• Journal of the Korean Vacuum Society
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• v.9 no.3
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• pp.207-215
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• 2000

Al films on cold-rolled steel sheet have been prepared by vacuum evaporation and arc-induced ion plating, respectively, and the evaporation rate and vapor distribution (thickness distribution over the substrate) have been investigated according to deposition conditions. The arc-induced ion plating (AIIP) method have been employed, which makes use of arc-like discharge current induced by ionization electrode located near the evaporation source. The AIIP takes advantage of high ionization rate compared with conventional ion plating, and can be carried out at low pressure of less than $10^{-4}$ torr. Very high evaporation rate of more than 2.0 mu\textrm{m}$/min could be achieved for Al evaporation using alumina liner by electron beam evaporation. The geometry factor n for the $cos^{n/\phi}$ vapor distribution, which affects the thickness distribution of films at the substrate turned out to be around 1 for vacuum evaporation, while it features around 2 or higher for ion plating. For the ion plated films, it has been found that the ionization condition and substrate bias are the main parameters to affect the thickness distribution of the films.

• Journal of the Korean Vacuum Society
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• v.12 no.2
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• pp.112-117
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• 2003

MgO films is widely used in plasma display panel (PDP) technology. In this work, structural and optical properties of the MgO films deposited by e-beam evaporation, reactive magnetron sputtering, which are commercially used, and arc deposition were compared. MgO thin films were deposited on glass substrates by vacuum arc deposition equipment using a magnesium metal target at various oxygen gas flows. In order to investigate the packing density by ellipsometer, to measure reasonable erosion-rates of the MgO protective layers, we introduced an acceleration test method, namely, Ar+ ion beam induced erosion test. Also, XPS and UV test were adopted to examine the effect of the moisture on the optical transmittance of the MgO protective layers, which showed that these of MgO films by arc deposition method sustained more 90% and were insensitive to effect of the moisture. XRD and AFM have been also used to study behaviors of the structure and surface morphology.

• The KSFM Journal of Fluid Machinery
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• v.11 no.4
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• pp.7-13
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• 2008

The computational investigation is performed to find out the interaction of arc plasmas with surrounding materials and the thermal flow characteristics in a PASB (Puffer-Assisted Self-Blast) chamber, which is one of new breaking concepts in $SF_6$ switchgears. It is very important to define the flow and mass transfer happened during the full arcing history for further understanding complex physics inside the chamber. In this study, we have considered two diffusion processes by the hot arc plasma, one is PTFE nozzle ablation and the other is Cu electrode evaporation, simultaneously. It was found that the principle of the pressure-rise inside the chamber is confirmed by the computational results and the increase of the electrical conductivity of the residual gas near current zero is critical to the chamber design.

• Carbon letters
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• v.3 no.3
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• pp.142-145
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• 2002

Multiwall carbon nanotubes (MWNT) were produced using the arc-discharge graphite evaporation technique. Composite films were developed using MWNT dispersed in polystirol polymer. In the present work, various properties of the polymeric thin film containing carbon nanotubes were investigated by optical absorption, electrical resistivity and the same have been discussed.

• Journal of the Korean Society of Industry Convergence
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• v.24 no.6_2
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• pp.909-917
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• 2021

This study was carried out experimentally on the production and properties of silicon nanopowders characteristics using a transferred type arc plasma apparatus. To investigate the properties of silicon nanopowder, the purity of argon gas(99.999%, 99.9%) and the partial pressure ratio of nitrogen gas(0~90%) were varied. The total pressure in chamber is 400Torr and the silicon chunk amount used as raw material is 300g. The power supplied to the cathode to generate arc plasma was 9~12kW/h, and the electrode was made of tungsten and graphite with a diameter of 13mm. The particle size, impurity elements and powder evaporation rate of the silicon powder were analyzed using the XRD, FE-SEM, TEM and electronic scale. According to the purity of argon gas, the silicon evaporation rate and the particle size were similar, and impurities were generated more in the case of 99.9% purity than 99.999%. When argon gas and nitrogen gas were mixed in the chamber, the silicon evaporation rate and particle size increased as the partial pressure ratio of nitrogen gas increased. In particular, when the partial pressure ratio of nitrogen gas was 80%, the silicon evaporation rate 80g/h, and the particle size was about 80~100nm.

