• Title/Summary/Keyword: Au thin film

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ZnO Nanowires Fabricated by Pulsed Laser Deposition using Gold Catalyst (PLD-Furnace로 증착시킨 금촉매를 이용한 ZnO 나노와이어 합성)

  • Son, Hyo-Jeong;Jeon, Kyung-Ah;Lee, Sang-Yeol
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2005.11a
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    • pp.5-6
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    • 2005
  • ZnO nanowlres (NWs) were fabricated using Au as catalyst for a method combining laser ablation cluster formation and vapor-liquid-solid (VLS) growth. The target used in synthesis was pure ZnO ceramics. Two different substrates were used; (0001)-oriented sapphires and Au-coated sapphires. The Au thin film was deposited by thermal evaporation and the thickness was about 50 ${\AA}$. ZnO NWs were only formed in case of that used catalyst metal. Field effect scanning electron microscopic (FESEM) investigation showed that the average diameter of ZnO NWs was about 70 nm and the typical lengths varied from $3{\sim}4{\mu}m$.

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Microstrip line tunable phase shifter (마이크로스트립 라인 전압제어 가변 대역통과필터)

  • ;Mai linh
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2002.05a
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    • pp.227-229
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    • 2002
  • In this paper, we report on a microstrip line voltage controlled tunable bandpass filter. We used the characteristic the relative dielectric constant of thin film ferroelectrics depends on the applied dr voltage. we designed using Au/BSTO/MgO/Au structure. We cascaded many resonators for large furling range sustaining 1 GHz renter frequency, narrow band, low IL ($\leq$4 dB). We could design the BPF of which center frequency is 16 GHz, 1.9 GHz tuning range, the narrow bandwidth within 800 MHz, low insertion loss less than 3 dB by adjusting the gap of 3 cascaded resonators.

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Resistance Development in Au/YBCO Thin Film Meander Lines under High-Power Fault Conditions (과도 사고 시 Au/YBCO 박막 곡선의 저항 거동)

  • Kim, H.R.;Sim, J.;Choi, I.J.;Yim, S.W.;Hyun, O.B.
    • Progress in Superconductivity
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    • v.8 no.1
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    • pp.81-86
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    • 2006
  • We investigated resistance development in $Au/YBa_2Cu_3O_7(YBCO)$ thin film meander lines during high-power faults. The meander lines were fabricated by patterning 300 nm thick YBCO films coated with 200 nm thick gold layers into meander lines. A gold film grown on the back side of the substrate was also patterned into a meander line. The front meander line was connected to a high-power fault-test circuit and the back line to a DC power supply. Resistance of both lines was measured during the fault. They were immersed in liquid nitrogen during the experiment. Behavior of the resistance development prior to quench completion could be understood better by comparing resistance of the front meander lines with that of the back. Quench completion point could be determined clearly. Resistance and temperature at the quench completion point were not affected by applied field strength. The experimental results were analyzed quantitatively with the concept of heat transfer within the meander lines/substrate and to the surrounding liquid nitrogen. In analysis, the fault period was divided into three regions: flux-flow region, region prior to quench completion, and region after quench completion. Resistance was calculated for each region, reflecting the observation for quench completion. The calculated resistance in three regions was joined seamlessly and agreed well with data.

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Structural Evolution of ZnO:Ga Thin Film on Profiled Substrate Grown by Radio Frequency Sputtering

  • Sun, J.H.;Kim, J.H.;Ahn, B.G.;Park, S.Y.;Jung, E.J.;Lee, J.H.;Kang, H.C.
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.02a
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    • pp.72-72
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    • 2011
  • Recently, Zinc oxide (ZnO) nano-structures have been received attractive attention because of their outstanding optical and electrical properties. It might be a promising material considered for applications to photonic and electronic devices such as ultraviolet light emitting diode, thin film transistor, and gas sensors. ZnO nano-structures can be typically synthesized by the VLS growth mode and self-assembly. In the VLS growth mode using various growth techniques, the noble metal catalysts such as Au and Sn were used. However, the growth of ZnO nano-structures on nano-crystalline Au seeds using radio frequency (RF) magnetron sputtering might be explained by the profile coating, i.e. the ZnO nano-structures were a morphological replica of Au seeds. Ga doped ZnO (ZnO:Ga) nano-structures using this concept were synthesized and characterized by XRD, AFM, SEM, and TEM. We found that surface morphology is drastically changed from initial islands to later sun-flower typed nano-structures. We will present the structural evolution of ZnO:Ga nano-structures with increasing the film thickness.

