• Title/Summary/Keyword: Auger electron spectroscopy (AES)

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Tribological properties of sputtered boron carbide coating and the effect of $CH_4$ reactive component of processing gas

  • Cuong Pham Duc;Ahn Hyo-Sok;Kim Jong-Hee;Shin Kyung-Ho
    • Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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    • 2003.11a
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    • pp.78-84
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    • 2003
  • Boron carbide thin coatings were deposited on silicon wafers by DC magnetron sputtering using a $B_4C$ target with As as processing gas. Various amounts of methane gas $(CH_4)$ were added in the deposition process to better understand their influence on tribological properties of the coatings. Reciprocating wear tests employing an oscillating friction wear tester were performed to investigate the tribological behaviors of the coatings in ambient environment. The chemical characteristics of the coatings and worn surfaces were studied using X-ray Photoelectron Spectroscopy (XPS) and Auger Electron Spectroscopy (AES). It revealed that $CH_4$ addition to As processing gas strongly affected the tribologcal properties of sputtered boron carbide coating. The coefficient of friction was reduced approximately from 0.4 to 0.1, and wear resistance was improved considerably by increasing the ratio of $CH_4$, gas component from 0 to $1.2\;vol\;\%$. By adding a sufficient amount of $CH_4\;(1.2\%)$ in the deposition process, the boron carbide coating exhibited lowest friction and highest wear resistance.

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Effects of Oxide Layer Formed on TiN Coated Silicon Wafer on the Friction and Wear Characteristics in Sliding (미끄럼운동 시 TiN 코팅에 형성되는 산화막이 마찰 및 마멸 특성에 미치는 영향)

  • 조정우;이영제
    • Tribology and Lubricants
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    • v.18 no.4
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    • pp.260-266
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    • 2002
  • In this study, the effects of oxide layer farmed on the wear tracks of TiN coated silicon wafer on friction and wear characteristics were investigated. Silicon wafer was used for the substrate of coated disk specimens, which were prepared by depositing TiN coating with 1 ${\mu}{\textrm}{m}$ in coating thickness. AISI 52100 steel ball was used fur the counterpart. The tests were performed both in air for forming oxide layer on the wear track and in nitrogen to avoid oxidation. This paper reports characterization of the oxide layer effects on friction and wear characteristics using X-ray diffraction(XRD), Auger electron spectroscopy(AES), scanning electron microscopy (SEM) and multi-mode atomic force microscope(AFM).

미끄럼운동 시 TiN코팅에 형성되는 산화막이 마찰 및 마멸 특성에 미치는 영향

  • Jo, Jeong-U;Im, Jeong-Sun;U, Sang-Gyu;Lee, Yeong-Je
    • Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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    • 2002.05a
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    • pp.310-316
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    • 2002
  • In this study, the effects of oxide layer formed on the wear tracks of TiN coated silicon wafer on friction and wear characteristics were investigated. Silicon wafer was used for the substrate of coated disk specimens, which were prepared by depositing TiN coating with $1{\mu}m$ in coating thickness. AISI 52100 steel ball was used for the counterpart. The tests were performed both in air for forming oxide layer on the wear track and in nitrogen to avoid oxidation. This paper reports characterization of the oxide layer effects on friction and wear characteristics using X-ray diffraction (XRD). Auger electron spectroscopy (AES), scanning electron microscopy (SEM) and sliding tests.

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Annealing for Improving adhesion between Metal layer and Oxide layer (산화막과 금속박막 계면에서의 adhesion 개선을 위한 열처리)

  • 김응수
    • Proceedings of the IEEK Conference
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    • 2002.06b
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    • pp.225-228
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    • 2002
  • The adhesion effect between the oxide layer and the metal layer has been studied by RTP anneal. Two types of oxides, BPSG and P-TEOS, were used as a bottom layer under multi-layered metal film. We observe the interface between oxide and metal layer using SEM (scanning electron microscopy), TEM (transmission electron microscopy), AES (auger electron spectroscopy). Adhesion failure was occurred by interfacial reaction between the BPSG oxide and the multi-layered metal film at 650"C RTP anneal. The phosphorus rich layer was observed at interface between BPSG oxide and metal layer by AES and TEM measurements. On the other hand adhesion was a)ways good in the sample used P-TEOS oxide as a bottom layer. We have known that adhesion between BPSG and multi-layered metal film was improved when the sample was annealed below $650^{\circ}C$.TEX>.

