• Title/Summary/Keyword: Assembly Structure

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A wireless impedance analyzer for automated tomographic mapping of a nanoengineered sensing skin

  • Pyo, Sukhoon;Loh, Kenneth J.;Hou, Tsung-Chin;Jarva, Erik;Lynch, Jerome P.
    • Smart Structures and Systems
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    • v.8 no.1
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    • pp.139-155
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    • 2011
  • Polymeric thin-film assemblies whose bulk electrical conductivity and mechanical performance have been enhanced by single-walled carbon nanotubes are proposed for measuring strain and corrosion activity in metallic structural systems. Similar to the dermatological system found in animals, the proposed self-sensing thin-film assembly supports spatial strain and pH sensing via localized changes in electrical conductivity. Specifically, electrical impedance tomography (EIT) is used to create detailed mappings of film conductivity over its complete surface area using electrical measurements taken at the film boundary. While EIT is a powerful means of mapping the sensing skin's spatial response, it requires a data acquisition system capable of taking electrical impedance measurements on a large number of electrodes. A low-cost wireless impedance analyzer is proposed to fully automate EIT data acquisition. The key attribute of the device is a flexible sinusoidal waveform generator capable of generating regulated current signals with frequencies from near-DC to 20 MHz. Furthermore, a multiplexed sensing interface offers 32 addressable channels from which voltage measurements can be made. A wireless interface is included to eliminate the cumbersome wiring often required for data acquisition in a structure. The functionality of the wireless impedance analyzer is illustrated on an experimental setup with the system used for automated acquisition of electrical impedance measurements taken on the boundary of a bio-inspired sensing skin recently proposed for structural health monitoring.

Sperm Injection into Maturing and Activated Porcine Oocytes

  • Kim, Bong-Ki;Lee, Yun-Jung;Cui, Xiang-Shun;Kim, Nam-Hyung
    • Proceedings of the KSAR Conference
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    • 2001.03a
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    • pp.41-41
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    • 2001
  • Chromatin configuration and microtubule assembly were determined in porcine maturing and activated oocytes following intracytoplasmic sperm injection. Microtubule localization was confirmed using a mouse monoclonal antibody to $\alpha$-tubulin and detected using a fluorescent labeled goat anti-mouse secondary antibody. DNA was stained with propidium iodide. The image of microtubules and chromatin was captured using laser scanning confocal microscope. In germinal vesicle stage oocyte, sperm chromatin remained condensation and sperm derived microtubules were not observed at 8 to 12 h after sperm injection. At 24 h after injection, the sperm nucleus developed to the metaphase chromatin along the metaphase structure of female nucleus. In some metaphase I stage oocytes, sperm chromatin decondensed at 8 h to 12 h after injection, sperm aster was seen soon after sperm injection. At 24 h after sperm injection into metaphase I stage oocyte, male chromatin developed to the metaphase chromatin while female chromatin extruded first polar body and formed the metaphase chromatin. At 12 to 15 h after sperm injection into preactivated oocytes, condensed sperm nucleus was located in close proximity of female pronucleus. However, the condensed nucleus did not fuse with female pronucleus. In preactivated ocytes, injected sperm remained condensation, a few sperm organized small microtubular aster. Instead, maternal derived microtubules were organized near the female chromatin, which seem to move condensed male chromatin near to the female pronucleus. These results suggest that sperm nuclear decondensing activity and nucleation activity of centrosome during fertilization are cell cycle dependent. In absence of male functional centrosome, female origin centrosome takes over the role of microtubule nucleation for nuclear movement.

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Cost-Driven Optimization of Defect-Avoidant Logic Mapping Strategies for Nanowire Reconfigurable Crossbar Architecture (Nanowire Reconfigurable Crossbar 구조를 위한 결함 회피형 로직 재할당 방식의 분석과 총 비용에 따른 최적화 방안)

  • Lee, Jong-Seok;Choi, Min-Su
    • Journal of KIISE:Computer Systems and Theory
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    • v.37 no.5
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    • pp.257-271
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    • 2010
  • As the end of photolithographic integration era is approaching fast, numerous nanoscale devices and systems based on novel nanoscale materials and assembly techniques are recently emerging. Notably, various reconfigurable architectures with considerable promise have been proposed based on nanowire crossbar structure as the primitive building block. Unfortunately, high-density sys-tems consisting of nanometer-scale elements are likely to have numerous physical imperfections and variations. Therefore, defect-tolerance is considered as one of the most exigent challenges in nanowire crossbar systems. In this work, three different defect-avoidant logic mapping algorithms to circumvent defective crosspoints in nanowire reconfigurable crossbar systems are evaluated in terms of various performance metrics. Then, a novel method to find the most cost-effective repair solution is demonstrated by considering all major repair parameters and quantitatively estimating the performance and cost-effectiveness of each algorithm. Extensive parametric simulation results are reported to compare overall repair costs of the repair algorithms under consideration and to validate the cost-driven repair optimization technique.

