• Journal of Radiation Protection and Research
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• v.13 no.2
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• pp.1-8
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• 1988

The energy losses of ${\alpha}$-particle with 3 to 5.4 MeV energy were measured as a function of gas absorber thickness and ${\alpha}$-particle energy in three light gaseous media; He, Ar, and $N_2$. The stopping powers and stopping cross-sections were determined by analyzing these data. For Ar gas, the experimental values are very well consistent with the corresponding values of Srivastava's stopping-power theory with the condition of the completely and partially stripped ion. For $N_2$ and He gases, these experimental values express the inconsistencies of about $13{\sim}36%$ and $27{\sim}28%$, respectively.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.43 no.4 s.346
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• pp.1-7
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• 2006

AlN thin films have been fabricated by using RF magnetron sputtering method and their crystal orientations, microstructures and piezoelectric properties have been investigated with variation of the $Ar/N_2$ gas ratio and the substrate temperature. Particularly, when the $Ar/N_2$ gas ratio and the substrate temperature are 10/10 (sccm) and $400^{\circ}C$, respectively, the AlN thin film exhibits the highest (002) orientation. The result of the surface roughness measurement by using AFM shows that the surface roughness becomes better as the partial pressure of $N_2$ increases at the substrate temperature of $400^{\circ}C$ and it becomes the smallest value of 2.1 nm when $Ar/N_2$ is 0/20 (sccm). The AFM measurement also shows that when $Ar/N_2$ is 10/10 (sccm) shows that surface roughness becomes better as the substrate temperature increases from room temperature up to $300^{\circ}C$ and then it becomes worse as the substrate temperature goes up from $300^{\circ}C$. At the substrate temperature of $300^{\circ}C$ and $Ar/N_2$=10/10 (sccm), the surface roughness is 3.036 nm. The piezoelectric constant ($d_{33}$) of AlN thin film is measured by Pneumatic probe method. The measurement shows that the AlN thin film with the highest (002) orientation, fabricated at $Ar/N_2$=10/10 (sccm) and the substrate temperature of $400^{\circ}C$, has the best Piezoelectric constant ($d_{33}$) of 6.01 pC/N.

• Journal of Welding and Joining
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• v.30 no.2
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• pp.70-75
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• 2012

In this study, effect of nitrogen volume in the shielding gas of Ar-$N_2$ mixing gas on the bead shape, hardness and microstructure of GTA welds of 3mm thick Commercial Pure Ti was investigated. As the nitrogen volume increased, the welding current for full penetration was reduced and hardness in the fusion zone significantly increased compared with that of the base metal, but there is no difference in the hardness of HAZ. Microstructure in the fusion zone with pure Ar gas changed from equiaxed alpha of the base metal to serrated alpha. On the other hand, microstructure using Ar-$N_2$ mixing gas changed to acicular alpha. With the increasing of nitrogen content, the amount of acicular alpha increased and the size of that was fine.

• Proceedings of the Materials Research Society of Korea Conference
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• 1996.11a
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• pp.17-17
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• 1996

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.37 no.7
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• pp.1-6
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• 2000

In this study, the effects of the addition of $N_2$ gas into the $Cl_2$ (90)/Ar(10) gas mixture, which has been proposed as the optimized etching gas combination, for etching of platinum was performed. The selectivity of platinum film to $SiO_2$ film etch mask increased with the addition of $N_2$ gas, and etch profile over 75 $^{\circ}$ could be obtained when 20 % additive $N_2$ gas was added. These phenomena were interpreted as the results of a formation of blocking layer such as Si-N or Si-O-N on the $SiO_2$ mask. The maximum etch rate of Pt film and selectivity of Pt to $SiO_2$ are 1425 ${\AA}$/min and 1.71, respectively. These improvements were considered to be due to the formation of more volatile compounds such as Pt-N or Pt-N-Cl.

• Bulletin of the Korean Chemical Society
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• v.35 no.9
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• pp.2774-2780
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• 2014

A dynamics study of relaxation and fragmentation of icosahedral argon cluster with a vibrationally excited $Ar_2^+$ (${\nu}$) is presented. Local translation is shown to be responsible for inducing energy flow from the embedded ion to host atoms and fragmentation of the cluster consisting of various low frequency modes. The total potential energy of $(Ar_2^+)Ar_{12}$ is formulated using a building-up procedure of host-guest and host-host interactions. The time dependence of ion-to-host energy transfer is found to be tri-exponential, with the short-time process of ~100 ps contributing most to the overall relaxation process. Relaxation timescales are weakly dependent on both temperature (50-300 K) and initial vibrational excitation (${\nu}$ = 1-4). Nearly 27% of host atoms in the cluster with $Ar_2^+$ (${\nu}$ = 1) fragment immediately after energy flow, the extent increasing to ~43% for ${\nu}$ = 4. The distribution of fragmentation products of $(Ar_2^+)Ar_{12}{\rightarrow}(Ar_2^+)Ar_n+(12-n)Ar$ are peaked around $(Ar_2^+)Ar_8$. The distribution of dissociation times reveals fragmentation from one hemisphere dominates that from the other. This effect is attributed to the initial fragmentation causing a sequential perturbation of adjacent atoms on the same icosahedral five-atom layer.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.13 no.2
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• pp.79-82
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• 2003

