• 한국정보디스플레이학회:학술대회논문집
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• 2000.01a
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• pp.13-14
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• 2000

21.6" a-Si:H TFT array for direct conversion X-ray detector with 2480 by 3072 pixel is successfully developed. To obtain good X-ray image quality, novel structure, storage on BCB structure, is proposed. The structure reduces the parasitic capacitance of data line, one of the main sources of signal noise. Also, the structure shows higher failure resistance against defects than that of the old design.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.43 no.9 s.351
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• pp.64-68
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• 2006

Novel system-on-package (SOP) - D technology to improve the mechanical and thermal properties of a MCM-D substrate was suggested. Based on this investigation, the two types of band pass filters for the V-band application with unique structure were designed and implemented using 2-metals, 3-BCB layers. The first type using distributed resonator had the insertion loss below 2.6 dB at 55 GHz and group delay was below 0.06 ns. For the second type with edge coupled structure, the insertion loss and group delay were 3 dB and 0.1 ns, respectively. Suggested MCM-D substrate with band pass filter can be used to evaluate mm-Wave system including flip-chip bonded MMIC.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.3
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• pp.31-36
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• 2000

We developed embedded inductors in MCM-D substrate for RF applications. The increasing demand for high density packaging was the driving forces to the development of MCM-D technology. Most of these development efforts have been focused on high performance digital circuits. However, recently there is a great need fur mixed mode circuits with a combination of digital, analog and microwave devices. Mixed mode modules often have a large number of passive components that are connected to a small number of active devices. Integration of passive components into the high density MCM substrate becomes desirable to further reduce cost, size, and weight of electronic systems while improving their performance and reliability. The proposed MCM-D substrate was based on Cu/photosensitive BCB multilayer and Ti/Cu is used to form the interconnect layer. Seed metal was formed with 1000 $\AA$ Ti/3000 $\AA$ Cu by sputtering method and main metal was formed with 3 $\mu\textrm{m}$ Cu by electrical plating method. The multi-turn sprial inductors were designed in coplanar fashion. This paper describe the manufacturing process of integrated inductors in MCM-D substrate and the results of electrical performance test.

• Elastomers and Composites
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• v.35 no.2
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• pp.122-131
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• 2000

In this work, the effect of chemical surface treatments on morphology of carbon blacks was investigated in terms of cure behavior and tearing energy ($G_T$) of carbon blacks/rubber composites. As experimental results, the polar or nonpolar chemical treatment led to a significant physical change of carbon black morphology. The cure activation energies (Ea) and frequency factor (A) obtained from Kissinger equation decreased with improving the dispersion of carbon flacks, resulting in high reactivity. However, a significant advantage of carbon black/rubber composites is gained by carbon blacks treated in basic (BCB) or nonpolar (NCB) chemical solution, resulting in increasing the tearing energy. These results could be explained by changes of dispersion, agglomerate, surface functional group, void volume, and cross-linking density of carbon black/rubber composites.

• 한국신재생에너지학회:학술대회논문집
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• 2009.06a
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• pp.156-158
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• 2009

우리 연구팀은 $SiO_2$ nanospheres를 이용한 natural lithography를 통해 2가지 방법으로 GaAs 기판의 반사율을 감소시켰다. 먼저 GaAs 기판 위에 benzocyclobutene(BCB) 고분자를 코팅한 후, 그 위에 $SiO_2$ nanospheres를 코팅한다. 그리고 고분자의 유리전이 온도이상으로 가열하면 $SiO_2$ nanospheres가 고분자 속으로 가라앉게 되어 렌즈 형태의 표면이 형성된다. 또한, 이 상태에서 BOE 용액을 통해 $SiO_2$ nanospheres를 제거하여 오목한 형태의 표면을 형성할 수 있다. 이러한 2가지 방법의 surface texturing을 통해 우리는 GaAs 표면의 반사도를 각각 400~800nm의 파장에서 평균 13.6%~16.52%의 반사율을 얻을 수 있었다.

• Journal of Microbiology and Biotechnology
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• v.18 no.6
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• pp.1050-1058
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• 2008

A gene encoding a dextransucrase (dsrBCB4) that synthesizes only ${\alpha}$-1,6-linked dextran was cloned from Leuconostoc mesenteroides B-1299CB4. The coding region consisted of an open reading frame (ORF) of 4,395 bp that coded a 1,465-amino-acids protein with a molecular mass of 163,581 Da. The expressed recombinant DSRBCB4 (rDSRBCB4) synthesized oligosaccharides in the presence of maltose or isomaltose as an acceptor, plus the products included ${\alpha}$-1,6-linked glucosyl residues in addition to the maltosyl or isomaltosyl residue. Alignments of the amino acid sequence of DSRBCB4 with glucansucrases from Streptococcus and Leuconostoc identified conserved amino acid residues in the catalytic core that are critical for enzyme activity. The mutants D530N, E568Q, and D641N displayed a 98- to 10,000-fold reduction of total enzyme activity.