• Journal of Powder Materials
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• v.20 no.6
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• pp.411-424
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• 2013

In this study, the synthesis of nickel nanoparticles and copper nanospheres for the potential applications of MLCC electrode materials has been studied by plasma arc evaporation method. The change in the broad distribution of the size of nickel and copper nanopowders is successfully controlled by manifesting proper mixture of gas ambiance for plasma generation in the size range of 20 to 200 nm in diameter. The factors affecting the mean diameter of the nanopowder was studied by changing the composition of reactive gases, indicating that nitrogen enhances the formation of larger particles compared to hydrogen gas. The morphologies and particle sizes of the metal nanoparticles were observed by SEM, and ultrathin oxide layers on the powder surface generated during passivation step have been confirmed using TEM. The metallic FCC structure of the nanoparticles was confirmed using powder X-ray diffraction method.

• Journal of the Korean institute of surface engineering
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• v.54 no.3
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• pp.133-138
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• 2021

Ternary Ti-X-N coatings, where X = Al, Si, Cr, O, etc., have been widely used for machining tools and cutting tools such as inserts, end-mills, and etc. Ti-Al-N-O coatings were deposited onto silicon wafer and WC-Co substrates by a cathodic arc evaporation (CAE) technique at various negative substrate bias voltages. In this study, the influence of substrate bias voltages during deposition on the microstructure and mechanical properties of Ti-Al-N-O coatings were systematically investigated to optimize the CAE deposition condition. Based on results from various analyses, the Ti-Al-N-O coatings prepared at substrate bias voltage of -80 V in the process exhibited excellent mechanical properties with a higher compressive residual stress. The Ti-Al-N-O (-80 V) coating exhibited the highest hardness around 30 GPa and elastic modulus around 303 GPa. The improvement of mechanical properties with optimized bias voltage of -80 V can be explained with the diminution of macroparticles, film densification and residual stress induced by ion bombardment effect. However, the increasing bias voltage above -80 V caused reduction in film deposition rate in the Ti-Al-N-O coatings due to re-sputtering and ion bombardment phenomenon.

• Journal of the Korean institute of surface engineering
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• v.54 no.3
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• pp.139-143
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• 2021

Cr-Al-N coatings were deposited onto WC-Co substrates using a cathodic arc evaporation (CAE) system. CAE technique is recognized to be a very useful process for hard coatings because it has many advantages such as high packing density and good adhesion to metallic substrates. In this study, the influence of deposition temperature as a key process parameter on film growth behavior and mechanical properties of Cr-Al-N coatings were systematically investigated and correlated with microstructural changes. From various analyses, the Cr-Al-N coatings prepared at deposition temperature of 450℃ in the CAE process showed excellent mechanical properties with higher deposition rate. The Cr-Al-N coatings with deposition temperature around 450℃ exhibited the highest hardness of about 35 GPa and elastic modulus of 442 GPa. The resistance to elastic strain to failure (H/E ratio) and the index of plastic deformation (H³/E² ratio) were also good values of 0.079 and 0.221 GPa, respectively, at the deposition temperature of 450℃. Based on the XRD, SEM and TEM analyses, the Cr-Al-N coatings exhibited a dense columnar structure with f.c.c. (Cr,Al)N multi-oriented phases in which crystallites showed irregular shapes (50~100nm in size) with many edge dislocations and lattice mismatches.

• Proceedings of the KSME Conference
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• 2007.05b
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• pp.2506-2511
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• 2007

The coupled simulation is performed to find out the interaction of arc plasmas with surrounding materials in a thermal puffer plasma chamber. In order to be more realistic, PTFE nozzle ablation and Cu electrode evaporation, which are caused by high temperature of arc plasmas, are considered together. Pressure rise and temperature inside the chamber generated during the whole arcing history are investigated with the applied currents. It is very important to define how thermal flow and mass transfer are processing between the arc plasma and surrounding materials for further understanding complex physics inside the chamber. It is concluded that the result might be very useful to understand the mechanism happened inside and to design thermal puffer plasma chambers, but further experimental studies are required to verify the results for the more practical applications.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.565-565
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• 2013

Free burning arcs where the work piece acts as an anode are frequently used for a number of applications. Our investigation is exclusively concerned with a simplified unified model of arcs and anode under steady state conditions at atmospheric pressure. The model is used to make predictions of arc and anode temperatures and arc voltage for a 200 A arc in argon. The computed temperatures along the axis between the cathode tip and the anode surface compare well the measured data. This knowledge of free burning arcfeatures can play a role in developing the atmospheric plasma systems, however, further investigation should include the modelling of Cu evaporation from anode and non-LTE situation near electrodes for more realistic calculations.