• Bulletin of the Korean Chemical Society
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• v.29 no.8
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• pp.1495-1498
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• 2008

$TiO_2$ nanopowders were synthesized by new sol-gel combustion hybrid method using acetylene black as a fuel. The dried gels exhibited autocatalytic combustion behaviour. $TiO_2$ nanopowders with an anatase structure and a narrow size distribution were obtained at 400-600 ${^{\circ}C}$. Their crystal structures were examined by powder Xray diffraction (XRD) and their morphology and crystal size were investigated by scanning electron microscopy (SEM). The crystal size of the nanopowders was found to be in the range of 15-20 nm. $TiO_2$ powders synthesized at 500 ${^{\circ}C}$ and 600 ${^{\circ}C}$ were applied to a dye solar cell. An efficiency of 5.2% for the conversion of solar energy to electricity ($J_{sc}$ = 11.79 mA/$cm^2$, $V_{oc}$ = 0.73 V, and FF = 0.58) was obtained for an AM 1.5 irradiation (100 mW/$cm^2$) using the $TiO_2$ nanopowder synthesized by the sol-gel combustion hybrid method at 500 ${^{\circ}C}$.

• Applied Chemistry for Engineering
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• v.5 no.6
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• pp.1030-1035
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• 1994

Curing behavior and glass transition temperatures of epoxy resins into which reactive diluents were added to control processability were investigated. Heat of cure generated of the epoxy resin was reduced with butyl glycidyl ether(BGE) and phenyl glycidyl ether(PGE) contents. $T_g$ of the resin was decreased with the amount of reactive diluents and it was attributed to increased molecular weight between crosslink points. Cure kinetics of the resins was studied employing autocatalytic reaction model and found that reaction constants decreased as the contents of reactive diluent was increased.

• Macromolecular Research
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• v.10 no.5
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• pp.259-265
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• 2002

The cure kinetics of blends of epoxy (DGEBA, diglycidyl ether of bisphenol A)/anhydride resin with polyamide copolymer, poly(dimmer acid-co-alkyl polyamine), were studied using differential scanning calorimetry (DSC) under isothermal condition. On increasing the amount of polyamide copolymer in the blends, the reaction rate was increased and the final cure conversion was decreased. Lower values of final cure conversions in the epoxy/(polyamide copolymer) blends indicate that polyamide hinders the cure reaction between the epoxy and the curing agent. The value of the reaction order, m, for the initial autocatalytic reaction was not affected by blending polyamide copolymer with epoxy resin, and the value was approximately 1.3, whereas the reaction order, n, for the general n-th order of reaction was increased by increasing the amount of polyamide copolymer in the blends, and the value increased from 1.6 to 4.0. A diffusion-controlled reaction was observed as the cure conversion increased and the rate equation was successfully analyzed by incorporating the diffusion control term for the epoxy/anhydride/(polyamide copolymer) blends. Complete miscibility was observed in the uncured blends of epoxy/(polyamide copolymer) up to 120 $^{\circ}C$, but phase separations occurred in the early stages of the curing process at higher temperatures than 120 "C. During the curing process, the cure reaction involving the functional group in polyamide copolymer was detected on a DSC thermogram.gram.

• Korean Journal of Materials Research
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• v.9 no.5
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• pp.467-472
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• 1999

The isothermal cure behavior of diglycidyl ether of bisphenol A(DGEBA) 4,4'-methylene dianiline(MDA) system with various contents of neopentyl glycol(NPG) has been analyzed by differential scanning calorimetry(DSC). TO increase the cure rate of DGEBA/MDA system, NPG was introduced as an accelerator. Regardless of the NPG content, the shape of the conversion curves showed sigmoid indication that DGEBA/MDA/NPG system followed autocatalytic cure reaction. The cure reaction of DGEBA/MDA system increased with the increment of NPG content and it was due to the catalytic role of hydroxyl groups of NPG.

• Applied Biological Chemistry
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• v.40 no.3
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• pp.196-201
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• 1997

Assuming that Asp225 is the substrate specificity determinant of Achromobacter pretense I (APl) which is lysine-specific serine protease, the 225th residue was substituted for other amino acids with a hope that the substrate specificity of a mutant API is altered. Furthermore, to maturate preform of mutant API autocatalytically, Lys(-1) was also replaced by Met, Asp, or Glu. However, all the mutants were not expressed, or accumulated as inactive precursor proteins. This result implicats that Asp225 plays a critical rol in restricted substrate specificity as a lysylendopeptidase but the substrate specificity of API is not determined only by the nature of residue 225.

