• Transactions of the Korean Society of Machine Tool Engineers
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• v.17 no.6
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• pp.118-123
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• 2008

Weakness process can be called ferrule array and epoxy filling process at connector manufacturing process, and a lot of problems happen as think as general manufacturing process at early investment. Wished to improve this and working environment mend of worker on childhood(planning phase) and problem that is happened at done ferrule array and epoxy injection by emphasis target. By ferrule sorting and Improvement of epoxy filling process, bring authoritativeness elevation of product by fraction defective decrease of product by sized work along with productivity elevation. On the other hand, working jigs are various in characteristics of optical connector manufacturing line. There have been lots of restriction in practice because the applicability of this system is only for single type model though the network should be smooth between lines. Thus, it is not only needed the recognition of necessity in industrial line but also the development of automation system arraying ferrule and filling epoxy in the manufacturing process. It is found that the present system development enhances productivity fairly and prevents industrial disaster in the optical connector manufacturing system.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.17 no.11
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• pp.1093-1101
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• 2007

This study presents the design improvement process for door module. Its objective evades the resonance generated at module plate due to the operation of window regulator motor. For this study, the design improvement process is composed of experimental methods having three steps. First step is modal analysis at door assembly status for acquisition of dynamic characteristics which are modal frequency and damping. Second step is a vibration experiment to get the test mode considered an efficiency of window regulator motor. Last step is a vibration measurement by the form of $6{\times}6$ array on module plate. A vibration measurement of $6{\times}6$ array form can be got to three analysis results which are a transfer path of vibration using cross correlation function, a vibration map using OA level and a contribution by frequency band using coherent output power spectrum on module plate. These results are applied to SDM(structural dynamic modification) for design improvement to get around the resonance on module plate by the excitation of window regulator motor.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.19 no.8
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• pp.940-945
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• 2008

In this paper, we have designed the Brick Transmit/Receive Module for K-band which can be applied to active phase array radar system. The proposed structure of T/R Module for K band is brick type for MCM(Multi Chip Module) form and the satisfaction of tile type T/R Module can apply to structure of cavity and main characteristic. The fabricated brick type T/R Module confirmed the main characteristic for electrical goal performance in test and this structure can be applied to active phase array radar.

• The Journal of the Korea institute of electronic communication sciences
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• v.13 no.2
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• pp.321-326
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• 2018

This study describes the design and implementation of TRM(Transmit and Receiver Module) for detection for targets of small RCS(Radar Cross Section). Through the pre-simulation analysis of radar system about RF, the main specifications of TRM are verified. After the fabrication of TRM, the main characteristics such as the maximum output, noise figure, spurious were confirmed. In the future, the radar system test will be carried out by assembling TRMs, antenna radiator, and the transceiver that generates and receivers the radar waveform reflected.

• Smart Structures and Systems
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• v.21 no.5
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• pp.537-548
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• 2018

A tunnel deformation monitoring system is developed with the use of fiber Bragg grating (FBG) sensing technique, aiming at providing continuous monitoring of railway tunnel deformation in the long term, and early warning for the rail service maintainers and authorities to avoid catastrophic consequences when significant deformation occurs. Specifically, a set of FBG bending gauges with the ability of angle measurement and temperature compensation is designed and manufactured for the purpose of online monitoring of tunnel deformation. An overall profile of lateral tunnel displacement along the longitudinal direction can be obtained by implementing an array of the FBG bending gauges interconnected by rigid rods, in conjunction with a proper algorithm. The devised system is verified in laboratory experiments with a test setup enabling to imitate various patterns of tunnel deformation before the implementation of this system in an in-service high-speed railway (HSR) tunnel.

