• 제목/요약/키워드: Argon plasma

검색결과 320건 처리시간 0.032초

저압 플라즈마 세정가스에 따른 세정특성 연구 (A Study on the Cleaning Characteristics according to the process gas of Low-Pressure Plasma)

  • 구희준;고광진;정찬교
    • 청정기술
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    • 제7권3호
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    • pp.203-214
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    • 2001
  • 플라즈마를 발생시키는 반응기체의 종류에 따라 실리콘 산화막 세정에 어떠한 영향을 미치는지에 대해 연구하였다. 압력 (100 mTorr), 전력 (300 W, 500 W), 전극간 거리 (5, 8, 11.5 cm), 세정시간 (90초, 180초), 가스유량 (50sccm) 등의 변수들을 고정시키고 $CHF_3$, $CF_4$, 아르곤, 산소 등의 세정가스를 변화시키며 세정성능을 비교하였다. 세정결과 아르곤 플라즈마는 단지 물리적인 스퍼터링 효과만으로 세정속도가 느렸다. 산소 플라즈마는 5cm 전극거리, 300W, 180초 세정시 좋은 세정효과를 내었으나, 표면거칠기가 증가하였다. $CF_4$ 플라즈마의 경우 가장 좋은 세정효과를 얻었다. $CHF_3$ 플라즈마는 CFx/F의 비율을 낮출 수 있는 첨가기체가 필요함을 알 수 있었다. $CHF_3$에 아르곤을 첨가하였을 경우에는 원활한 세정효과를 얻을 수 없었으나, 산소를 첨가하였을 경우 좋은 세정효과를 얻을 수 있었다.

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A simple analysis on the abnormal behavior of the argon metastable density in an inductively coupled Ar plasma

  • 박민;유신재;김정형;성대진;신용현;장홍영
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2009년도 제38회 동계학술대회 초록집
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    • pp.438-438
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    • 2010
  • The abnormal behavior of the argon metastable density during the E-H mode transition in argon ICP discharge was investigated. Lots of investigations including global models expected that during and after the mode transition of ICP discharge, the density of metastable increases with applied rf power (i.e. electron density). However, recent direct measurement of metastable density revealed that the metastable density of argon decreases with the applied power during and after the mode transition. This result may not be explained by the previous global model which is based on the assumption of the Maxwellian electron energy distribution function (EEDF). In this paper, to explain this abnormal behavior with simple manners, a simple global model taking account of the effect of the non-Maxwellian EEDFs incorporating into a set of coupled rate equations is proposed. The result showed that the calculated metastable density taking account of non-Maxwellian EEDF and its evolution during the transition has an abnormal behavior with electron density and is in good agreement with the previous measurement results, indicating the close coupling of electron kinetics and the behavior of metastable density. The proposed simple model is expected to provide qualitative kinetic insight to understand the behavior of the metastable density in various plasma discharges which typically exhibit non-Maxwellian distribution.

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유도결합플라즈마 표면 처리 및 SnO2 증착에 따른 폴리카보네이트 특성 연구 (Influence of Inductive Coupled Plasma Treatment and SnO2 Deposition on the Properties of Polycarbonate)

  • 엄태영;최동혁;손동일;엄태용;김대일
    • 한국전기전자재료학회논문지
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    • 제31권3호
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    • pp.156-159
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    • 2018
  • Inductively coupled plasma (ICP) treatment with argon and a mixture of argon and oxygen gases has been used to modify the surface of polycarbonate (PC) substrates. The results showed that the surface contact angle was inversely proportional to the plasma discharge power and that the mixed-gas plasma (gas flow 10:10 sccm, discharge power 60 W) decreased the surface contact angle as low as $18.3^{\circ}$, indicating a large increase in the surface hydrophilicity. In addition, $SnO_2$ thin films deposited on the PC substrate effectively enhanced the ICP plasma treatment, and could also enhance the usefulness of PC in the inner parts of automobiles.

Ar 가스 압력과 RF 전력에 따른 유도결합형 플라즈마의 전기적 및 광학적 특성 (Electrical and Optical Characteristics of Inductively Coupled Plasma by Ar Gas Pressure and Rf Power)

  • 최용성;허인성;이영환;박대희
    • 한국전기전자재료학회논문지
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    • 제17권5호
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    • pp.560-566
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    • 2004
  • In this paper, the electrical and emission properties of electrodeless fluorescent lamp were discussed using the inductively coupled plasma (ICP) with the variation of argon gas pressure and RF power. The RF output was applied to the antenna in the range of 5∼50 W at 13.56 MHz. The internal plasma voltage of the chamber and the probe current were measured while varying the supply voltage to the Langmuir probe in the range of -100V∼+100V. When the pressure of argon gas was increased, electric current was decreased. There was a significant electric current increase from 10 to 30 W. Also, when the RF power was increased, electron density was increased. Also, the emission spectrum, Ar- I lins, luminance were investigated. At this time, the input parameter for ICP RF plasma, Ar gas pressure and RF power were applied in the range of 10∼60 mTorr, 10∼300 W, respectively. This implies that this method can be used to find an optimal RF power for efficient light illumination in an electrodeless fluorescent lamp.

