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http://dx.doi.org/10.6117/kmeps.2013.20.3.059

Experimental Assessment of PBGA Packaging Reliability under Strong Random Vibrations  

Kim, Yeong K. (Department of Convergence Engineering and Management, Inha University)
Hwang, Dosoon (Korea Aerospace Research Institute)
Publication Information
Journal of the Microelectronics and Packaging Society / v.20, no.3, 2013 , pp. 59-62 More about this Journal
Abstract
Experimental analyses on the solder joint reliability of plastic ball grid array under harsh random vibration were presented. The chips were assembled on the daisy chained circuit boards for the test samples preparation, half of which were processed for underfill to investigate the underfill effects on the solder failures. Acceptance and qualification levels were applied for the solder failure tests, and the overall controlled RMS of the power spectrum densities of the steps were 22.7 Grms and 32.1 Grms, respectively. It was found that the samples survived without any solder failure during the tests, demonstrating the robustness of the packaging structure for potential avionics and space applications.
Keywords
PBGA; Reliability; Random vibration; Solder failure;
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Times Cited By KSCI : 1  (Citation Analysis)
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