• 한국진공학회지
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• 제21권6호
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• pp.333-341
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• 2012

본 연구는 RF 마그네트론 스퍼터링법을 이용하여 산소유량 변화에 따라 증착된 ITO 박막 구조적, 전기적, 광학적 특성을 분석하였다. ITO (Indium Tin Oxide) 박막은 $1.0{\times}10^{-3}$ Torr의 공정 압력과 2 kW 및 13.56 MHz의 RF 전력, 1,000 sccm의 Ar 가스 조건하에 0~12 sccm의 $O_2$ 가스 유량을 변경하면서 증착하였다. 광투과율 측정은 적분구를 이용하였으며, 측정 파장 범위는 300~1,100 nm이다. 4-point probe를 이용하여 면저항을 측정하였으며, Hall Measurement System을 이용하여 비저항, 캐리어 농도 및 전자이동도를 측정하였다. Scanning electron microscope 장비를 이용하여 ITO 박막 표면을 분석하였고, 박막의 거칠기는 Atomic force microscope을 이용하여 측정하였다. ${\gamma}$-Focused ion beam system을 이용하여 ITO 박막의 이차전자방출계수를 측정하였으며, 이차전자방출계수 값으로 Auger neutralization mechanism 분석법을 이용해 ITO 박막의 일함수를 결정하였다. 3 sccm의 산소 유량에서 증착된 ITO 박막의 비저항은 약 $2.4{\times}10^{-4}{\Omega}{\cdot}cm$로 가장 좋았으며, 광학적 특성 또한 84.93% (Weighted average)로 가장 좋은 것을 확인할 수 있었다. 이 조건에서 이차전자방출 계수가 가장 높았고 일함수는 가장 낮은 경향의 일치함을 확인하였다.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
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• pp.620-625
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• 2002

Considering the fuel consumption of car, a light structure of aluminum alloys is desired for car body nowadays. However, fusion welding of aluminum alloys has some problems of reduction of joint efficiency, porosity formation and hot cracking. ill the present work, investigation to improve the joint performance of laser welded joint has been carried out by addition of Cu, Ni, and Zr to A6N01 alloy welds. Aluminum alloy plate of 2.0mm in thickness with filler metal bar was welded by twin beam Nd:YAG laser facility (total power:5kW). The filler metals were prepared by changing the chemical compositions for adding the elements into the weld metal. Thirteen filler metal bars were prepared and pre-placed into the base metal before welding. Ar gas shielding with a flow rate of 10 l/min was used. The defocusing distance is kept at 0 mm. At travel speeds of 3 to 9 m/min and at laser power of 5kW (front beam 2kW rear beam 3kW), full penetration welds were obtained, whereas at travel speeds of 12 to 18 m/min and same power, partial penetration was observed. The joint efficiency of laser-welded joint was improved by the addition of Cu, Ni, and Zr due to the solid solution hardening, grain refining and precipitation hardening. The type of hardening has been further considered by metallurgical examination.

• 대한전자공학회논문지
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• 제26권6호
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• pp.48-56
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• 1989

밀착형 1차원 영상감지소자로서 팩시밀리에 사용될 광도전막을 사일랜듸 글로방전 분해법으로 제작하였다. 우선 rf전력, 사일랜유량, 분위기 가스압, $H_2/SiH_4$비 및 기판온도의 증착조건에 따른 단층광전도막의 전기적 및 광학적특성을 조사하였다. 이 단층구조 영상감지막은 광전감도 0.85와 100lux 조도하에서 $I_{ph}/I_d=100$을 나타내었다. 그러나 이러한 단층박막은 양 전극으로 부터의 캐리어주입으로 인해 큰 암전류도 0.2nA 이하를 나타내었다. 또한 다층막은 단층막에 비해 단파장 가시광영역이 보상되어 팩시밀리용 1차원 영상감지소자에 사용될 만한 결과를 나타내었다.

