• Title/Summary/Keyword: Back Panel

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Analysis of Thermal Distribution inside LCD Monitor by Development of Prediction Formula for Inner Temperature (내부 온도 추정식 개발에 의한 LCD 모니터 내부의 열분포 분석)

  • Oh, S.J.;Ko, H.S.;Chung, D.H.
    • 유체기계공업학회:학술대회논문집
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    • 2006.08a
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    • pp.487-488
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    • 2006
  • In these days, demand of a LCD monitor is remarkably increasing with development of the LCD technology. However, there are thermal problems for improvement of efficiency for the LCD monitor. Thus, this research analyzed thermal problems such as convection and conduction heat transfer characteristics in the LCD monitor using an infrared (IR) camera. Also, the results of the outer side of the front LCD panel using the IR camera have been compared with the results of the inner side of the front panel using T-type thermocouples. The equations have been derived for the temperature distribution of the inner side of the front LCD panel by a multiple regression method including variables for ambient temperature, humidity and temperature differences between the front and back panels of the LCD monitor.

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A Study on the Adhesion Performance of Solid Forming Angle at Fiber Panel in the Water Supply Facility (수처리 시설물에 적용되는 섬유패널 배면부의 입체 성형 각도에 따른 부착 성능 연구)

  • Youn, Joon-No;Park, Wan-Goo;Choi, Su-Young;Kim, Dong-Bum;Kim, Byoung-Il;Oh, Sang-Keun
    • Proceedings of the Korean Institute of Building Construction Conference
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    • 2018.11a
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    • pp.171-172
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    • 2018
  • The purpose of this study is to confirm the adhesion performance of the three - dimensional forming fiber panels by the dimensional forming angle. As a result of applying the three dimensional surface shape to the back side of the fiber panel and testing the adhesion strength by the three dimensional forming angle, it was confirmed that the bonding strength of the specimens to which the dimensional molding was applied was higher than that of the non dimensional molding. In addition, the highest adhesion strength was confirmed in a specimen having a three-dimensional forming angle of 70 °.

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Translation and Validation of Korean Version of Hall's Professionalism Inventory (간호의 전문직업성 척도 개발을 위한 Hall의 전문직업성 척도 번역 및 동등성 비교)

  • Kim, Yeoun-Soo;Baek, Hee-Chong
    • Journal of Korean Academy of Nursing Administration
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    • v.13 no.4
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    • pp.509-515
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    • 2007
  • Purpose: The purpose of this study was to translate and validate the Korean version of Hall's Professional Inventory(HPI) scale to assess levels of professionalism among Korean registered nurses. Method: The 25 item HPI scale was translated and content review was done by translation panel. After the content review, a bilingual nursing scholar performed the back-translation into English. A semantic equivalence test was conducted with 5 American nursing professors. A pilot study was conducted with a sample of 164 registered nurses in Korea to test the validity and reliability of the translated HPI. Result: The content equivalence for translated version of HPI was validated by a translation panel. The finding of the semantic equivalence test of back-translated version was 72.8%. The Cronbach's alpha for the Korean version of HPI was .820. Conclusions: This study provides information about the issues of translating an instrument such as the HPI. The Korean version of the HPI is a valid and reliable instrument and can have psychometric properties equivalent to those of the original HPI. The translated version could be used for assessing levels of professionalism for other health care professionalism as well as nurses.

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Development of Automotive Structural Part Considering the Formability of Sandwich Panel (샌드위치 판재의 성형성을 고려한 차체 부품의 개발)

  • Choi, Won-Ho;Choi, Bo-Sung;Lee, Dug-Young;Hwang, Woo-Seok
    • Transactions of the Korean Society of Automotive Engineers
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    • v.20 no.4
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    • pp.33-38
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    • 2012
  • Sandwich composite panel with high strength steel face can reduce the weight of the automotive structural parts. Unlike the parts in aerospace application, the automotive parts are made by the forming process for mass production. The CAE simulation can predict the failures caused by forces and deformation during the forming process. Since the material properties are very important factor for the simulation, we performed the tensile test to get the material properties. The inspections by the optical microscope at each strain level show the states of the polymer resin. The material properties measured by the tensile tests are used for the input data of simulation. The simulation predicts the forming process of the bumper back beam very exactly compared with the try out results.