• Journal of Power Electronics
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• v.16 no.2
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• pp.553-563
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• 2016

This paper presents a digital hardware implementation of a real-time simulator for a multiphase drive using a field-programmable gate array (FPGA) device. The simulator was developed with a modular and hierarchical design using very high-speed integrated circuit hardware description language (VHDL). Hence, this simulator is flexible and portable. A state-space representation model suitable for FPGA implementations was proposed for a dual three-phase induction machine (DTPIM). The simulator also models a two-level 12-pulse insulated-gate bipolar transistor (IGBT)-based voltage-source converter (VSC), a pulse-width modulation scheme, and a measurement system. Real-time simulation outputs (stator currents and rotor speed) were validated under steady-state and transient conditions using as reference an experimental test bench based on a DTPIM with 15 kW-rated power. The accuracy of the proposed digital hardware implementation was evaluated according to the simulation and experimental results. Finally, statistical performance parameters were provided to analyze the efficiency of the proposed DTPIM hardware implementation method.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.31 no.10A
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• pp.988-995
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• 2006

In this Paper, we Present a nonharmonic may geometry design method using Euclidan minimum distance function in difference Phase spaces for 2-D (azimuth/elevation) multiple baseline antenna may which has a way to reduce the number of sensor antennas while maintaining accurate DOA estimate. The major advantages of our approach is that even the shortest interelement spacing can be larger than half-wavelength and is not limit13d to linear and it can be applied successfully to any array configuration. In multiple signals impinging situation, the performance simulation results of superresolution algorithms shows the effectiveness of the proposed method. Also the 2-D asymmetric may using the Proposed method is designed and the Performance of the manufactured away through the experimental test is verified.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.13 no.9
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• pp.904-913
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• 2001

The objective of this study was to investigate the characteristics of jet flow and heat transfer caused by trapezoid rods array in impinging jet system. In this study, trapezoid rods have been set up in front of flat plate to serve as a turbulence promoter. The bottom width of trapezoid rod was W=4, 8 mm and oblique angle were 80$^{\circ}$. The space from rods to the heating surface was C=1, 2, 4 mm, the pitch between each rods was P=30, 40, 50 mm, and the distance from nozzle exit to flat plate was H=100, 500 mm. This results were compared with the case without trapezoid rods. As a result, when rods are installed in front of the impinging plate, the acceleration of the jet flow and the eddies due to the rods seem to contribute to the heat transfer enhancement. Among test conditions, the heat transfer performance was best for the condition of W=8 mm, C=1 mm, P=30 mm and H/B=10. The maximum heat transfer rate is about 1.9 times larger than that without trapezoid rods.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.04a
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• pp.27-34
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• 2001

The BGA Package has been the area array package of choice for several rears. Recently, the transition has been to finer pitch configuration called Chip Scale Packages (CSP). Several of these package types are available at 0.5 mm pitch, requiring surface mount assemblers to evaluate and optimize various elements of the assembly process. This presentation describes the issues associated with making the transition from BGA to CSP assembly. Areas addressed will include the accuracy of pick and piece equipment, printed wiring board lines and spaces, PWB vias, in-circuit test issues, solder paste printing, moisture related factors, rework and reliability. The transition to 0.5 mm pitch requires careful evaluation of the board design, solder paste selection, stencil design and component placement accuracy. At this pitch, ball and board pad diameters can be as small as 0.25 mm and 0.20 mm respectively. Drilled interstitial vias are no longer possible and higher ball count packages require micro-via board technology. The transition to CSP requires careful evaluation of these issues. Normal paste registration and BGA component tolerances can no longer achieve the required process levels and higher accuracy pick and place machines need to be implemented. This presentation will examine the optimization of these critical assembly operations, contrast the challenges at 0.5 mm and also look at the continuation of the process to incorporate smaller pitch flip chip devices.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.3
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• pp.59-62
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• 2013

Experimental analyses on the solder joint reliability of plastic ball grid array under harsh random vibration were presented. The chips were assembled on the daisy chained circuit boards for the test samples preparation, half of which were processed for underfill to investigate the underfill effects on the solder failures. Acceptance and qualification levels were applied for the solder failure tests, and the overall controlled RMS of the power spectrum densities of the steps were 22.7 Grms and 32.1 Grms, respectively. It was found that the samples survived without any solder failure during the tests, demonstrating the robustness of the packaging structure for potential avionics and space applications.