• Journal of Surface Science and Engineering
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• v.49 no.1
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• pp.98-103
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• 2016

The dry etching characteristics of SnO thin films were investigated using inductively coupled plasma (ICP) in Ar, $CF_4$, $Cl_2$ chemistries. the SnO thin films were deposited by reactive rf magnetron sputtering with Sn metal target. In order to study the etching rates of SnO, the processing factors of processing pressure, source power, bias power, and etching gas were controlled. The etching behavior of SnO films under various conditions was obtained and discussed by comparing to that of $SiO_2$ films. In our results, the etch rate of SnO film was obtained as 94nm/min. The etch rates were mainly affected by physical etching and the contribution of chemical etching to SnO films appeared relatively week.

• Resources Recycling
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• v.8 no.5
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• pp.19-27
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• 1999

The desilica~ilalioc~h~ar .~ctcrisocs or conveutcu dust for molten pg iron has bee11 sludled for the pulposc of converter dust reuse. Desiloconizalir~ne ff~c~encwya s observed 10 be increased with increasing feeding rate of dust, and there was 110 cffccl to Lhe des~lica~~iratiearlfli cio~cyfo r the addtioolI CaO Ln dust. In ~noslc ases, the dcs~l~conizaliornea ction was ucconlpl~shed wrthin 10 minutes regadless of thc dust cornpasilim In addition lo the desil~comzat~oenfl ect, the rzmow~lc hal-i~cteristo~fs M u, P. C, and S from mallen iron by convcrtcr dust also have been in\~esligataled. CuO m thc converlel. dust was observed to ~educc the demanganizi~tion eflect and slag laming phenomenon and make thc dephosphoriralion pn,ce*s easler.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07a
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• pp.243-246
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• 2004

W CMP 공정에서 abrasive 의 size 및 shape 에 따른 CMP 거동에 대해 관찰하였으며, 주요 제거 막질인 W 막질과 stopping layer 로 사용되는 Oxide 막질에 대한 압력(P)과 상대 속도(V) 영향성을 관찰하였다. CMP 제거량이 입자의 size 변화에 의존한다는 기존의 이론과는 달리 응집도(aggregate ratio) 변화가 주요 변수임을 밝혀 내었다. 한편, 각 막질에 대한 P,V 영향성 평가를 통해, 변형된 Prestonian equation 이 abrasive size 및 shape 에 상관없이 W 막질의 제거 거동을 설명하는데 중요한 역할을 수행함을 보였다. 그렇지만, W CMP 공정에서 stopping layer 로 사용되는 oxide 막질의 거동을 설명하는 데에는 어려움이 있었으며, 특히 P,V 에 의한 비선형적 removal rate(RR) 거동발생으로 인해 기존의 이론치와는 많은 차이를 나타내었다. 또한, abrasive size 와 shape 에 따라서도 복잡한 거동을 나타낸다.

• Nuclear Engineering and Technology
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• v.50 no.5
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• pp.724-730
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• 2018

Chromium and chromium nitride were selected as potential barriers to prevent fuel-clad chemical interaction (FCCI) between the cladding and the fuel material. In this study, ferritic/martensitic HT-9 steel and misch metal were used to simulate the reaction between the cladding and fuel fission product, respectively. Radio frequency magnetron sputtering was used to deposit Cr and CrN films onto the cladding, and the gas flow rates of argon and nitrogen were fixed at certain values for each sample to control the deposition rate and the crystal structure of the films. The samples were heated for 24 h at 933 K through the diffusion couple test, and considerable amount of interdiffusion (max. thickness: $550{\mu}m$) occurred at the interface between HT-9 and misch metal when the argon and nitrogen were used individually. The elemental contents of misch metal were detected at the HT-9 through energy dispersive X-ray spectroscopy due to the interdiffusion. However, the specimens that were sputtered by mixed gases (Ar and $N_2$) exhibited excellent resistance to FCCI. The thickness of these CrN films were only $4{\mu}m$, but these films effectively prevented the FCCI due to their high adhesion strength (frictional force ${\geq}1,200{\mu}m$) and dense columnar microstructures.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.09a
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• pp.175-180
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• 2005

In this study, we have developed a novel wire straightener which uses the direct heating method (DHM) fer straightening the micro wire. Also, we have developed a shearing device for cutting the micro wire. In order to avoid the surface oxidization, we supplied the inert gas(Ar) during the heating process and examined the effect of gas flow rate. The effects of the tension and the current applied to the tungsten micro wires were also thoroughly studied. From various experiments and analyses, we could obtain fine straightness $(\approx1\;{\mu}m/1000\;{\mu}m)$ and roundness $(<{\pm}2{\mu}m\;/100{\mu}m)$ when the tension is $500\~~600gf$ and the current is about 1.5A. for burrfree cutting, counter-punch method which two cutters moving contrary was used. The cutting blade has various U-groove angle where upper $10^{\circ}$, $mid:25^{\circ}$, lower $0^{\circ}$. After the shearing process, we confirmed the shearing section.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.438-438
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• 2010