GaN nanoparticles were synthesized by the pulsed laser deposition (PLD) process on $SiO_2$substrate after irradiating the surface of the GaN sintered pellet by the ArF (193 nm) excimer laser. At this moment Ar gas pressure of 100 Pa, 50 Pa, 10 Pa and 1 Pa were applied during the ablation process and laser power of 100 mJ and 200 mJ were also applied. The synthesized fan nanoparticles were characterized by XRD, SEM, TEM, XPS and optical absorption spectra. The synthesized GaN nanoparticles had the crystallite sizes of 20~30 nm, and besides, GaN nanoparticles synthesized under low Ar gas pressure compared to the others corresponded with stoichiometry, and the optical band edge of the GaN nanoparticles was blueshifted.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.87-87
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• 2018

다이아몬드 상 탄소(diamond-like carbon, DLC)는 상당량의 $sp^3$ 결합을 가지는 비정질 탄소(a-C) 또는 수소화 비정질 탄소(a-C:H)로 이루어진 준안정 형태의 탄소이다. DLC는 전기 저항과 굴절률이 높고 화학적으로 다른 물질과 반응하지 않으며, 마찰계수가 낮고 경도가 높아 자기 디스크, 광학 소자 등의 다양한 분야에서 적용되고 있다[1,2]. 또한 다이아몬드에 비해 상온에서 성장이 가능할 정도로 합성온도가 낮아 적용 기판의 제한이 거의 없고, 증착 방법과 조건에 따라 탄소 결합의 다양성과 비정질성이 변화하기 때문에 넓은 범위의 특성을 얻을 수 있는 장점이 있다. 지금까지 DLC 박막의 광학적 특성, 특히 굴절률, 광학적인 에너지 밴드 갭, 자외선과 적외선 투과성에 대해서는 많은 연구가 진행되었으나 가시광선의 투과성에 대한 연구는 제한적이며[4], 가시광선 투과도 개선에 대한 연구는 전무하다. 본 연구에서는 ITO 기판 위에 DLC를 합성하고 기계적 특성과 가시광선 영역 투과도를 조사하였다. RF-PECVD(radio frequency plasma enhanced chemical vapor deposition) 방법에 의해서 $C_2H_2+Ar$ 혼합 가스 비율과 $C_2H_2+N_2$ 혼합 가스 비율을 변화시켜 ITO 기판 위에 DLC 박막을 합성하였다. 공정 압력과 rf-power, 증착시간, 기판온도는 0.2 torr, 40 W, 5 분, $50^{\circ}C$로 고정하고, 공정 가스는 $C_2H_2+Ar$과 $C_2H_2+N_2$가 200 sccm이 되도록 비율을 변화하였다. $C_2H_2:Ar$과 $C_2H_2:N_2$의 비율은 180 : 20, 160 : 40, 140 : 60, 120 : 80, 100 : 100이 되도록 가스의 유량을 조절하였다. 투과도는 가시광선(380 ~ 780 nm) 범위에서 측정하였고 두께와 표면조도는 AFM으로 측정하였다. 투과도는 $C_2H_2+Ar$의 Ar 가스 비율이 증가할수록 증가해 140 : 60일 때 최댓값을 나타낸 후 다시 감소하였다. $C_2H_2+N_2$ 투과도는 $N_2$ 가스 비율이 증가할수록 감소하는 경향을 나타내었다. 표면 거칠기는 $C_2H_2+Ar$ 혼합 가스를 사용한 경우의 Ar의 가스 비율이 증가할수록 증가하였다. 그러나 $C_2H_2+N_2$ 혼합 가스를 사용한 경우에는 $N_2$ 가스의 혼합 비율이 증가할수록 감소하였다.

• Journal of the Korean institute of surface engineering
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• v.42 no.4
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• pp.169-172
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• 2009

We investigated the dry-etching mechanism of the TiN thin film using a $Cl_2$/Ar inductively coupled plasma system. To understand the effect of the $Cl_2$/Ar gas mixing ratio, we etched the TiN thin film by varying $Cl_2$/Ar gas mixing ratio. When the gas mixing ratio was 100% $Cl_2$, the highest etch rate was obtained. The chemical reaction on the surface was investigated with X-ray photoelectron spectroscopy (XPS). Scanning electron microscopy (SEM) was used to examine etched profiles of the TiN thin film.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.48 no.9
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• pp.616-621
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• 1999

A planar inductively coupled $CH_4/H_2/Ar$plasma was used to investigate dry etch characteristics of GaN as a function of input power, RF bias power, and etch gas composition. Etch rate of GaN increased with input power up to 600 W and was saturated at the higher power. Also, the etch rates increased with increasing RF bias power, composition of $CH_4$ and Ar gas. We achieved the maximum etch rate of $930{\AA}$/min at the input power 400 W, RF bias power 250 W, and operational pressure 10 mTorr. This paper shows that smooth etched surface having roughness less than 1 nm in rms can be obtained by using planar inductively coupled plasma with $CH_4/H_2/Ar$ gas chemistry.