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Electrochemistry and Electrokinetics of Prussian Blue Modified Electrodes Obtained Using Fe(III) Complex

  • 문성배;문정대
    • Bulletin of the Korean Chemical Society
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    • v.16 no.9
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    • pp.819-823
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    • 1995
  • Thin films of two kinds of Prussian Blue (PB)-modified, using iron(Ⅲ) complex instead of conventional FeCl3, were prepared on a gold substrate and these films were able to be electrochemically reduced in potassium nitrate solution. In case of PB-modified films prepared from Fe(Ⅲ)-ethylenediamine-N,N'-diacetic acid (FeEN3+)/K3Fe(CN)6 solution, the mid-peak potential was 0.156 V in 0.1 M KNO3 and it was found that potassium ion migrates into or out of the film during the electrolysis. These films were shown to be electrochromic. These films exhibited smaller peak separation than those formed from Fe(Ⅲ)-tartaric acid (FeTA3+)/K3Fe(CN)6 system. The diffusion coefficient of Fe(CN)63-/4- redox couple, evaluated using the fabricated Au rotating disc electrode(rde) previously reported, was in good agreement with the existing data. Two experimental procedures, including the voltammetry at relatively low scan rates and the rde study, have been used in order to characterize the electrode kinetics. The electrode kinetics of some redox couples (FeEN2+-FeEN3+ and FeTA2+-FeTA3+) on both PB-modified thin films and bare Au electrode were studied using a Au rde. In all cases the rate constants of electron transfer obtained with the PB-modified film electrodes were only slightly less than those obtained for the same reaction on bare Au disc electrodes. The conductivities, as determined from the slopes of the i-V curves for a ca. 1 mm sample for dried PB-modified potassium-rich and deficient bulk samples pressed between graphite electrodes, were 6.21 × 10-7 and 2.03 × 10-7(Ω·cm)-1, respectively.

Electrochemical characterization of LiCoO2 thin film by sol-gel process for annealing temperature and time (졸-겔법에 의해 합성한 리튬 코발트 산화물의 열처리 온도와 시간에 따른 전기 화학적 특성)

  • Roh, Tae-Ho;Yon, Seog-Joo;Ko, Tae-Seog
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.24 no.3
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    • pp.99-105
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    • 2014
  • $LiCoO_2$ thin film have received attention as cathodes of thin-film microbatteries. In this study, $LiCoO_2$ thin films were synthesized on Au substrates by sol-gel spin coating method and electrochemical properties were investigated under annealing temperature and time. The phycochemical properties of $LiCoO_2$ thin film were investigated by X-ray diffraction, scaning electron microscopy and atomic force microscopy. The electrochemical properties were characterized using galvanostatic charging/discharging cycling tests. From X-ray diffraction, as-grown films annealed at $550^{\circ}C$ and $750^{\circ}C$ are presumed to be spinel structure and a single phase of the layered-rock-salt, respectively. The RMS roughness and grain size of the films which annealed at $750^{\circ}C$ has similar values for annealing time 10 and 30 min, while for annealing time 120 min surface roughness, grain size increase and pore appearance were observed. The first discharge capacity of $LiCoO_2$ thin films annealed at $750^{\circ}C$ for 10, 30 and 120 min is about 54.5, 56.8 and $51.87{\mu}Ah/cm^2{\mu}m$, respectively. Corresponding capacity retention at 50th cycle is 97.25, 76.69, 77.19%.

Design and Fabrication of a Low-cost Wafer-level Packaging for RF Devices

  • Lim, Jae-Hwan;Ryu, Jee-Youl;Choi, Hyun-Jin;Choi, Woo-Chang
    • Transactions on Electrical and Electronic Materials
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    • v.15 no.2
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    • pp.91-95
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    • 2014
  • This paper presents the structure and process technology of simple and low-cost wafer-level packaging (WLP) for thin film radio frequency (RF) devices. Low-cost practical micromachining processes were proposed as an alternative to high-cost processes, such as silicon deep reactive ion etching (DRIE) or electro-plating, in order to reduce the fabrication cost. Gold (Au)/Tin (Sn) alloy was utilized as the solder material for bonding and hermetic sealing. The small size fabricated WLP of $1.04{\times}1.04{\times}0.4mm^3$ had an average shear strength of 10.425 $kg/mm^2$, and the leakage rate of all chips was lower than $1.2{\times}10^{-5}$ atm.cc/sec. These results met Military Standards 883F (MIL-STD-883F). As the newly proposed WLP structure is simple, and its process technology is inexpensive, the fabricated WLP is a good candidate for thin film type RF devices.