• 제목/요약/키워드: Automatic thickness measurement

검색결과 36건 처리시간 0.023초

Simulation of the Digital Image Processing Algorithm for the Coating Thickness Automatic Measurement of the TRISO-coated Fuel Particle

  • Kim, Woong-Ki;Lee, Young-Woo;Ra, Sung-Woong
    • Journal of Information Processing Systems
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    • 제1권1호
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    • pp.36-40
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    • 2005
  • TRISO (Tri-Isotropic)-coated fuel particle is widely applied due to its higher stability at high temperature and its efficient retention capability for fission products in the HTGR (high temperature gas-cooled reactor), one of the highly efficient Generation IV reactors. The typical ball-type TRISO-coated fuel particle with a diameter of about 1 mm is composed of a nuclear fuel particle as a kernel and of outer coating layers. The coating layers consist of a buffer PyC, inner PyC, SiC, and outer PyC layer. In this study, a digital image processing algorithm is proposed to automatically measure the thickness of the coating layers. An FBP (filtered backprojection) algorithm was applied to reconstruct the CT image using virtual X-ray radiographic images for a simulated TRISO-coated fuel particle. The automatic measurement algorithm was developed to measure the coating thickness for the reconstructed image with noises. The boundary lines were automatically detected, then the coating thickness was circularly by the algorithm. The simulation result showed that the measurement error rate was less than 1.4%.

카메라를 이용한 ALC 블록의 치수계측 및 불량검사 자동화 시스템 개발 (Development of Automatic Measurement and Inspection System for ALC Block Using Camera)

  • 허경무;김성훈
    • 제어로봇시스템학회논문지
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    • 제9권6호
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    • pp.448-455
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    • 2003
  • A system design technique of automatic thickness measurement and defect inspection system, which measures the thickness of the ALC(Autoclaved Lightweight Concrete) block and inspects the defect on a realtime basis is proposed. The image processing system was established with a CCD camera, an image grabber, and a personal computer without using assembled measurement equipment. The image obtained by this system was analyzed by a devised algorithm, specially designed for the enhanced measurement accuracy. For the realization of the proposed algorithm, the preprocessing method that can be applied to overcome uneven lighting environment, an enhanced edge decision method using 8 edge-pairs with irregular and rough surface, the unit length decision method in uneven condition with rocking objects, and the curvature calibration method of camera using a constructed grid are developed. The experimental results, show that the required measurement accuracy specification is sufficiently satisfied using our proposed method.

디지탈 이미지프로세싱을 이용한 자동외관검사장치 개발 (System Development for Automatic Form Inspecion by Digital Image Processing)

  • 유봉환
    • 한국생산제조학회지
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    • 제5권2호
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    • pp.57-62
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    • 1996
  • Basically, the idea underlying most edge-detection technique is the computation of a local derivative operator used for edge detection in gray level image. This concept can be easily illustrated with the aid of object which shows an image of a simple lilght on a dark background, Using the gray level profile along a horizontal scan line of the image. the first and second derivatives of it were acquired. This study is to develop an automatic measuring system based on the digital image processing which can be applied to the real time measurement of the characteristics of the ultra-thin thickness. The experimental results indicate that the developed automatic inspection can be applied in real situation.

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레이저센서를 이용한 비접촉식 두께자동측정기 개발 (Development of Automated Non-contact Thickness Measurement Machine using a Laser Sensor)

  • 조경철;김수연;신기열
    • 한국기계가공학회지
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    • 제14권2호
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    • pp.51-58
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    • 2015
  • In this study, we developed an automated non-contact thickness measurement machine that continuously and precisely measures the thickness and warp of a PCB product using a laser sensor. The system contains a measurement part to measure the thickness in real time automatically according to the set conditions with an alignment supply unit and unloading unit to separate OK and NG products. The measurement machine was utilized to evaluate the performance at each step to minimize measurement error. At the zero setting for the initial setup, the standard deviation of the 216 samples was determined to be $5.52{\mu}m$. A measurement error of 0.5mm and 1.0mm as a standard sample in the measurement accuracy assessment was found to be 2.48% and 2.28%, respectively. In the factory acceptance test, the standard deviation of 1.461mm PCB was measured as $28.99{\mu}m$, with a $C_{pk}$ of 1.2. The automatic thickness measurement machine developed in this study can contribute to productivity and quality improvement in the mass production process.