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Construction of a PEALD System and Fabrication of Cobalt Thin Films (PEALD 장치 제작 및 Co박막 증착)

  • Lee, D.H.;Noh, S.J.
    • Journal of the Korean Vacuum Society
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    • v.16 no.2
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    • pp.110-115
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    • 2007
  • A plasma enhanced atomic layer deposition(PEALD) system has been constructed adopting an inductively coupled plasma(ICP) source with an ALD system, and its plasma generation was carried out. Cobalt thin films were deposited on a p-type Si(100) wafer at $230^{\circ}C$. $Co_{2}(CO)_{6}$ was used as a cobalt precursor, $NH_{3}$ as a reactant, and Ar as a carrier and purge gas. The properties of the thin films were investigated using field emission scanning electron microscopy(FESEM) and auger electron spectroscopy(AES). Large amounts of impurities were found in both the ALD film and the PEALD film, however, the amount of impurities in the PEALD film was reduced to about 50 % compared to that in the ALD film. It was found that $NH_{3}$ plasma, very effectively, induces the reaction with carbon in a cobalt precursor.

Nano-structural Characteristics of N-doped ZnO Thin Films (N-doped ZnO 박막의 미세 구조 특성)

  • Lee, Eun-Ju;Zhang, Ruirui;Park, Jae-Don;Yoon, Gi-Wan
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.13 no.11
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    • pp.2385-2390
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    • 2009
  • N-doped ZnO thin films with c-axis preferred orientation were prepared on p-Si(100) wafers, using an RF magnetron sputter deposition. For ZnO deposition, $N_2O$ gas was employed as a dopant source and various deposition conditions such as $N_2O$ gas fraction and RF power were applied. The depth pofiles of the nitrogen [N] atoms incorporated into the ZnO thin films were investigated by Auger Electron Spectroscopy(AES) and the nano-scale structural characteristics of the N-doped ZnO thin films were also investigated by a scanning electron microscope (SEM) technique.

The Blue and Red Luminescences from Ambient Air Aged Porous Silicon

  • Chang, S.S;Yoon, S.O;Choi, G.J;Kawakami, Y;Sakai, A
    • The Korean Journal of Ceramics
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    • v.4 no.1
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    • pp.28-32
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    • 1998
  • This paper reports on photoluminescence (PL), luminescence decay curves, and compositional analysis of porous silicon(PS) which is aged under air ambient by Fourier transform infrared vibrational spectroscopy (FTIR) and by Auger electron spectroscopy (AES). Porous silicos which has been aged under air ambient yields two PL band structures, i.e. blue/violet PL and red PL. The evolution of a blue/violet band is pronounced, especially for thin PS film which is prepared in dilute HF solution. The blue/violet PL band has been observed initially to increrase rapidly with aging, then saturated with further atmospheric aging. The ambient air aged PS exhibits a fast decay time of sub-nanosecond at room temperature and shows appreciably faster decay time than that at 20K. Atmospheric aging of this thin blue/violet luminescing PS yield non-stoichiometric oxide judging from the vibrational spectra of Si-O and AES analysis.

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Characteristic and moisture permeability of SiOxCy thin film synthesized by Atmospheric pressure-plasma enhanced chemical vapor deposition

  • Oh, Seung-Chun;Kim, Sang-Sik;Shin, Jung-Uk
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2011.05a
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    • pp.171-171
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    • 2011
  • Atmospheric pressure- plasma enhanced chemical vapor deposition(AP-PECVD)Processes are recognized as promising and cost effective methods for wide-area coating on sheets of steel, glass, polymeric web, etc. In this study, $SiO_xC_y$ thin films were deposited by using AP-PECVD with a dielectric barrier discharge(DBD). The characteristic of $SiO_xC_y$ thin films were investigated as afunction of the HMDSO/O2/He flow rate. And the moisture permeability of $SiO_xC_y$ thin films was studied. The $SiO_xC_y$ thin films were characterized by the Fourier-transformed Infrared(FT-IR) spectroscopy and also investigated by X-ray photo electron spectroscopy(XPS), Auger Electron Spectroscopy(AES). The moisture permeability of $SiO_xC_y$ thin films was investigated by $H_2O$ permeability tester Detailed experimental results will be demonstrated through th present work.