The abnormal behavior of the argon metastable density during the E-H mode transition in argon ICP discharge was investigated. Lots of investigations including global models expected that during and after the mode transition of ICP discharge, the density of metastable increases with applied rf power (i.e. electron density). However, recent direct measurement of metastable density revealed that the metastable density of argon decreases with the applied power during and after the mode transition. This result may not be explained by the previous global model which is based on the assumption of the Maxwellian electron energy distribution function (EEDF). In this paper, to explain this abnormal behavior with simple manners, a simple global model taking account of the effect of the non-Maxwellian EEDFs incorporating into a set of coupled rate equations is proposed. The result showed that the calculated metastable density taking account of non-Maxwellian EEDF and its evolution during the transition has an abnormal behavior with electron density and is in good agreement with the previous measurement results, indicating the close coupling of electron kinetics and the behavior of metastable density. The proposed simple model is expected to provide qualitative kinetic insight to understand the behavior of the metastable density in various plasma discharges which typically exhibit non-Maxwellian distribution.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.08a
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• pp.195.1-195.1
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• 2013

Cu는 금속 박막재료로서 높은 전기전도성을 지니고 있을 뿐만 아니라 Ag, Al, Pt 등 보다 비용이 저렴하여, 높은 전기전도성을 필요로 하는 박막 재료로써 폭넓게 사용되고 있다. 그러나, 낮은 기계적 특성을 지니고 있어서 interconnect와 같은 작은 단면적의 배선재료로 사용될 경우, 높은 전류밀도에 따른 electromigration 현상에 의하여 hillock 또는 void의 형성 등 박막재료의 변형이 생기게 되어서 전자소자의 수명이 단축된다는 단점이 있다. TiN은 금속재료 못지않은 높은 전기 전도성을 지니고 있을 뿐만 아니라, 금속재료에 비하여 높은 기계적 특성과 녹는점을 지니고 있어 다양한 분야로 사용되고 있다. 본 연구에서는 Cu와 TiN composite 박막을 soda-lime glass위에 증착하여 낮은 비저항 뿐만 아니라 Cu와 비교하여 기계적 특성이 향상된 박막을 제작하고자 하였다. Cu와 TiN composite 박막 증착을 위하여 DC reactive magnetron co-sputtering 장비를 사용하였으며, Cu와 Ti 타겟 power, Ar:N2 유량비(Flow rate)을 변화시켜 Cu와 Ti의 조성비 및 TiN의 결정성을 조절하였고, 이를 통하여 박막의 TiN 조성에 따른 낮은 비저항 값과 순수한 Cu 박막과 비교하여 높은 기계적 특성을 지닌 Cu-TiN 박막을 증착하였다. Cu-TiN composite 박막의 구조 및 조성은 SEM (Scanning Electron Microscope), EDS (Energy Dispersive Spectrometer), XPS (X-ray Photoelectron Spectroscopy)장비를 사용하여 분석하였으며, 전기전도도는 4-point probe를 사용하여 측정하였고, Knoop hardness 측정방법을 사용하여 박막의 기계적 특성을 측정하였다.

• Journal of Surface Science and Engineering
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• v.46 no.5
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• pp.192-196
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• 2013

Stainless steels (AISI 316L) are carburized by Inductively coupled plasma using $CH_4$ and Ar gas. The ${\gamma}_c$ phase(S-phase) is formed on the surface of stainless steel after carburizing process. The XRD peak of carburized samples is shifted to lower diffracting angle due to lattice expansion. Overall, the thickness of ${\gamma}_c$ phase showed a linear dependence with respect to increasing temperature due to the faster rate of diffusion of carbon. However, at temperatures above 500, the thickness data deviated from the linear trend. It is expected that the deviation was caused from atomic diffusion as well as other reactions that occurred at high temperatures. The interfacial contact resistance (ICR) and corrosion resistance are measured in a simulated proton exchange membrane fuel cell (PEMFC) environment. The ICR value of the carburized samples decreased from 130 $m{\Omega}cm^2$ (AISI 316L) to about 20 $m{\Omega}cm^2$. The sample carburized at 200 showed the best corrosion current density (6 ${\mu}Acm^{-2}$).

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07b
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• pp.718-721
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• 2004

The $(Sr_{0.9}Ca_{0.1})TiO_3$(SCT) thin films are deposited on Pt-coated electrode$(Pt/TiN/SiO_2/Si)$ using RF sputtering method at various substrate temperature. The optimum conditions of RF power and $Ar/O_2$ ratio were 140[W] and 80/20, respectively. Deposition rate of SCT thin films was about $18.75[{\AA}/min]$. The crystallinity of SCT thin films were increased with increase of substrate temperature in the temperature range of $100\sim500[^{\circ}C]$. The dielectric constant of SCT thin films were increased with the increase of substrate temperature, and changed almost linearly in temperature ranges of $-80\sim+190[^{\circ}C]$. The current-voltage characteristics of SCT thin films showed the increasing leakage current as the substrate temperature increases.

• Journal of the Semiconductor & Display Technology
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• v.17 no.2
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• pp.16-19
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• 2018

The development speed of semiconductor and display device manufacturing technology is growing faster than the development speed of process equipment. So, there is a growing need for process diagnostic technology that can measure process conditions in real time and directly. In this study, a plasma diagnosis was carried out using impedance variation due to the plasma discharge. Variation of the measurement impedance appears as a voltage change at the reference impedance, and the plasma density is calculated using this. The above experiment was conducted by integrating the plasma diagnosis system and the linear atmospheric pressure DBD plasma source. It was confirmed that plasma density varies depending on various parameters (gas flow rate, $Ar/O_2$ mixture ratio, Input power).