디지탈 영상처리 기법을 이용한 자동 두께측정 장치 개발 (Development for Automatic Thickness Measurment System by Digital Image Processing)

  • Kim, Y.I.
    • 한국정밀공학회지
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    • 제12권6호
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    • pp.72-79
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    • 1995
  • The purpose of this paper is to develop an automatic measuring system based on the digital image processing which can be applied to the in-process measurment of the characteristics of the thin thickness. The derivative operators is used for edge detection in gray level image. This concept can be easily illustrated with the aid of object shows an image of a simple light object on a dark background, the gray level profile along a horizontal scan line of the image, and the first and second derivatives of the profile. The first derivative of an edge modeled in this manner is 0 in all regions of constant gray level, and assumes a constant value during a gray level transition. The experimental results indicate that the developed automatic inspection system can be applied in real situation.

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Automatic Visual Feature Extraction And Measurement of Mushroom (Lentinus Edodes L.)

  • Heon-Hwang;Lee, C.H.;Lee, Y.K.
    • 한국농업기계학회:학술대회논문집
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    • 한국농업기계학회 1993년도 Proceedings of International Conference for Agricultural Machinery and Process Engineering
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    • pp.1230-1242
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    • 1993
  • In a case of mushroom (Lentinus Edodes L.) , visual features are crucial for grading and the quantitative evaluation of the growth state. The extracted quantitative visual features can be used as a performance index for the drying process control or used for the automatic sorting and grading task. First, primary external features of the front and back sides of mushroom were analyzed. And computer vision based algorithm were developed for the extraction and measurement of those features. An automatic thresholding algorithm , which is the combined type of the window extension and maximum depth finding was developed. Freeman's chain coding was modified by gradually expanding the mask size from 3X3 to 9X9 to preserve the boundary connectivity. According to the side of mushroom determined from the automatic recognition algorithm size thickness, overall shape, and skin texture such as pattern, color (lightness) ,membrane state, and crack were quantified and measured. A portion of t e stalk was also identified and automatically removed , while reconstructing a new boundary using the Overhauser curve formulation . Algorithms applied and developed were coded using MS_C language Ver, 6.0, PC VISION Plus library functions, and VGA graphic function as a menu driven way.

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Morphological Detection of Carotid Intima-Media Region for Fully Automated Thickness Measurement by Ultrasonogram

  • Park, Hyun Jun;Kim, Kwang Baek
    • Journal of information and communication convergence engineering
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    • 제15권4호
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    • pp.250-255
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    • 2017
  • In this paper, we propose a method of detecting the region for measuring intima-media thickness (IMT). The existing methods for IMT measurement are automatic, but the region used for measuring IMT is not detected automatically but often set by the user. Therefore, research on detecting the intima-media region is needed for fully automated IMT measurement. The proposed method uses a morphological feature of the carotid artery visible as two long high-brightness horizontal lines at the upper and lower parts. It uses Gaussian blurring, ends-in search stretching, color quantization using a color-importance-based self-organizing map, and morphological operations to emphasize and to detect the morphological feature. The experimental results for evaluating the performance of the proposed method showed a 97.25% (106/109) success rate. Therefore, the proposed method can be used to develop a fully automated IMT measurement system.