• International Journal of Precision Engineering and Manufacturing
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• v.9 no.3
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• pp.40-45
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• 2008

This paper presents a linear positioning system and its control algorithm design with nano accuracy/resolution. The basic linear stage structure is driven by an ultrasonic motor and its displacement feedback is detected by a LDGI (Laser Diffraction Grating Interferometer), which can achieve nanometer resolution. Due to the friction driving property of the ultrasonic motor, the driving situation differs in various ranges along the travel. Experiments have been carried out in order to observe and realize the phenomena of the three main driving modes: AC mode (for mm motion), Gate mode (for ${\mu}m$ motion), and DC mode (for nm motion). A proposed FCMAC (Fuzzy Cerebella Model Articulation Controller) control algorithm is implemented for manipulating and predicting the velocity variation during the motion of each mode respectively. The PCbased integral positioning system is built up with a NI DAQ Device by a BCB (Borland $C^{++}$ Builder) program to accomplish the purpose of an intelligent nanopositioning control.

• Journal of the Microelectronics and Packaging Society
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• v.5 no.2
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• pp.21-26
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• 1998

대용량, 고속데이터 처리가 요구되는 System 개발은 이들의 복잡하고 고기능의 회 로 구현이 가능하냐에 달려 있고 또한 이들고기능 요구를 가장 잘 만족할수 있는 패키지는 MCM 이라 할 수있다. 시스템의 고속화, 소형화는 회로의 복잡성을 요구하는 있는 이를 패 키지로 구현하는 MCM은 시험성 확보에 심각한 문제점으로 나타나고 있다. 본 논문에서는 고밀도 구조의 MCM 기판에 대한 Interconnetion Line 시험검증을 위한 Flying Prober의 적 용 및 모듈 패키징 공정에 대한 조립성 검증을 위한 BST에 대해 설명한다. 연구에 사용된 MCM 모듈은 MCM-D 공정으로 제작되었으며 31um 신호선폭, 50um Via Hole Dia. 5신호 선층 5절연층 및 455 Net의 기판으로절연층은 Dow chemical의 BCB-4024/4026을 적용하였 다. 조립은 3 ASIC, 24소자 실장 및 2000 Wire Bonding으로 이루어지며 패키지는 방열특성 을 고려한 BGA(491 I /O,50mil pitch)를 개발하여 사용하였다. MCM 기판의미세패턴으로 구성된 Interconnection Line에 대해 Fine Ptich Probing이 가능한 Flying Prober를 사용하 여 평가하였으며 BST를 이용하여 실장소자의 KGD평가 및 능동, 수동소자가 실장된 MCM Package의 조립시험성을 확보할수 있었다.

• Proceedings of the KIEE Conference
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• 2008.07a
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• pp.1452-1453
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• 2008

본 논문에서는 RF MEMS 패키징 플랫폼을 활용한 안테나 구조를 제안하고, 이를 바탕으로 마이크로머시닝 공정을 이용한 슬롯 결합형 원형 패치 안테나를 제작하였다. 제안된 안테나는 RF MEMS 패키징 플랫폼 상에서 패키징 물질을 안테나의 유전 물질로 이용하기 위하여 슬롯 결합형 급전 구조를 사용하였다. 한편, BCB를 이용한 폴리머 접착 접합 공정의 RF MEMS 패키징 플랫폼을 기반으로, 하판 유리기판과 상판 수정 기판을 일체화한 형태로 마이크로 스트립라인 안테나를 제작하였다. 최종 제작된 안테나는 20.36-GHz에서 -21 dB의 반사 손실 값을 나타내며, 1.7-GHz, 즉 8.3 %의 주파수 대역을 가진다.

• Proceedings of the IEEK Conference
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• 2006.06a
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• pp.169-170
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• 2006

A band pass filter for the V-band application with unique circuit and structure was designed and implemented using 2-metals, 3-BCB layers. In the mean while the effective electrical conductivity of metal layer was extracted and its value was $4{\times}10^7S/m$. The insertion loss of band pass filter at 60 GHz was 3.0 dB and group delay was below 0.1 ns.