• 한국표면공학회지
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• 제38권5호
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• pp.188-192
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• 2005

Indium zinc oxide (IZO) thin films were deposited on glass substrate by dc magnetron sputtering. The effects of oxygen flow rate and deposition temperature on electrical and optical properties of the films were investigated. With addition of small amount of oxygen gas, the characteristic properties of amorphous IZO films were improved and the specific resistivity was about $4.8{\times}10^{-4}\Omega{\cdot}cm$. Change of structural properties according to the deposition temperature was observed with XRD, SEM, and AFM. Films deposited above $300^{\circ}C$ were found to be polycrystalline. Surface roughness of the films was increased due to the formation of grains on the surface. Electrical conductivity became deteriorated for polycrystalline IZO films. Consequently, high quality IZO films could be prepared by do sputtering with $O_{2}/Ar{\simeq}0.03$ and deposition temperature in range of $150\~200^{\circ}C$; a specific resistivity of $3.4{\times}10^{-4}{\Omega}{\cdot}cm$, an optical transmission over $90\%$ at wavelength of 550 nm, and a rms value of surface roughness about $3{\AA}$.

• International Journal of Korean Welding Society
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• 제2권2호
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• pp.26-31
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• 2002

Considering the fuel consumption of car, a light structure of aluminum alloys is desired fer car body nowadays. However, fusion welding of aluminum alloys has some problems of reduction of joint efficiency, porosity formation and hot cracking. In the present work, investigation to improve the joint performance of laser welded joint has been carried out by addition of Cu, Ni, and Zr to A6NO 1 alloy welds. Aluminum alloy plate of 2.Omm in thickness with filler metal bar was welded by twin beam Nd: YAG laser facility (total power: 5kW). The filler metals were prepared by changing the chemical compositions for adding the elements into the weld metal. Thirteen filler metal bars were prepared and pre-placed into the base metal before welding. Ar gas shielding with a flow rate of 10 1/min was used. The defocusing distance is kept at 0 mm. At travel speeds off 3 to 9 and at laser power of 5kW (front beam 2kW rear beam 3kW), full penetration welds were obtained, whereas at travel speeds of 12 to 18 m/min and same power, partial penetration was observed. The joint efficiency of laser-welded joint was improved by the addition of Cu, Ni, and Zr due to the solid solution hardening, grain refining and precipitation hardening. The type of hardening has been further considered by metallurgical examination.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2009년도 제38회 동계학술대회 초록집
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• pp.448-448
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• 2010

Magnetic random access memory (MRAM) has made a prominent progress in memory performance and has brought a bright prospect for the next generation nonvolatile memory technologies due to its excellent advantages. Dry etching process of magnetic thin films is one of the important issues for the magnetic devices such as magnetic tunneling junctions (MTJs) based MRAM. CoFeB is a well-known soft ferromagnetic material, of particular interest for magnetic tunnel junctions (MTJs) and other devices based on tunneling magneto-resistance (TMR), such as spin-transfer-torque MRAM. One particular example is the CoFeB - MgO - CoFeB system, which has already been integrated in MRAM. In all of these applications, knowledge of control over the etching properties of CoFeB is crucial. Recently, transferring the pattern by using milling is a commonly used, although the redeposition of back-sputtered etch products on the sidewalls and the low etch rate of this method are main disadvantages. So the other method which has reported about much higher etch rates of >$50{\AA}/s$ for magnetic multi-layer structures using $Cl_2$/Ar plasmas is proposed. However, the chlorinated etch residues on the sidewalls of the etched features tend to severely corrode the magnetic material. Besides avoiding corrosion, during etching facets format the sidewalls of the mask due to physical sputtering of the mask material. Therefore, in this work, magnetic material such as CoFeB was etched in an ICP etching system using the gases which can be expected to form volatile metallo-organic compounds. As the gases, carbon monoxide (CO) and ammonia ($NH_3$) were used as etching gases to form carbonyl volatiles, and the etched features of CoFeB thin films under by Ta masking material were observed with electron microscopy to confirm etched resolution. And the etch conditions such as bias power, gas combination flow, process pressure, and source power were varied to find out and control the properties of magnetic layer during the process.