A study on chemical bonding characteristics of the interface between curved FRP panels for consecutive structural assembly (곡면 FRP 패널 부재 연속시공을 위한 연결부 화학적 접합 특성에 관한 연구)

  • Lee, Gyu-Phil;Shin, Hyu-Soung;Jung, Woo-Tai
    • Journal of Korean Tunnelling and Underground Space Association
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    • v.14 no.1
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    • pp.79-91
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    • 2012
  • A curved fiber reinforced polymer (FRP) panel is produced with a certain width depending on allowances of manufacturing processes and facilities. An targeted arch-shaped structure could be built by sequential connection of series of the FRP panels. The connection manner between the FRP panels could be given by chemical treatment, mechanical treatment and hybrid method. Among those, the connection between the panels by chemical treatment is commonly adopted. Therefore, For an optimized design of the connected part between FRP pannels, a number of direct shear tests have been undertaken in terms of a number of parameters: surface treatment conditions, bonding materials, etc.. As results, surface grinding condition by sand paper or surface treatment by sand blasting appear properly acceptable methods, and epoxy and acryl resins are shown to be effective bonding materials for the purpose in this study.

A study on the Economic Impact of Measurement Standards on the Advancement of Korean Industry - with case study on measuring equipment industry - (측정표준의 국내 산업성장에 대한 기여도 분석 - 측정기기산업의 분석을 중심으로 -)

  • Ahn, Ung-Hwan;Park, Byoung-Sun;Cho, Youn-Sang
    • Journal of Korea Technology Innovation Society
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    • v.10 no.2
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    • pp.361-382
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    • 2007
  • As the Korea's economy grows bigger and its industrial structure advances, demands of high quality product become increasing. And the technology becomes to be more important factor than labor power and capital. And, the development of technology plays the key role in promoting the competitiveness of a nation. Measurement means 'Measuring with instrument', dissemination of measurement standards related with dissemination and distribution of measuring instrument. Measurement technology has been known to be the main factor of economic growth and technological development. National measurement standards is one of these factors of measurement technology. Therefore, in order to enhance dissemination of measurement standards to industry, we have to define its economic impact. We analysed the economic impact of measurement standards in terms of its contribution to the product induction of industry and management results using I-O Table with the quantitative data. The results from this study show that the increasement of measurement standards dissemination is in complementary relation with the productivity of various industries, assembly manufacturing, in particularly.

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Application of Principal Component Analysis in Automobile Body Assembly : Case Study (자동차 차체 조립공장에서 주성분 분석의 응용 : 사례 연구)

  • Lee, Myung-D.;Lim, Ik-Sung;Kim, Eun-Jung
    • Journal of Korean Society of Industrial and Systems Engineering
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    • v.31 no.3
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    • pp.125-130
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    • 2008
  • Multivariate analysis is a rapidly expanding approach to data analysis. One specific technique in multivariate analysis is Principal Component Analysis (PCA). PCA is a statistical technique that linearly transform a given set of variables into a new set of composite variables. These new variables are orthogonal to each other and capture most of the information in the original variables. PCA is used to reduce the number of control points to be checked by measurement system. Therefore, the structure of the data set is simplified significantly It is also shown that eigenvectors obtained by conducting principal component analysis on the basis of the covariance matrix can be used to physically interpret the pattern of relative deformation for the points. This case study reveals the twisting deformation pattern of the underbody which is the largest mode of the total variation.

Three Dimensional Thermal-Elastic Plastic Analysis of GMAW Considering the Melting of Weld Bead (비드의 용용상태를 고려한 가스메탈 아크용접의 3차원 열탄소성 변형 해석)

  • Jang-Hyun Lee;Jong-Gye Shin;Ji-Hoon Kim
    • Journal of the Society of Naval Architects of Korea
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    • v.39 no.1
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    • pp.49-60
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    • 2002
  • Welding is essential in ship production since welding is very popular method for joining two or more metals. However, welding causes residual stress and distortion and these give a bad influence to the structure strength and assembly of ship blocks. Therefore, prediction and treatment of residual stress and distortion is a key to accuracy control in shipyard. In this paper, a computational procedure, based on thermal-elastic-plastic 3-dimensional FEA, has been suggested to simulate butt and fillet welding process. In the simulation process, temperature distribution at each time step is obtained by heat transfer analysis and then thermal deformation analysis is done with obtained temperature distributions to find the residual stress and distortion. In heat transfer analysis, enthalpy method is used to realize phase change at melting temperature. Also element birth and death method is used to simulate adding of weld metal in both heat transfer analysis and thermal elastic plastic analysis. The proposed procedure is verified by related researches and the results show good agreement with those of related researches.

