• 한국재료학회지
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• 제8권5호
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• pp.377-382
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• 1998

Ti[N ($C_{2}$$H_{5}$ $CH_{3}$)$_{2}$]$_{4}$ [tetrakis(ethylmethylammino)titanium.TEMAT]와 $NH_{3}$를 반응가스로 하여 각각 펄스(pulse) 형태로 시분할 주입되는 새로운 박막 증착방법(이하 Cycle-CVD라 함)을 이용하여 TiN박막이 $SiO_2$.기판위에 증착되었다.Cycle-CVD에서 반을로 내로 주입되는 반응가스와 Ar가스는 TEAM 펄스, Ar 펄스,$NH_{3}$펄스, Ar 펄스의 순서로 시분할주입되었고, 이렇게 차례대로 주입되는 4개의 펄스를 하나의 cycle로 규정하고, Cycle-CVD는 이러한 cycle이 연속하여 반복적으로 주입되도록 설계되었다. 기판온도가 $170^{\circ}C$-$210^{\circ}C$에서는 atomic layer deposition(ALD)특성을 보였고, $200^{\circ}C$에서 충분한 반응가스의 펄스시간 후에 cycle당 증착된 박막의 두께가 0.6nm/cycle로 포화되는 양상을 보여주었는데, 이는 cycle당 증착된 TiN 박막의 두께가 1.6 monolayer(ML)/cycle에 해당된다. 이와 같이 반등가스의 흡착을 이용ㅇ하여 TiN이 제한된 표면반응만에 의하여 ALD 기구에 의해 증착이 이루어지므로 TiN 박막의 두께는 단지 cycle 횟수만으로 정확하게 제어할 수 있었고, 우수한 step coverage 특성을 얻었다. 또한 반응가스간의 기상반응을 방지함으로써 입자의 발생을 억제할 수 있었고, 상대적으로 낮은 온도임에도 불구하고 4at% 이하의 낮은 탄소함량을 갖는 양호한 특성을 보여주었다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.169-169
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• 2008

To keep pace with scaling trends of CMOS technologies, high-k metal oxides are to be introduced. Due to their high permittivity, high-k materials can achieve the required capacitance with stacks of higher physical thickness to reduce the leakage current through the scaled gate oxide, which make it become much more promising materials to instead of $SiO_2$. As further studying on high-k, an understanding of the relation between the etch characteristics of high-k dielectric materials and plasma properties is required for the low damaged removal process to match standard processing procedure. There are some reports on the dry etching of different high-k materials in ICP and ECR plasma with various plasma parameters, such as different gas combinations ($Cl_2$, $Cl_2/BCl_3$, $Cl_2$/Ar, $SF_6$/Ar, and $CH_4/H_2$/Ar etc). Understanding of the complex behavior of particles at surfaces requires detailed knowledge of both macroscopic and microscopic processes that take place; also certain processes depend critically on temperature and gas pressure. The choice of $BCl_3$ as the chemically active gas results from the fact that it is widely used for the etching o the materials covered by the native oxides due to the effective extraction of oxygen in the form of $BCl_xO_y$ compounds. In this study, the surface reactions and the etch rate of $Al_2O_3$ films in $BCl_3/Cl_2$/Ar plasma were investigated in an inductively coupled plasma(ICP) reactor in terms of the gas mixing ratio, RF power, DC bias and chamber pressure. The variations of relative volume densities for the particles were measured with optical emission spectroscopy (OES). The surface imagination was measured by AFM and SEM. The chemical states of film was investigated using X-ray photoelectron spectroscopy (XPS), which confirmed the existence of nonvolatile etch byproducts.

• 청정기술
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• 제20권4호
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• pp.425-432
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• 2014

이 논문은 촉매막반응기(catalytic membrane reactor)에서의 중요한 두 요소인 수소선택도와 수소투과량 및 Ar sweep 유량과 압력이 수성가스전이반응의 성능에 미치는 영향에 대하여 1차원 반응기모델과 반응속도식에 근거한 연구결과를 나타내고 있다. 연소전 이산화탄소 포집의 한 방법으로서, 촉매막반응기를 사용하여 원통부분에서는 고압/고농도의 이산화탄소를 관부분에서는 고순도의 수소를 동시에 얻을 수 있는지에 대한 가능성을 검토하였다. 또한, 고농도의 이산화탄소와 고순도의 수소를 동시에 얻기 위해 필요한 수소투과량, 수소선택도, Ar sweep 유량 및 압력에 대한 지침을 나타내었다. 그 결과 $1{\times}10^{-8}molm^{-2}s^{-1}Pa^{-1}$의 수소투과량과 10000의 수소선택도를 가진 막을 장착한 촉매막반응기에서는 8 atm의 압력과 $6.7{\times}10^{-4}mols^{-1}$의 Ar sweep 유량의 조건하에서 약 90%의 농도를 가진 이산화탄소와 100%의 순도를 가진 수소가 동시에 얻어짐이 밝혀졌다.