• 한국진공학회:학술대회논문집
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• 한국진공학회 1998년도 제14회 학술발표회 논문개요집
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• pp.77-77
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• 1998

Present silicon dioxide (SiOz) 떠m as intennetal dielectridIMD) layers will result in high parasitic c capacitance and crosstalk interference in 비gh density devices. Low dielectric materials such as f f1uorina뼈 silicon oxide(SiOF) and f1uoropolymer IMD layers have been tried to s이ve this problem. I In the SiOF ftlm, as fluorine concentration increases the dielectric constant of t뼈 film decreases but i it becomes unstable and wa않r absorptivity increases. The dielectric constant above 3.0 is obtain어 i in these ftlms. Fluoropolymers such as polyte$\sigma$따luoroethylene(PTFE) are known as low dielectric c constant (>2.0) materials. However, their $\alpha$)Or thermal stability and low adhesive fa$\pi$e have h hindered 야1리ru뚱 as IMD ma따"ials. 1 The concept of a plasma processing a찌Jaratus with 비gh density plasma at low pressure has r received much attention for deposition because films made in these plasma reactors have many a advantages such as go여 film quality and gap filling profile. High ion flux with low ion energy in m the high density plasma make the low contamination and go어 $\sigma$'Oss피lked ftlm. Especially the h helicon plasma reactor have attractive features for ftlm deposition 야~au똥 of i앙 high density plasma p production compared with other conventional type plasma soun:es. I In this pa야Jr, we present the results on the low dielectric constant fluorocarbonated-SiOF film d밑JOsited on p-Si(loo) 5 inch silicon substrates with 00% of 0dFTES gas mixture and 20% of Ar g gas in a helicon plasma reactor. High density 띠asma is generated in the conventional helicon p plasma soun:e with Nagoya type ill antenna, 5-15 MHz and 1 kW RF power, 700 Gauss of m magnetic field, and 1.5 mTorr of pressure. The electron density and temperature of the 0dFTES d discharge are measUI벼 by Langmuir probe. The relative density of radicals are measured by optic허 e emission spe따'Oscopy(OES). Chemical bonding structure 3I피 atomic concentration 따'C characterized u using fourier transform infrared(FTIR) s야3띠"Oscopy and X -ray photonelectron spl:’따'Oscopy (XPS). D Dielectric constant is measured using a metal insulator semiconductor (MIS;AVO.4 $\mu$ m thick f fIlmlp-SD s$\sigma$ucture. A chemical stoichiome$\sigma$y of 야Ie fluorocarbina$textsc{k}$영-SiOF film 따~si야영 at room temperature, which t the flow rate of Oz and FTES gas is Isccm and 6sccm, res야~tvely, is form려 야Ie SiouFo.36Co.14. A d dielec$\sigma$ic constant of this fIlm is 2.8, but the s$\alpha$'!Cimen at annealed 5OOt: is obtain려 3.24, and the s stepcoverage in the 0.4 $\mu$ m and 0.5 $\mu$ m pattern 킹'C above 92% and 91% without void, res야~tively. res야~tively.

• 대한환경공학회지
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• 제27권6호
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• pp.590-598
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• 2005

본 연구에서는 HPLC와 DRC ICP-MS를 연결하여 수중의 Cr(III)와 Cr(VI) 측정을 위한 최적의 분석조건을 설정하고, 서울시 6개 취수장 원수에서의 Cr(III)와 Cr(VI)의 분포 특성을 조사하였다. 크롬 종(species) 분리를 위한 HPLC 이동상으로는 tetrabutylammonium phosphate monobasic(1.0 mM TBAP), ethylenediaminetetraacetic acid(0.6 mM EDTA) 그리고 2% v/v 메탄올을 사용하였으며, flushing solvent로는 5% v/v 메탄올을 사용하였다. 또한 크롬 종 분리 시 방해물질인 $ArC^+$의 제거를 위한 반응가스로 암모니아($NH_3$) 가스를 사용하였으며, Cr(III)와 Cr(VI)의 최적의 분리를 위해 이동상의 solvent ratio, pH 유속 및 시료 주입량의 변화에 따른 시험을 실시하였다. 외국의 경우 Cr(III)가 Cr(VI)보다 분석 감도가 우수한 것으로 보고되고 있으나 본 연구 결과 반응가스($NH_3$)를 사용할 경우, Cr(III)에 비해 Cr(VI)의 분석 감도가 더 우수한 것으로 나타났으며, 검출한계는 Cr(III)와 Cr(VI)에 대해 각각 $0.061\;{\mu}g/L$, $0.052\;{\mu}g/L$로 분석시간은 3분 이내로 나타났다. 서울시 6개 취수장 원수에서의 Cr(III)는 $0.048{\sim}0.064\;{\mu}g/L$(평균 $0.054\;{\mu}g/L$), Cr(VI)는 $0.014{\sim}0.023\;{\mu}g/L$(평균 $0.019\;{\mu}g/L$)의 농도 범위로 검출되었다. 회수율은 $90.1{\sim}94.1%$ 범위로 우수하게 나타났으며, Cr(III)가 Cr(VI)에 비해 $2{\sim}3$배 정도 높은 농도로 나타났다.

