진공도도 우수하였다. 3)표면조도에 민감한 Helicoflex gasket를 사용하지 않고 알루미늄 플랜지를 용접하여 AI gasketc 를 이용할 수 있기 때문에 초도품챔버에서와 같이 알루미늄 챔버와 스텐레스 스틸 부품을 연결하 는 stainless spool piece가 필요하지 않게 된다. 4)고가의 helicoflex gasket을 쓰지 않으므로 가격절감을 할 수 있다.

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엔드밀 설계 및 제작 기술에 관한 연구 (Development of Design and Manufacturing Technology for Endmills)

  • 고성림;김용현
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2002년도 춘계학술대회 논문집
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    • pp.69-72
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    • 2002
  • The geometry parameter of tool such as rake angle and clearance angle is defined clearly to solve the difference in communication between design and measurement stage. Using the developed simulation program, wheel is properly determined and end mill can be manufactured accurately. The performance test with well defined end mill provides sufficient information to decide optimal geometry. For machining hardened steel, end mills are designed and manufactured. Optimal rake angle and clearance angle is obtained from performance test. A specific software for automatic end mill production is developed far simulation and fur generation of NC code as Cad/CAM system.

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UV-LIGA 공정용 SU-8 PR 몰드 제작 공정 개발 (A Development of Fabrication of Processes of SU-8 PR Mold for UV-LIGA)

  • 김창교
    • 한국산학기술학회:학술대회논문집
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    • 한국산학기술학회 2002년도 추계학술발표논문집
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    • pp.238-242
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    • 2002
  • 본 논문에서는 3차원 마이크로구조물을 위한 새로운 Thick Photoresist(TPR) 공정 기술을 개발하였다. 일반적으로 Thin Photoresist는 얇은 두께로 코팅을 할 수 있다. 그러나 SU-8과 같은 TRP은 몇 십 ㎛ 또는 그 이상으로 코팅이 가능하고 높은 종횡비를 얻을 수 있다. SU-8과 같은 TPR을 사용하여 마이크로구조물을 제작할 때 TPR의 crack들은 bake시의 갑작스런 tool down에 의한 stress에 의해 나타나는데, 이러한 crack들은 마이크로구조물의 도금을 어렵게 만든다. 본 논문에서는 TPR의 코팅, baking 시간 조절, cool down과 PEB(Post Expose Sake) 시간 조절을 통하여 stress에 의해 발생되는 crack이 없는 3차원 마이크로구조물을 제작할 수 있는 새로운 공정 기술을 개발하였다.

Deep UV Photoresists;Dissolution Inhibitor

  • Shim, Sang-Yeon;Crivello, James V.
    • 한국응용과학기술학회지
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    • 제17권3호
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    • pp.188-191
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    • 2000
  • A new class of deep UV Photoresist based on the principles of chemical amplification was developed. This photoresist consists of three basic elements: a copolymer, blocked tetrabromobisphenol-A as a dissolution inhibitor and a photosensitive onium salt as a photoacid generator. On irradiation followed by a post exposure bake, tert-butoxycarbonyloxy phenyl group is converted to phenol group. Thus the initially base insoluble resin is converted under UV irradiation to a base soluble resin which may be preferentially removed by dissolution. This new photoresist display high sensitivity, 10 $mJ/cm^{2}$.

Adaptive Control of a Class of Nonlinear Systems Using Multiple Parameter Models

  • Lee Choon-Young
    • International Journal of Control, Automation, and Systems
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    • 제4권4호
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    • pp.428-437
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    • 2006
  • Many physical systems are hybrid in the sense that they have continuous behaviors and discrete phenomena. In control system with multiple models, switching strategy and stability of the closed-loop system under switching are very important issues. In this paper, a novel adaptive control scheme based on multiple parameter models is proposed to cope with a change in Parameters. Switching strategy guarantees the non-increase in the global control Lyapunov function if the estimation of Lyapunov function value converges. Least-square estimation is used to find the estimated value of the Lyapunov function. Switching and adaptation law guarantees the stability of closed-loop system in the sense of Lyapunov. Simulation results on anti-lock brake system are shown to verify the effectiveness of the proposed controller in view of a large change in system parameters.

Nonvolatile Semiconductor Memories Using BT-Based Ferroelectric Films

  • Yang, Bee-Lyong;Hong, Suk-Kyoung
    • 한국세라믹학회지
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    • 제41권4호
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    • pp.273-276
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    • 2004
  • Report ferroelectric memories based on 0.35$\mu\textrm{m}$ CMOS technology ensuring ten-year retention and imprint at 175$^{\circ}C$. This excellent reliability resulted from newly developed BT-based ferroelectric films with superior reliability performance at high temperatures, and also resulted from robust integration schemes free from ferroelectric degradation due to process impurities such as moisture and hydrogen. The superior reliabilities at high temperature of ferroelectric memories using BT-based films are due to the random orientation by special bake treatments.

Lexical Mismatches between English and Korean: with Particular Reference to Polysemous Nouns and Verbs

  • Lee, Yae-Sheik
    • 한국언어정보학회지:언어와정보
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    • 제4권1호
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    • pp.43-65
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    • 2000
  • Along with the flourishign development of computational linguistics, research on the meanings of individual words has started to resume. Polyusemous words are especially brought into focus since their multiple senses have placed a real challenge to linguists and computer scientists. This paper mainly concerns the following three questions with regard to the treatments of such polysemous nouns and verbs in English and Korean. Firstly, what types of information should be represented in individual lexical entries for those polysemous words\ulcorner Secondly, how different are corresponding polysemous lexical entries in both languages\ulcorner Thirdly, what does a mental lexicon look like with regard to polysemous lexical entries\ulcorner For the first and second questions, Pustejosky's (1995) Generative Lexicon Theory (hereafter GLT) will be discussed in detail: the main focus falls on developing alternative way of representing (polysemous) lexical entries. For the third question, a brief discussion is made on mapping between concepts and their lexicalizations. Furthermore, a conceptual graph around conept 'bake' is depicted in terms of Sowa(2000)

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감광성 BCB를 사용한 MCM-D 기판에서 C2F6 플라즈마 clcaning 이 비야형성에 미 치는 영향 (The Effects of C2F6 Plasma Cleaning on Via Formation in MCM-D Substrate using photosensitive BCB)

  • 이영민
    • 마이크로전자및패키징학회지
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    • 제5권2호
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    • pp.7-12
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    • 1998
  • 감광성 BCB를 사용한 MCM-D기판에 신뢰성있는 비아형성을 위하여 BCB의 공정 특성과 C2F6를 사용한 플라즈마 cleaning 영향을 분석하였다. 절연막, 금속배선재료로 각각 감광성 BCB, Cu를 사용하여 MCM-D 기판을 제작 분석한 결과 BCB는 soft bake 후 초기 두께의 50%정도 두께 손실이 있었으며 해상도는 15um이었다. BCB층에 비아 형성후 C2F6 가스로 플라즈마 cleaning 하고 AES로 비아표면을 분석한 결과 유기물 C는 검출되지 않은 반면 플라즈마 cleaning을 하지 않은 비아를 분석한 결과 유기물 성분의 C가 많이 검출되었 고 Ar 스퍼터에 의해서도 완전히 제거되지 않았다. 따라서 감광성 BCB를 절연막으로 사용 한 MCM-D 기판 제작공정에서 비아 형성후 C2F6를 이용한 플라즈마 cleaning의 필요성을 확인하였다.