초음파 영상 깃각 자동 측정 프로그램 개발 (Development of an Automatic Measuring Program for the Pennation Angle Using Ultrasonography Image)

  • 김종순
    • 대한통합의학회지
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    • 제5권1호
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    • pp.75-83
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    • 2017
  • Purpose : The parameters used in architectural analysis are muscle thickness, fascicle length, pennation angle, etc. Pennation angle is an important muscle characteristic that plays a significant role in determining a fascicle's force contribution to movement. Ultrasonography has been widely used to obtain the image for measurement of a pennation angle since it is non-invasive and real-time. However, manual assessment in ultrasonographic images is time-consuming and subjective, making it difficult for using in muscle function analysis. Thus, in this study, I proposed an automatic method to extract the pennation angle from the ultrasonographic images of gastrocnemius muscle. Method : The ultrasonographic image obtained from 10 healthy participants's gastrocnemius muscle using for developed automatic measuring program. Automatic measuring program algorithm consists with preprocessing, line detection, line classification, and angle calculation. The resulting image was then used to detect the fascicles and aponeuroses for calculating the pennation angle with the consideration of their distribution in ultrasonographic image. Result : The proposed automatic measurement program showed the stable repeatability of pennation angle calculation. Conclusion : This study demonstrated that the proposed method was able to automatically measure the pennation angle of gastrocnemius, which made it possible to easily and reliably investigate pennation angle more.

후판 압연공정에서 퍼지 두께제어 구현 (An Implementation of Fuzzy Automatic Gauge Control for the Plate Steel Rolling Process)

  • 허윤기;최영규
    • 제어로봇시스템학회논문지
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    • 제15권6호
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    • pp.634-640
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    • 2009
  • The plate manufacturing processes are composed of the reheating furnace, finishing mill, cooling process and hot leveling. The finishing rolling mill (FM) as a reversing mill has produced the plate steel through multiple pass rolling. The automatic gauge control (AGC) is employed to maintain the thickness tolerance. The high grade products are forming greater parts of the manufacturing and customers are requiring strict thickness margin. For this reason, the advanced AGC method is required instead of the conventional AGC based on the PI control. To overcome the slow response performance of the conventional AGC and the thickness measurement delay, a fuzzy AGC based on the thickness deviation and its trend is proposed in this paper. An embedded controller with the fuzzy AGC has been developed and implemented at the plate mill in POSCO. The fuzzy AGC has dynamically controlled the roll gap in real time with the programmable logic controller (PLC). On line tests have been performed for the general and TMCP products. As the results, the thickness deviation range (maximum - minimum of the inner plate) is averagely from 0.3 to 0.1 mm over the full length. The fuzzy AGC has improved thickness deviation and completely satisfied customer needs.

NOVA System을 이용한 CMP Automation에 관한 연구 (The Study for the CMP Automation with Nova Measurement System)

  • 김상용;정헌상;박민우;김창일;장의구
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2001년도 추계학술대회 논문집 Vol.14 No.1
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    • pp.176-180
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    • 2001
  • There are several factors causing re-work in CMP process such as improper polish time calculation by operator. removal rate decline of the polisher, unstable in-suit pad conditioning, slurry supply module problem and wafer carrier rotation inconsistancy. And conclusively those fundimental reason for the re-work rate increasement is mainly from the cycle time delay between wafer polish and post measurement. Therefore, Wafer thickness measurement in wet condition could be able to remove those improper process conditions which may happen during the process in comparison with the conventional dried wafer measurement system and it can be able to reduce the CMP process cycle time. CMP scrap reduction by overpolish, re-work rate reduction, thickness control efficiency also can be easily achieved. CMP Equipment manufacturer also trying to develop integrated system which has multi-head & platen, cleaner, pre & post thickness measure and even control the polish time from the calculated removal rate of each polishing head by software. CMP re-work problem such as over & under polish by target thickness may result in the cycle time delay. By reducing those inefficient factors during the process and establish of the automatic process control, CLC system need to be adopted to maximize the process performance. Wafer to Wafer Polish Time Feed Back Control by measuring the wafer right after the polish shorten the polish time calculation for the next wafer and it lead to the perfact Post CMP target thickness control capability. By Monitoring all of the processed the wafer, CMP process will also be stabilize itself.

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