• 제어로봇시스템학회:학술대회논문집
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• 1992.10b
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• pp.11-21
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• 1992

Modern manufacturing process requires machine intelligence to meet the demands for high technology products as well as intelligence-based operating skills to lessen human worker's intervene. To meet this trend there has been wide spread interest in applying artificial neural network(ANN) to the areas of manufacturing process monitoring and control. This paper addresses application problems in such processes as welding, assembly, hydroforming process and inspection of solder joints.

• International Journal of Safety
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• v.5 no.1
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• pp.24-28
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• 2006

This study focuses on the issue of improving safety management of elevators. The role of certification and supervision in reducing the associated accidents is specifically addressed. The results of simple statistical analysis suggests that a certification procedure emphasizing the quality assurance during manufacturing and supervision during assembly and installation of elevators are needed and can be effective in minimizing the associated accidents.

• Proceedings of the KSR Conference
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• 2010.06a
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• pp.571-582
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• 2010

Typically nondestructive inspection methods of the large gear units are applied to penetrate non-destructive inspection. Nondestructive penetrating inspection put into the small openings of the defect to penetration liquid, remove to excess penetration liquid on the surface of the gear units, spread with developing solution and we can find the small defect by coating with penetration liquid. However, this method has so many issues because of penetrate nondestructive tests on the gear assembly. The steep angle of screw is hard to achieved full penetration and has the problem to remove the excess. In contrast, the magnetic nondestructive inspection is easy to detect subsurface defects and subtle defects. According to the inspection results the stress concentrates in gear surface, some internal defects and microscopic flaws exist on the gear units are not found to penetrate the nondestructive inspection, but magnetic nondestructive inspection could have found many defect. Therefore, a reasonable method of nondestructive inspection for the large gear units is suitable to magnetic nondestructive inspection.

• Journal of the Korean Society for Precision Engineering
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• v.28 no.9
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• pp.1094-1102
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• 2011

Recent trends for the miniaturization and weight reduction of portable electronic parts is the use of subminiature components. Assembly of the miniaturized components requires subminiature screws of which pitch sizes are in a micrometer scale. To produce such a subminiature screw with high precision threads, not only a precision forming technology but also high-precision measurement technique is required. In the present work, a vision inspection system is developed to measure the thread profile of a subminiature screw. Optical simulation based on a ray tracing method is used to design and analyze the optical system of the vision inspection apparatus. Through this simulation, optical performance of the developed vision inspection system is optimized. The image processing algorithm for the precision screw inspection is also discussed.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.20 no.4
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• pp.446-451
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• 2011

Recent trends for the miniaturization and weight reduction of portable electronic parts have driven uses of subminiature components. Assembly of the miniaturized components requires subminiature screws of which pitch sizes are micrometer scale. To produce such subminiature screws with high precision threads, not only a precision forming technology but also a high-precision measurement technology is required. The present study covers the development of a vision inspection system for precision screws for the automatic measurement of subminiature screws with high speed and reliability. In this study, the feeding unit that transfers the subminiature screws to the inspection unit is investigated through finite element(FE) analysis. The vibration characteristics of the feeding unit are predicted through FE analyses, from which we can determine whether the subminiature screw can be stably fed into the inspection unit or not. The effects of several design parameters on the vibration characteristics are also discussed.

• Journal of the Korean Society for Industrial and Applied Mathematics
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• v.10 no.1
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• pp.31-45
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• 2006

Recently advanced device and sophisticated manufacture process by high-density, high-integration require critical inspection criteria in SMT(surface mounting technologies). Especially for solder paste which come out over 60% of inferior goods of all product, 3-dimensional inspection replaces 2-D inspection as a effectiveness substitute of this trend. Therefore this paper proposes a fast 3-D inspection system and measurement algorithm automatically inspecting 3-D solder paste of PCB in SMT assembly line. The proposed method generates 3-D surface of data using B-spline algorithm and then extracts to inspect the pad.

• Transactions of the Korean Society of Automotive Engineers
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• v.16 no.5
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• pp.8-14
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• 2008

For nondestructive inspection of electron beam (EB) welding part in automotive power transmission assembly, a pulse-echo ultrasonic testing apparatus in water immersion has been applied using the ultrasonic waves with a frequency of 10MHz. However various problems have appeared during the ultrasonic inspection, which led to some significant mistakes in automatic quality evaluation of the welding parts. Experimental study showed that the state of water couplant medium containing some amount of contaminants, rusts and anti-corrosion agents had considerable influences on the reduction of ultrasonic amplitudes during wave propagation. The amplitude reduction depending on the coupling medium state could bring about some mis-diagnoses for defects in the welding parts. The results proposed that for a reliable inspection of defects in welds the state of water medium should be kept in about 15 volume fractions (vol.%) of anti-corrosion agents and in minimized contaminants.

• Journal of Institute of Control, Robotics and Systems
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• v.15 no.9
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• pp.916-921
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• 2009

The technology to inspect and measure an inner structure of micro parts has become an important tool in the semi-conductor industrial field with the development of automation and precision manufacturing. Especially, the inspection skill on the inside of highly integrated electronic device becomes a key role in detecting defects of a completely assembled product. X-ray inspection technology has been focused as a main method to inspect the inside structure. However, there has been insufficient research done on the customized inspection technology for the flip-chip assembly due to the interior connecting part of flip chip which connects the die and PCB electrically through balls positioned on the die. In this study, therefore, it is implemented to detect shape error of flip chip bonding without damaging chips using an x-ray inspection system. At this time, it is able to monitor the solder bump shape by introducing an edge-extracting algorithm (exponential approximation function) according to the attenuating characteristic and detect shape error compared with CAD data. Additionally, the bonding error of solder bumps is automatically detectable by acquiring numerical size information at the extracted solder bump edges.

• 제어로봇시스템학회:학술대회논문집
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• 2005.06a
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• pp.2414-2417
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• 2005

Compact Camera Module(CCM) is widely used in PDA, Celluar phone and PC web camera. With the greatly increasing use for mobile applications, there has been a considerable demands for high speed production of CCM. The major burden of production of CCM is assembly of lens module onto CCD or CMOS packaged circuit board. After module is assembled, the CCM is inspected. In this paper, we developed the image capture board for CCM and the imaging processing algorithm to inspect the defects in captured image of assembled CCMs. The performances of the developed inspection system and its algorithm are tested on samples of 10000 CCMs. Experimental results reveal that the proposed system can focus the lens of CCM within 5s and we can recognize various types of defect of CCM modules with good accuracy and high speed.

• International Journal of Fuzzy Logic and Intelligent Systems
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• v.6 no.2
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• pp.95-99
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• 2006

A tape feeder of a SMD(Surface Mount Device) mounter is a device that sequentially feeds electronic components on a tape reel to the pick-up system of the mounter. As components are getting much smaller, feeding accuracy of a feeder becomes one of the most important factors for successful component pick-up. Therefore, it is critical to keep the feeding accuracy to a specified level in the assembly and production of tape feeders. This paper describes a tape feeder inspection system that was developed to automatically measure and to inspect feeding accuracy using machine vision. It consists of a feeder base, an image acquisition system, and a personal computer. The image acquisition system is composed of CCD cameras with lens, LED illumination systems, and a frame grabber inside the PC. This system loads up to six feeders at a time and inspects them automatically and sequentially. The inspection software was implemented using Visual C++ on Windows with easily usable GUI. Using this system, we can automatically measure and inspect the quality of ail feeders in production process by analyzing the measurement results statistically.