저기압하의 아르곤 가스의 RF 글로우 방전특성 (RF Glow Discharge Characteristics of Argon at Low Gas Pressure)

  • 곽동주;김두환;박정후
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1995년도 하계학술대회 논문집 C
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    • pp.1382-1384
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    • 1995
  • In order to study the structure of RF glow discharge driven at 13.56MHz in argon, the discharge voltage, current and phase shift between them will be measured over a wide range of discharge parameters(gas pressure between 1mTorr and 50mTorr with discharge power between 20mW and 200W). In this paper, the dc glow discharge characteristics and plasma parameters of both FTS and CPMS systems are studied experimentally. It is found that for CPMS system discharge is stablized under wider ranges of magnetic field and pressure than for FTS system. The plasma density and electron temperature of the plasma for these two systems are in the range of $10^{10}{\sim}7{\times}10^{11}[cm^{-3}]$ and $3.5{\sim}6.5$[eV], respectively.

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Mechanisms of $Cl_2$ Molecules Dissociation in a Gas Discharge Plasma in Mixtures with Ar, $O_2.N_2$

  • Efremov, A.M.;Kwon, Kwang-Ho
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제1권4호
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    • pp.197-201
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    • 2001
  • The influence of argon, oxygen, and nitrogen admixtures on the dissociation of $Cl_2$ molecules in a glow discharge low-temperature plasma under the constant pressure conditions was investigated. For $Cl_2/Ar$ and $Cl_2/O_2$mixtures, the concentration of chlorine atoms was observed to be a practically constant at argon or oxygen concentrations up to 50%. This invariability is a most pro bably explained by relative increase in rate of $Cl_2$ direct electron impact dissociation due to the changes in electrophysical parameters of plasma such as EEDF, electron drift rate and mean energy. For all the considered mixtures, the contribution of stepwise dissociation involving active species from gas additives (metastable atoms and molecules, vibrationally excited molecules) was found to be negligible.

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Preparation of Boron Doped Fullerene Film by a Thermal Evaporation Technique using Argon Plasma Treatment and Its Electrochemical Application

  • Arie, Arenst Andreas;Jeon, Bup-Ju;Lee, Joong-Kee
    • Carbon letters
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    • 제11권2호
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    • pp.127-130
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    • 2010
  • Boron doped fullerene $C_{60}$ ($B:C_{60}$) films were prepared by the thermal evaporation of $C_{60}$ powder using argon plasma treatment. The morphology and structural characteristics of the thin films were investigated by scanning electron microscope (SEM), Fourier transform infra-red spectroscopy (FTIR) and x-ray photo electron spectroscopy (XPS). The electrochemical application of the boron doped fullerene film as a coating layer for silicon anodes in lithium ion batteries was also investigated. Cyclic voltammetry (CV) measurements were applied to the $B:C_{60}$ coated silicon electrodes at a scan rate of $0.05\;mVs^{-1}$. The CV results show that the $B:C_{60}$ coating layer act as a passivation layer with respect to the insertion and extraction of lithium ions into the silicon film electrode.

플라즈마 중합법에 의해 제작된 폴리스틸렌의 레지스트 특성 조사 (A Study on Resist Characteristics of Polystyrene by Plasma Polymerization)

  • 박상근;박종관;이덕출;김종석;정해덕
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 1994년도 춘계학술대회 논문집
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    • pp.138-140
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    • 1994
  • Plasma polymerized thin film was prepared using an interelectrod inductively coupled gas-flow-type reactor. Styrene was chosen as the monomer to be used. This thin films were also delineated by the electron-beam apparatus with an acceleration voltage 30kV, and the pattern in the resist was developed with RIE 80 with argon gas mixture ratio, pressure and RF power. The effect of charge of discharge power on growth rate and etching rate of the thin films were studied. The molecular structure of thin films were investigated by FIR and then was discussed in relation to its quality as a resist. In the case of Plasma polymerization, thickness of resist could be controlled by discharge duration and power. Also etch rate is increased as to growing argon gas and RF power with RIE 80.

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Effect of Argon Plasma Treatment On Silver Nanowires

  • Tran, Vo Thi Bao;Choi, Dooho
    • 마이크로전자및패키징학회지
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    • 제28권1호
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    • pp.73-77
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    • 2021
  • In this study, we report on the effects of argon plasma treatment on Ag nanowires by varying the power and duration. Sheet resistance was found to be significantly reduced to 10 ohm/sq. relative to the value of 21 ohm/sq. for the pristine sample. Such a reduction was found to be associated with welded junctions between Ag nanowires, which results in enhanced current flow. With the optimized plasma treatment conditions, the maximum and average transmittance were 76.8% and 71%, respectively. Finally, we fabricated transparent heating devices based on the methodology, which exhibited superior heating capability.