The Study on the Reflection Coating Design Scheme in the Thin-Film Silicon Solar Cell (박막 실리콘 태양전지의 반사코팅 설계기술 연구)

  • Kim, Chang-Bong
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.12 no.11
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    • pp.5172-5177
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    • 2011
  • This paper presents a reflection coating design scheme in the thin-film silicon solar cell. The antireflection(high reflection) coating skill is needed in the front(back) panel of the thin-film solar cell to improve an efficiency of light absorbing. In the single structure a reflectivity is changed according to the thickness of coating for antireflection scheme and its minimum value can be obtained by controlling thickness of coating. In the symmetric multi layer structure low reflectivity can be obtained in the wide wavelength range. And we also find that high reflectivity can be obtained through multi layer structure, which has alternate layers of high and low material, for high reflection scheme in the back panel.

Depression in Middle-aged and Elderly People with Pain: A Latent Profile Analysis (중고령자의 통증과 우울에 관한 연구: 잠재프로파일분석(Latent Profile Analysis)을 중심으로)

  • Kim, Yeon Ha
    • Journal of muscle and joint health
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    • v.27 no.3
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    • pp.325-332
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    • 2020
  • Purpose: This study attempted to classify the potential layer for pain in the middle-aged and elderly based on the seventh Aging Research Panel Survey (2018) data and to identify the degree of depression by potential layer. Methods: This study used data from the 2018 Aging Research Panel Survey, whose participants included 6,890 middle-aged and elderly people. The data were analyzed using SPSS/WIN 22.0 and M-plus 8.0 for latent profile analysis. Results: In the study, Type 1 was a "general pain group", Type 2 was the "high back pain group", Type 3 was the "lower body pain group", Type 4 was the "shoulder pain group", and Type 5 was the "pain-free group", which included those who answered that there was no pain. Second, it was found that the variables such as gender, age, education, or not alone were statistically significant (p<.001). Third, the difference in income, subjective health conditions, depression according to the pain site type group were confirmed. Depression was significantly higher in the back pain group, lower body pain group, and shoulder pain group compared to the pain-free group. Conclusion: Developing integrative interventions is necessary to reduce depression using the pain coping skills in middle-aged and Elderly.

The Photosensitive Insulating Materials as a Passivation Layer on a-Si TFT LCDs

  • Lee, Liu-Chung;Liang, Chung-Yu;Pan, Hsin-Hua;Huang, G.Y.;Gan, Feng-Yuan
    • 한국정보디스플레이학회:학술대회논문집
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    • 2006.08a
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    • pp.695-698
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    • 2006
  • The photosensitive poly-siloxane material used as the passivation layers for the conventional back channel etched (BCE) thin film transistors (TFTs) has been investigated. Through the organic material, the TFT array fabrication process can be reduced and higher aperture ratio can be achieved for higher LCD panel performance. The interface between the organic passivation layer and the back channel of the amorphous active region has been improved by the back channel oxygen treatment and the devices exhibits lower leakage current than the conventional silicon nitride passivation layer of BCE TFTs. The leakage currents between Indium-tin-oxide (ITO) pixels and the TFT devices and its mechanism have also been investigated in this paper.

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Quantitative Analysis of Elastic Recovery Behavior after Bending of Ultra High Strength Steel Sheet: Spring-back or Spring-go (유한요소법을 이용한 초고강도 판재 굽힘에 따른 후변형의 정량적 분석: Spring-back or Spring-go)

  • Kwak, E.J.;Lee, K.;Suh, C.H.;Lim, Y.H.
    • Transactions of Materials Processing
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    • v.20 no.6
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    • pp.456-460
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    • 2011
  • A major source of difficulty in die design for high strength steel is the high level of elastic recovery during unloading. The degree of elastic recovery is affected by factors such as material strength, bending angle, punch's corner radius and sheet thickness. Finite Element Method was used in the present work to quantitatively analyze the elastic recovery for various combinations of these parameters. In some cases elastic recovery happened in reverse direction. This phenomenon, which we call spring-go, was explained via changes in stress distribution in the panel occurring in the forming process.