• Nuclear Engineering and Technology
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• v.48 no.5
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• pp.1174-1183
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• 2016

Hydrogen release during severe accidents poses a serious threat to containment integrity. Mitigating procedures are necessary to prevent global or local explosions, especially in large steel shell containments. The management of hydrogen safety and prevention of over-pressurization could be implemented through a hydrogen reduction system and spray system. During the course of the hypothetical large break loss-of-coolant accident in a nuclear power plant, hydrogen is generated by a reaction between steam and the fuel-cladding inside the reactor pressure vessel and also core concrete interaction after ejection of melt into the cavity. The MELCOR 1.8.6 was used to assess core degradation and containment behavior during the large break loss-of-coolant accident without the actuation of the safety injection system except for accumulators in Beznau nuclear power plant. Also, hydrogen distribution in containment and performance of hydrogen reduction system were investigated.

• Journal of the Semiconductor & Display Technology
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• v.19 no.1
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• pp.29-35
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• 2020

The cure characteristics of three kinds of naphthalene type epoxy resins(NET-OH, NET-MA, NET-Epoxy) with a 2-methyl imidazole(2MI) catalyst were investigated for preparing sheet epoxy molding compound(SEMC) for wafer level package(WLP) applications, comparing with diglycidyl ether of bisphenol-A(DGEBA) and 1,6-naphthalenediol diglycidyl ether(NE-16) epoxy resin. The cure kinetics of these systems were analyzed by differential scanning calorimetry with an isothermal approach, and the kinetic parameters of all systems were reported in generalized kinetic equations with diffusion effects. The NET-OH epoxy resin represented an n-th order cure mechanism as like NE-16 and DGEBA epoxy resins, however, the NET-MA and NET-Epoxy resins showed an autocatalytic cure mechanism. The NET-OH and NET-Epoxy resins showed higher cure conversion rates than DGEBA and NE-16 epoxy resins, however, the lowest cure conversion rates can be seen in the NET-MA epoxy resin. Although the NETEpoxy and NET-MA epoxy resins represented higher cure reaction conversions comparing with DGEBA and NE-16 resins, the NET-OH showed the lowest cure reaction conversions. It can be figured out by kinetic parameter analysis that the lowest cure conversion rates of the NET-MA epoxy resin are caused by lower collision frequency factor, and the lowest cure reaction conversions of the NET-OH are due to the earlier network structures formation according to lowest critical cure conversion.

• ETRI Journal
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• v.38 no.6
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• pp.1179-1189
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• 2016

A chemorheological analysis of a no-flow underfill was conducted using curing kinetics through isothermal and dynamic differential scanning calorimetry, viscosity measurement, and solder (Sn/27In/54Bi, melting temperature of $86^{\circ}C$) wetting observations. The analysis used an epoxy system with an anhydride curing agent and carboxyl fluxing capability to remove oxide on the surface of a metal filler. A curing kinetic of the no-flow underfill with a processing temperature of $130^{\circ}C$ was successfully completed using phenomenological models such as autocatalytic and nth-order models. Temperature-dependent kinetic parameters were identified within a temperature range of $125^{\circ}C$ to $135^{\circ}C$. The phenomenon of solder wetting was visually observed using an optical microscope, and the conversion and viscosity at the moment of solder wetting were quantitatively investigated. It is expected that the curing kinetics and rheological property of a no-flow underfill can be adopted in arbitrary processing applications.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2004.04a
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• pp.214-217
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• 2004

The cure kinetics of blends of epoxy(tetraglycidyl-4,4'-diaminodiphenylmethane ; TGDDM)/curing agent(diaminodiphenyl sulfone ; DDS) resin with amine terminated polyetherimide-CTBN-amine terminated polyetherimide triblock copolymer(ABA) were studied using differential scanning calorimetry under isothermal conditions to determine the reaction parameters such as activation energy and reaction constants. By increasing the amount of ABA in the blends, the final cure conversion was decreased. Lower values of the final cure conversions in the epoxy/ABA blends indicated that ABA hinders the cure reaction between the epoxy and curing agents. 1be value of the reaction order, m, for the initial autocatlytic reaction was not affected by blending ABA with epoxy resin, and the value was approximately 1.0. The value of n for the nth order component in the autocatalytic analysis was increased by increasing the amount of ABA in the blends, and the value increased from 2.0-3.4. A diffusion controlled reaction was observed as the cure conversion increased and the rate equation was successfully analyzed by incorporating the diffusion control term for the epoxy/DDS/ABA blends.

• Polymer(Korea)
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• v.35 no.3
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• pp.196-202
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• 2011

The cure kinetics of a bisphenol A epoxy resin and polyoxypropylene diamine curing agent system are investigated in both dynamic and isothermal conditions by differential scanning calorimetry (DSC). In dynamic experiments, the shift of exothermic peaks obtained at different heating rates is used to obtain activation energy of overall cure reaction based on the methods of Ozawa and Kissinger. Isothermal DSC data at different temperatures are fitted to an autocatalytic Kamal kinetic model. The kinetic model is in a good agreement with the experimental data in the initial stage of cure. A diffusion effect is incorporated to describe the later stage of cure, predicting the cure kinetics over the whole range of curing process. Also, dynamic mechanical analysis is performed to evaluate the storage modulus and average molecular weight between crosslinkages.