• Journal of the Korean Crystal Growth and Crystal Technology
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• v.26 no.3
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• pp.121-125
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• 2016

The effect of temperature and pressure in the nitrogen ambient furnace on bulk micro defect (BMD) and denuded zone (Dz) is experimentally investigated. It is found that as pressure increases, Dz depth increases with a small decrease of BMD density in the range of temperature, $100{\sim}300^{\circ}C$. BMD density with hot isostatic pressure treatment (HIP) at temperature of $850^{\circ}C$ is higher than that without HIP while Dz depth is lower due to much higher BMD density. As the pressure increases, BMD density is increased and saturated to a critical value, and Dz depth increases even if BMD density is saturated. The concentration of nitrogen increases near the surface with increasing pressure, and the peak of the concentration moves closer to the surface. The nitrogen is gathered near the surface, and does not become in-diffusion to the bulk of the wafer. The silicon nitride layer near the surface prevents to inject the additional nitrogen into the bulk of the wafer across the layer. The nitrogen does not affect the formation of BMD. On the other hand, the oxygen is moved into the bulk of the wafer by increasing pressure. Dz depth from the surface is extended into the bulk because the nuclei of BMD move into the bulk of the wafer.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.52 no.10
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• pp.451-457
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• 2003

The silicon wafer is stable status at room temperature, but it is weak at high temperatures which is necessary for it to be fabricated into a power semiconductor device. During thermal diffusion processing, a high temperature produces a variety thermal stress to the wafer, resulting in device failure mode which can cause unwanted oxide charge or some defect. This disrupts the silicon crystal structure and permanently degrades the electrical and physical characteristics of the wafer. In this paper, the electrical characteristics of a single oxide layer due to high temperature diffusion process, wafer resistivity and thickness of polyback was researched. The oxide quality was examined through capacitance-voltage characteristics, defect density and BMD(Bulk Micro Defect) density. It will describe the capacitance-voltage characteristics of the single oxide layer by semiconductor process and device simulation.

• Korean Journal of Materials Research
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• v.9 no.1
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• pp.104-107
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• 1999

We investigated the effects of cooling condition on deep levels and iron precipitate formation in iron-contaminated p-type silicon by DLTS(Deep Level Transient Spectroscopy) and preferential etching technique. Dependency of cooling condition on Bulk Micro-Defect (BMD) and four different iron-related deep traps were observed. For normal cooling condition, T1, T2, T3, T4 traps that related to Fe\ulcorner or Fe-O complex were obtained. However, the trap with activation energy, 0.4 eV was observed for slow cooling condition. The trap caused by the $\textrm{Fe}^{+}\textrm{}^{-}$ pair (H4:0.56eV) were detected only at the case of $\textrm{LN}_{2}$ quenching condition.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.24 no.6
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• pp.246-251
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• 2014

Recent studies have shown methods of improving solar cell efficiency. Especially on single crystalline silicon wafer which is high-efficiency solar cell material that has been widely studied. Interstitial oxygen (Oi) is the main impurity in the Czochralski (Cz) growing method, and excess of this can form precipitates during cell fabrication. We have demonstrated the effect of Oi impurity and oxygen precipitation concentration of the wafer on Cz-silicon solar cell efficiency. The result showed a decrease in cell efficiency as Oi and oxygen precipitation increase. Moreover, we have found that the critical point of [Oi] to bring higher cell efficiency is at 14.5 ppma in non-existent Bulk Micro Defect (BMD).

• Korean Journal of Materials Research
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• v.11 no.1
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• pp.55-60
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• 2001

The effect of high energy B ion implantation and initial oxygen concentration upon defect formation and gettering of metallic impurities in Czochralski silicon wafer has been studied by applying DLTS( Deep Level Transient Spectroscopy), SIMS(Secondary ton Mass Spectroscopy), BMD (Bulk Micro-Defect) analysis and TEM(Transmission Electron Microscopy). DLTS results show the signal of the deep levels not only in as-implanted samples but also in low and high temperature annealed samples. Vacancy-related deep levels in as- implanted samples were changed to metallic impurities-related deep levels with increase of annealing temperature. In the case of high temperature anneal, by showing the lower deep level concentration with increase of initial oxygen concentration, high initial oxygen concentration seems to be more effective compared with the lower initial oxygen one.

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.81-81
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• 1999

고에너지 이온 주입에 의해 형성되는 결함의 거동을 DLTS(deep level transient spectroscopy)를 통해 조사하였다. 이온 주입에 이용된 기판들은 서로 다른 산소 농도를 가지고 있었으며, B 이온의 주입 농도는 각각 5X10E13 ~ 4X10E14으로 주입 에너지는 1.5MeV였다. 이온 주입에 의해 형성된 buried layer 내의 boron의 농도는 SIMS(secondary ion mass spectroscopy)를 이용하여 측정하였으며, 열처리에 따른 이차 결함의 생성은 TEM(transmission electron microscopy) 및 BMD(bulk micro defect)를 조사함으로써 알 수 있었다. 이온 주입에 의해 형성된 일차 결함의 제거 및 silicon 내부에서의 금속 gettering을 위하여 furnace 및 RTA (rapid thermal annealing)를 이용한 열처리를 행하였다. 이온주입 초기 상태 및 산소의 농도 또는 이온주입의 농도에 따른 결함을 살펴보기 위하여 DLTS를 이용하였으며, 또한 열처리에 따른 이러한 초기 결함들의 거동을 조사하여 TEM 및 BMD 결과와 비교, 분석하였다.