• 한국표면공학회지
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• 제46권3호
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• pp.133-138
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• 2013

We have developed a 2D axi-symmetric numerical model for an inductively coupled plasma system in order to analyze gas mixing effect through a narrow gap shower head. For frictional flow, holes of 0.5 mm diameter and 2 mm length are approximately modeled in 2D. Gas velocity distribution 10 mm below the shower head showed 2 times difference between the center and the edge at 10 mTorr. At 10 mm above the wafer, it was increased to 6 times difference due to the pumping duct effect. The model with a 5 mm height buffer region of a shower head showed reasonable behavior of Ar discharge. The density of Ar metastable showed additional peak inside the buffer region around the edge holes.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2015년도 제49회 하계 정기학술대회 초록집
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• pp.186-186
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• 2015

We have introduced multifunctional ITO single thin films formed by normal sputtering system equipped with a plasma limiter which effectively blocks the bombardment of energetic negative oxygen ions. MFSS ITO also possesses high gas diffusion barrier properties simultaneously low resistivity even it deposited at room temperature without post annealing on plastic substrate. Nano-crystalline enhancement by Ar energy has energy window from 20 to 30 eV under blocking NOI condition. Effect of blocking NOI and optimal Ar energy window enhancement facilitate that resistivity is minimized to $3.61{\times}10^{-4}{\Omega}cm$ and the WVTR of 100 nm thick MFSS ITO is $3.9{\times}10^{-3}g/(m^2day)$ which is measured under environmental conditions of 90% relative humidity and 50oC that corresponds to a value of ${\sim}10^{-5}g/(m^2day)$ at room temperature. The multifunctional MFSS ITO with low resistivity, and low gas permeability will be highly valuable for plastic electronics applications.

• 한국반도체및디스플레이장비학회:학술대회논문집
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• 한국반도체및디스플레이장비학회 2007년도 춘계학술대회
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• pp.183-187
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• 2007

The magnetron reactive ion etching (RIE) characteristics of polycrystalline (poly) 3C-SiC grown on $SiO_2$/Si substrate by APCVD were investigated. Poly 3C-SiC was etched by $CHF_3$ gas, which can form a polymer as a function of side wall protective layers, with additive $O_2$ and Ar gases. Especially, it was performed in magnetron RIE, which can etch SiC at lower ion energy than a commercial RIE system. Stable etching was achieved at 70 W and the poly 3C-SiC was undamaged. The etch rate could be controlled from $20\;{\AA}/min$ to $400\;{\AA}/min$ by the manipulation of gas flow rates, chamber pressure, RF power, and electrode gap. The best vertical structure was improved by the addition of 40 % $O_2$ and 16 % Ar with the $CHF_3$ reactive gas. Therefore, poly 3C-SiC etched by magnetron RIE can expect to be applied to M/NEMS applications.

• 한국진공학회지
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• 제5권2호
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• pp.119-126
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• 1996

The effect of the $O_2$ concentration in the sputtering gas mixture, substate temperature and Ar pressure on the structural and optical properties of 3 mol% YSZ and 8 mol% YSZ thin films deposited by RF magnetron sputtering were investigated . The films were observed to have various crystal structures with different compositions in accordance with the type of the target materials. The size of fine grain-like particles decreased wiht increasing the $O_2$ concentration in the sputtering gas in the case of 3mol% YSZ, while it increased in the case of 8 mol% YSZ . However, the average opticla transmission of 8mol% YSZ, despite of thicker thickness. was higher than that of 3 mol% YSZ. Furthermore, the values of refractive index of 3mol% YSZ increased with increasing the $O_2$ concentration in the sputtering gas on the contrary to those of the 8 mol% YSZ. However, the transmission spectra of 8 mol% YSZ films were not strongly influenced by the substrate temperature and Ar pressure, whereas the refractive index of the YSZ films were strongly affected by the sputtering parameters.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제52권11호
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• pp.508-511
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• 2003

In this paper, electrical characteristics of inductively coupled plasma in an electrodeless fluorescent lamp were investigated using a Langmuir probe with a variation of argon gas pressure. The RF output was applied in the range of 5 ∼ 50 (W) at 13.56 (MHz). The internal plasma voltage of the chamber and the probe current were measured while varying the supply voltage to the Langmuir probe in the range of -100 (V) ∼+100 (V). When the pressure of argon gas was increased, electric current was decreased. There was a significant electric current increase from l0W to 30 〔W〕. Also, when the RF power was increased, electron density was increase. This implies that this method can be used to find an optimal RF rower for efficient light illumination in an electrodeless fluorescent lamp.

• 반도체디스플레이기술학회지
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• 제8권4호
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• pp.59-63
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• 2009

This paper presents two dimensional simulation results of an inductively coupled $Ar/O_2$ plasma reactor. The effects of operating conditions on the plasma properties and the uniformity of atomic oxygen near the wafer were systematically investigated. The plasma density had the linear dependence on the chamber pressure, the flow rate of the feed gas and the power deposited into the plasma. On the other hand, the electron temperature decreased almost linearly with the chamber pressure and the flow rate of the feed gas. The power deposited into the plasma nearly unaffected the electron temperature. The simulation results showed that the uniformity of atomic oxygen near the wafer could be improved by lowering the chamber pressure and/or the flow rate of the feed gas. However, the power deposited into the plasma had an adverse effect on the uniformity.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 1998년도 특별강연 및 춘계학술발표 개요집
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• pp.150-154
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• 1998

The purpose of this paper is to investigate optimum welding conditions of STS 304 thin sheet by GTA welding and control 6 $\delta$--fenite which is harmful in mechanical processing, corrosion problem and can be formed brittle a phase in using long term at high temperature. One series of automatic welds was made using argon plus 10, 20, 30 % nitrogen to ensure a fully austenite deposit. Results obtained were summarized as follows: 1) 6 $\sigma$ferrite content in the weld metals is influenced largely by the nitrogen content. 2) Additions of nitrogen to the shielding gas can significantly reduce the amount of retained delta ferrite and result in an increase in hot cracking. 3) Bead width was increased when Ar + $N_2$ shielding gas was used and travel speed was increased. 4) Ar+$N_2$ shielding gas made weld metal ductile and reduce 6 -$\delta$-ferrite.