• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.4
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• pp.1460-1465
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• 2012

The semi-automatic gas metal arc welding equipment was developed and the weldability of zinc coated steel pipes was evaluated in terms of strength, porosity and welding parameters including shielding gas composition. The good bead appearance and the reduction of porosity in the welds could be possibly obtained by adding $O_2$ to Ar. The strength and joint efficiency of welds made by the semi-automatic welding equipment was about 1.8 times higher compared with welds manually made. The integrity of welds was confirmed by the water pressure test as well, Finally, it is expected that the weld productivity will be enhanced even unskilled welders can produce quality welds by operating the semi-automatic welding equipment.

• Membrane Journal
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• v.11 no.1
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• pp.38-49
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• 2001

The surface of polyimide membrane was modified by plasma treatment using Ar and NH~. and the permeability and selectivity for the mixture gas $(CO_2/N_2=20/80 vol%)$ were measured. The per¬meation experiments were performed by a variable volume method at $30^{\circ}$C and total pressure of 5 atm, The effect of the plasma conditions such as treatment time, power input, gas flow rate and pressure in the reactor on the transport Dwperties of modified membranes was investigated. The surface of the plasma treated membrane was analyzed by means of FTlR - ATH, ESCA and AFM. The dependences of the wettability and the etching on plasma treatment time were investigated by use of the contact angle and the weight loss measurement. Measurements of gas pcnneability characteristic were performed using both dry and wet membranes. The effects of experimental conditions such as temperature on the membrane performance were studied.

• Journal of the Korean Ceramic Society
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• v.40 no.8
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• pp.739-745
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• 2003

In $N_{x}$ films were deposited on soda-lime glass without substrate heating by reactive dc magnetron sputtering using indium (In) metal target. Depositions were carried out under various total gas pressures ( $P_{tot}$) of mixture gases (Ar+$N_2$ or He+$N_2$). He gas was introduced to $N_2$ gas in order to enhance the reactivity of nitrogen on film surface by the "penning ionization". Plasma impedance decreased greatly when 20% or more introduced the $N_2$ gas. This is due to the In $N_{x}$ layers formed on target surface because a secondary electron emission rate of InN is small compared with In metal. XRD patterns of the films revealed that <001> preferred oriented polycrystalline In $N_{x}$ films, where the crystallinity of the films was improved with decrease of $P_{tot}$ and with increase of $N_2$ flow ratio. The improvement of the crystallinity and stoichimetry of the In $N_{x}$ films were considered to be caused by an increase in the activated nitrogen radicals and also by an increase in the kinetic energy of sputtered In atoms arriving at growing film surface, which should enhance the chemical reaction and surface migration on the growing film surface, respectively. Furthermore, the films deposited using mixture gases of He+$N_2$ showed higher crystallinity compared with the film deposited by the mixture gases of Ar+$N_2$.$.EX>.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.32A no.1
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• pp.152-158
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• 1995

Eteching characteristics of the Indium Tin Oxide (ITO), which is transparent conductor, was investigated with CH4/H2 and Ar as etching gases for the Reactive Ion Etching (RIE). With CH4/H2 for the etching gas, the highly selective etching characteristics for the ITO on GaAs was obtained. It was examined that the dominant etching parameter for the selective etchning of ITO on GaAs structure was the chamber pressure. But, the etching selectivity for ITO on InP was poor eventhough we tried systematic etching. RIE etching conditins using CH4/H2 gas was limited due to the formation of polymer on the substrates. In the case of Ar gas for the reactive gas, the selectivity of ITO on BaTiO3 was above 10. The etch rete of ITO was more sensitive to the etching parameters than that of BaTiO3, which was almost constant with different etching parameters.

• Bulletin of the Korean Chemical Society
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• v.35 no.8
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• pp.2403-2409
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• 2014

Absolute isotope ratio is a critical constituent in determination of atomic weight. To measure the absolute isotope ratio using a mass spectrometer, mass discrimination factor, $f_{MD}$, is needed to convert measured isotope ratio to real isotope ratio of gas molecules. If the $f_{MD}$ could be predicted, absolute isotope ratio of a chemical species would be measureable in absence of its enriched isotope pure materials or isotope references. This work employed gravimetrically prepared isotope mixtures of argon (Ar) to obtain $f_{MD}$ at m/z of 40 in the magnetic sector type gas mass spectrometer (gas/MS). Besides, we compare the nitrogen isotope ratio of nitrogen trifluoride ($NF_3$) with that of nitrogen molecule ($N_2$) decomposed from the same $NF_3$ thermally in order to identify the difference of $f_{MD}$ values in extensive m/z region from 28 to 71. Our result shows that $f_{MD}$ at m/z 40 was $-0.044%{\pm}0.017%$ (k = 1) from measurement of Ar artificial isotope mixtures. The $f_{MD}$ difference in the range of m/z from 28 to 71 is observed $-0.12%{\pm}0.14%$ from $NF_3$ and $N_2$. From combination of this work and reported $f_{MD}$ values by another team, IRMM, if $f_{MD}$ of $-0.16%{\pm}0.14%$ is applied to isotope ratio measurement from $N_2$ to $SF_6$, we can determine absolute isotope ratio within relative uncertainty of 0.2 %.