• 한국수소및신에너지학회논문집
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• 제10권1호
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• pp.59-69
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• 1999

반응성 스퍼터링법으로 AIN 박막을 증착하여 Al/AlN/Si구조의 MIS소자용 절연박막으로서의 응용가능성에 대해 연구하였다. 기판온도 $300^{\circ}C$, RF power 150W, 스퍼터링 압력 5mTorr, 아르곤과 질소 가스유량비 1:1 의 조건에서 5%의 수소가스를 부가적으로 첨가해 주는 시기에 따른 AIN박막의 표면형상변화, I-V특성, C-V특성, 조성을 조사하였다. 수소첨가에 따라 증착속도는 상당히 감소하였으나 표면형상 및 거칠기는 크게 변하지 않았다. I-V특성에서는 AIN 박막 증착시 초기 20분간 수소첨가를 시킨 경우가 후기 20분간 수소첨가를 시킨 경우보다 보다 우수한 절연특성을 보였다. 또한 C-V특성에서도 수소가 첨가됨에 따라 플랫밴드전압이 매우 낮아졌으며, 초기 20분간 수소첨가를 시킨 경우는 히스테리시스를 거의 보이지 않았으나, 후기 20분간 수소첨가를 시킨 경우는 상당한 히스테리시스를 보였다. AES를 이용한 조성분석을 통해 수소가스가 첨가됨에 따라 AIN박막내의 산소농도가 낮아진다는 사설을 발견하였고, 이에 따라 박막의 절연특성 및 C-V특성이 향상될 수 있는 가능성을 보였다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
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• pp.220-220
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• 2013

Surface-normal transmission electro-absorption modulator (EAM) are attractive for high-definition (HD) three-dimensional (3D) imaging application due to its features such as small system volume and simple epitaxial structure [1,2]. However, EAM in order to be used for HD 3D imaging system requires uniform modulation performance over large area. To achieve highly uniform modulation performance of EAM at the operating wavelength of 850 nm, it is extremely important to remove the GaAs substrate over large area since GaAs material has high absorption coefficient below 870 nm which corresponds to band-edge energy of GaAs (1.424 eV). In this study, we propose and experimentally demonstrate a transmission EAM in which highly selective backside etching methods which include lapping, dry etching and wet etching is carried out to remove the GaAs substrate for achieving highly uniform modulation performance. First, lapping process on GaAs substrate was carried out for different lapping speeds (5 rpm, 7 rpm, 10 rpm) and the thickness was measured over different areas of surface. For a lapping speed of 5 rpm, a highly uniform surface over a large area ($2{\times}1\;mm^2$) was obtained. Second, optimization of inductive coupled plasma-reactive ion etching (ICP-RIE) was carried out to achieve anisotropy and high etch rate. The dry etching carried out using a gas mixture of SiCl4 and Ar, each having a flow rate of 10 sccm and 40 sccm, respectively with an RF power of 50 W, ICP power of 400 W and chamber pressure of 2 mTorr was the optimum etching condition. Last, the rest of GaAs substrate was successfully removed by highly selective backside wet etching with pH adjusted solution of citric acid and hydrogen peroxide. Citric acid/hydrogen peroxide etching solution having a volume ratio of 5:1 was the best etching condition which provides not only high selectivity of 235:1 between GaAs and AlAs but also good etching profile [3]. The fabricated transmission EAM array have an amplitude modulation of more than 50% at the bias voltage of -9 V and maintains high uniformity of >90% over large area ($2{\times}1\;mm^2$). These results show that the fabricated transmission EAM with substrate removed is an excellent candidate to be used as an optical shutter for HD 3D imaging application.