Flip Chip Assembly Using Anisotropic Conductive Adhesives with Enhanced Thermal Conductivity

  • Yim, Myung-Jin;Kim, Hyoung-Joon;Paik, Kyung-Wook
    • Journal of the Microelectronics and Packaging Society
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    • v.12 no.1 s.34
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    • pp.9-16
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    • 2005
  • This paper presents the development of new anisotropic conductive adhesives with enhanced thermal conductivity for the wide use of adhesive flip chip technology with improved reliability under high current density condition. The continuing downscaling of structural profiles and increase in inter-connection density in flip chip packaging using ACAs has given rise to reliability problem under high current density. In detail, as the bump size is reduced, the current density through bump is also increased. This increased current density also causes new failure mechanism such as interface degradation due to inter-metallic compound formation and adhesive swelling due to high current stressing, especially in high current density interconnection, in which high junction temperature enhances such failure mechanism. Therefore, it is necessary for the ACA to become thermal transfer medium to improve the lifetime of ACA flip chip joint under high current stressing condition. We developed thermally conductive ACA of 0.63 W/m$\cdot$K thermal conductivity using the formulation incorporating $5 {\mu}m$ Ni and $0.2{\mu}m$ SiC-filled epoxy-bated binder system to achieve acceptable viscosity, curing property, and other thermo-mechanical properties such as low CTE and high modulus. The current carrying capability of ACA flip chip joints was improved up to 6.7 A by use of thermally conductive ACA compared to conventional ACA. Electrical reliability of thermally conductive ACA flip chip joint under current stressing condition was also improved showing stable electrical conductivity of flip chip joints. The high current carrying capability and improved electrical reliability of thermally conductive ACA flip chip joint under current stressing test is mainly due to the effective heat dissipation by thermally conductive adhesive around Au stud bumps/ACA/PCB pads structure.

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A Study on the Standard Joint Material and Reference Plane for the Standard of Construction in the Apartment (공동주택 시공표준화를 위한 조립기준면 및 표준마무리재에 관한 연구)

  • Lim, Seok-Ho;Park, Keun-Soo;Lee, Ga-Kyung
    • Proceeding of Spring/Autumn Annual Conference of KHA
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    • 2009.04a
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    • pp.230-235
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    • 2009
  • In our country, the application of the design method of face to face dimension in wall-slab apartment has passed 10 years. So MC design method has fixed in the design step to some degree. In Design and Work Execution of House the exclusive area of the apartment was calculated by face to face dimension. And the term of face to face dimension was known broadly to clients, construction company, etc. But design method of face to face dimension is not to simply extend the room size so far as wall depth in design process but to ensure the actual space should be considered with efficient use and assembly of building components. That is to say, Design method of face to face dimension is not to be defined by design step but to be related with construction and maintenance. However in construction process the point of face to face design method was not understood even now. So the purpose of this study was to extract the effect and question of face to face design method in construction process by survey of actual condition of structure and construction quality, and compare this result with existing construction method. The following project of this study is to survey of actual condition of interior components such as gypsum board, windows & doors etc. Therefore this study is to induce architectural long-life through architectural standardization construction and component's exchange, and, by the subject of the study on Apartment to have design guideline and basis for joining part between Gypsumboard and windows.

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A Review on Membranes and Catalysts for Anion Exchange Membrane Water Electrolysis Single Cells

  • Cho, Min Kyung;Lim, Ahyoun;Lee, So Young;Kim, Hyoung-Juhn;Yoo, Sung Jong;Sung, Yung-Eun;Park, Hyun S.;Jang, Jong Hyun
    • Journal of Electrochemical Science and Technology
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    • v.8 no.3
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    • pp.183-196
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    • 2017
  • The research efforts directed at advancing water electrolysis technology continue to intensify together with the increasing interest in hydrogen as an alternative source of energy to fossil fuels. Among the various water electrolysis systems reported to date, systems employing a solid polymer electrolyte membrane are known to display both improved safety and efficiency as a result of enhanced separation of products: hydrogen and oxygen. Conducting water electrolysis in an alkaline medium lowers the system cost by allowing non-platinum group metals to be used as catalysts for the complex multi-electron transfer reactions involved in water electrolysis, namely the hydrogen and oxygen evolution reactions (HER and OER, respectively). We briefly review the anion exchange membranes (AEMs) and electrocatalysts developed and applied thus far in alkaline AEM water electrolysis (AEMWE) devices. Testing the developed components in AEMWE cells is a key step in maximizing the device performance since cell performance depends strongly on the structure of the electrodes containing the HER and OER catalysts and the polymer membrane under specific cell operating conditions. In this review, we discuss the properties of reported AEMs that have been used to fabricate membrane-electrode assemblies for AEMWE cells, including membranes based on polysulfone, poly(2,6-dimethyl-p-phylene) oxide, polybenzimidazole, and inorganic composite materials. The activities and stabilities of tertiary metal oxides, metal carbon composites, and ultra-low Pt-loading electrodes toward OER and HER in AEMWE cells are also described.