• Korean Chemical Engineering Research
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• v.46 no.4
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• pp.676-680
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• 2008

TiN thin films were deposited on a $SiO_2(2000{\AA})/Si$ substrate by radio-frequency(rf) magnetron sputtering. TiN films were prepared under varying $N_2$ concentration in $N_2/Ar$ gas mix, rf power and gas pressure, and investigated in terms of deposition rate, resistivity and surface morphology. As $N_2$ concentration increased, the deposition rate and the surface roughness of the films decreased and the resistivity increased. With increasing rf power, the deposition rate increased but the resistivity was decreased. As gas pressure increased, little change in deposition rate was obtained but the resistivity rapidly increased. TiN film with resistivity of $2.46{\times}10^{-4}{\Omega}cm$ at 1 mTorr was formed. It was observed that there existed a correlation between the deposition rate and resistivity. In particular, the gas pressure has a strong influence on the resistivity of thin films.

• Analytical Science and Technology
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• v.7 no.4
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• pp.483-492
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• 1994

Direct solid analysis of various kinds of metal samples has been conducted by glow discharge. In this laboratory, the gas-jet assisted glow discharge(GJGD) device has been developed and characterized. The effect of changes in applied current, cell pressure and flow rate on atomic emission signals obtained from a jet-assisted cathodic sputtering was investigate. The emission intensities of Cu, Zn, and Ar were measured. They were increased with the current. But the intensities were decreased by increasing the flow rate of argon due to the diffusion and transportation of particles into plasma. By increasing the pressure of the cell, the intensities were greatly decreased because of enhancement of redeposition onto the surface of the sample.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07a
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• pp.74-77
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• 2004

[ $HfO_2$ ] dielectric layers were grown on the p-type Si(100) substrate by metalorganic molecular beam epitaxy(MOMBE). Hafnium $t-butoxide[Hf(O{\cdot}t-C_4H_9)_4]$ was used as a Hf precursor and Argon gas was used as a carrier gas. The thickness of the layers was measured by scanning electron microscopy (SEM) and high-resolution transmission electron measurement(HR-TEM). The properties of the $HfO_2$ layers were evaluated by X-ray diffraction(XRD), high frequency capacitance-voltage measurement(HF C-V), current-voltage measurement(I-V), and atomic force measurement(AFM). HF C-V measurements have shown that $HfO_2$ layer grown by MOMBE has a high dielectric constant(k=19-21). The properties of $HfO_2$ films are affected by various process variables such as substrate temperature, bubbler temperature, Ar, and $O_2$ gas flows. In this paper, we examined the relationship between the $O_2/Ar$ gas ratio and the electrical properties of $HfO_2$.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.43 no.4 s.346
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• pp.1-7
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• 2006

AlN thin films have been fabricated by using RF magnetron sputtering method and their crystal orientations, microstructures and piezoelectric properties have been investigated with variation of the $Ar/N_2$ gas ratio and the substrate temperature. Particularly, when the $Ar/N_2$ gas ratio and the substrate temperature are 10/10 (sccm) and $400^{\circ}C$, respectively, the AlN thin film exhibits the highest (002) orientation. The result of the surface roughness measurement by using AFM shows that the surface roughness becomes better as the partial pressure of $N_2$ increases at the substrate temperature of $400^{\circ}C$ and it becomes the smallest value of 2.1 nm when $Ar/N_2$ is 0/20 (sccm). The AFM measurement also shows that when $Ar/N_2$ is 10/10 (sccm) shows that surface roughness becomes better as the substrate temperature increases from room temperature up to $300^{\circ}C$ and then it becomes worse as the substrate temperature goes up from $300^{\circ}C$. At the substrate temperature of $300^{\circ}C$ and $Ar/N_2$=10/10 (sccm), the surface roughness is 3.036 nm. The piezoelectric constant ($d_{33}$) of AlN thin film is measured by Pneumatic probe method. The measurement shows that the AlN thin film with the highest (002) orientation, fabricated at $Ar/N_2$=10/10 (sccm) and the substrate temperature of $400^{\circ}C$, has the best Piezoelectric constant ($d_{33}$) of 6.01 pC/N.

• Proceedings of the Korean Vacuum Society Conference
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• 2005.02a
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• pp.132-132
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• 2005