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플라즈마 표면처리시 산소 분율의 변화가 기판의 표면에너지와 코팅층과의 계면 부착 특성에 미치는 영향

  • Kim, Dong-Yong;Bae, Gwang-Jin;Kim, Jong-Gu;Ju, Jae-Hun;Jo, Yeong-Rae
    • Proceedings of the Korean Vacuum Society Conference
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    • 2015.08a
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    • pp.110-110
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    • 2015
  • 표면에너지는 계면특성을 지배하는 핵심인자로 디스플레이의 터치 스크린 패널 공정, 이종소재의 접합, 금속의 클래딩 등 실제 산업에 있어서 매우 중요하다. 표면에너지는 코팅과 본딩 이론에 있어서 기본이 되는 물리량으로 표면에너지가 높을수록 코팅 또는 박막 증착시 코팅, 증착이 용이하며 이종소재의 접합도 쉽게 일어난다. 본 연구에서는 플라즈마 표면처리시 산소 분율의 변화에 따른 기판의 표면에너지와 코팅층과 기판의 부착력의 변화에 대해 연구하였다. 연구의 주요 기판으로 ITO, PET 기판을 사용하였고, 표면 에너지 변화를 확인하기 위해 기판을 상온 상압 플라즈마에 노출시켰다. 플라즈마는 아르곤(Ar)의 공급량을 20 LPM으로 고정하고 산소($O_2$)의 공급량을 0 sccm에서 40 sccm 까지 10 sccm 간격으로 변수를 주었다. 표면에너지 값은 기판 위에 형성된 액체의 접촉각을 통해 도출하였다. 표면에너지 측정 액체로 증류수(deionized water)와 디오도메탄(diiodo-methane)을 사용하였다. 표면에너지는 산소분압이 10 sccm에서 최대값인 76 mJ/m2으로 증가한 후 20 sccm까지 유지하다 다시 직선적으로 감소하였다. 기판에 증착된 크롬 박막의 부착력은 스크래치 테스트를 통해 측정하였다. 표면에너지의 증가와 비례하게 부착력은 증가하였고 표면에너지가 감소하는 범위에서는 부착력도 감소하였다. 기판과 코팅층의 부착력 증가 원인 중 하나인 계면 산화물 층의 생성 여부를 알아보기 위해 auger electron spectroscopy (AES) 분석을 진행하였다. AES 분석을 통해 플라즈마 표면처리시 기판과 코팅층의 계면 산화물층의 두께가 표면에너지의 변화와 비례하게 증가하였다가 감소하는 것을 확인하였다. 산소분압이 10 sccm 이었을 경우 산화물층의 두께가 가장 두꺼웠다. 또한 계면의 화학적 결합 상태를 알아보기 위해 X-ray photoelectron spectroscopy (XPS) 분석을 진행하였으며 산소 분율의 변화에 따라 크롬 산화물의 양이 증가하였다 감소하는것을 확인하였다. 이 연구를 통해 산소를 포함한 플라즈마 표면개질이 기판과 코팅층의 부착력 증가에 영향을 끼침을 확인 할 수 있었다. 또한 이를 응용하여 부착력 증가가 필요한 다양한 분야에서도 쉽게 적용시킬 수 있을 것이다.

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Studies on Improvement of Schottky Characteristics for GaN Devices (GaN 소자의 쇼트키 특성 향상에 관한 연구)

  • 윤진섭
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.14 no.9
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    • pp.700-706
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    • 2001
  • In this paper, I have fabricated and measured the gallium nitride(GaN) based Schottky diodes, and have carried out analyses of degradation of Schottky barrier characteristics. To improve of degraded Schottky barrier characteristics, I have carried out several experiments such as N$_2$ plasma exposure, annealing in N$_2$ ambient and annealing after N$_2$ plasma exposure. In the results of these experiments, I have achieved that only annealing in N$_2$ ambient is enough to improve the Schottky barrier characteristics, are temperature of 700$\^{C}$ and time of 90 sec in N$_2$ ambient furnace. for the analysis of these experiments, I have carried out the measurement of electric characteristics and quantitative analysis of etching damage using AES(Aguger Electron Spectroscopy).

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