• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2007.11a
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• pp.225-228
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• 2007

Micro solid propellant thruster is the most feasible for development with current MEMS. Basic components of micro solid propellant thruster are diverging nozzle, micro igniter, combustion chamber, and solid propellant. Micro nozzles and micro chambers were fabricated using photosensitive glass by anisotropic wet etching technique. Micro Pt heaters on glass membrane which ignited solid propellant were developed. Components of thruster were integrated. Successful ignition was observed.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.33 no.3
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• pp.237-242
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• 2009

MEMS catalytic combustors were fabricated to use in micro-power sources as a heat source. The combustor was fabricated by photolithography and anisotropic wet etching of photosensitive glass wafers. Two different catalyst loading methods were used to complete the fabrication of the combustors. For thin film type, the $Al_2O_3$ was washcoated on the surface of the combustion chamber as a catalyst support, and for packed-bed type, ceramic foam was inserted after Pt was coated. The volume of the combustors was 1.8 $cm^3$ and 16W of heat was generated using the fabricated combustors with hydrogen. The energy density of combustor was about 8.9 W/$cm^3$.

• Journal of the Korean Institute of Telematics and Electronics
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• v.27 no.4
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• pp.563-570
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• 1990

A silicon pressure sensor made of a full bridge of diffused resistors was designed and fabricated using semiconductor integrated circuit process. Thin diaphragms with 30\ulcorner thickness were obtained using anisotropic wet chemical etching technique. Our device showed strong temperature dependence. Compensation networks are used to compensate for the temperature dependence of the pressure sensor. The bridge supply voltage having positive temperature coefficient by compensation networks was utilized against the negative temperature coefficient of bridge output voltage. The sensitivity fluctuation of pressure sensor before temperature compensation was -1700 ppm/\ulcorner, while it reduced to -710ppm\ulcorner with temperature compensation. Our result shows that the we could develop accurate and reliable pressure sensor over a wide temperature range(-20\ulcorner~50\ulcorner).

• Journal of Sensor Science and Technology
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• v.14 no.5
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• pp.357-361
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• 2005

Low-stress silicon nitride (LSN) thin films with embedded metal line have been developed as free standing structures to keep microspheres in proper locations and localized heat source for application to a chip-based sensor array for the simultaneous and near-real-time detection of multiple analytes in solution. The LSN film has been utilized as a structural material as well as a hard mask layer for wet anisotropic etching of silicon. The LSN was deposited by LPCVD (Low Pressure Chemical Vapor Deposition) process by varing the ratio of source gas flows. The residual stress of the LSN film was measured by laser curvature method. The residual stress of the LSN film is 6 times lower than that of the stoichiometric silicon nitride film. The test results showed that not only the LSN film but also the stack of LSN layers with embedded metal line could stand without notable deflection.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.3
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• pp.176-181
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• 2012

Due to the high etch rate and low fabrication cost, the wet etching of silicon using KOH etchant is widely used in MEMS fabrication area. However, anisotropic etch characteristic obstruct intuitional mask design and compensation structures are required for mask design level. Therefore, the accurate modeling for various types of silicon surface is essential for fabrication of three-dimensional MEMS structure. In this paper, we modeled KOH etch profile for MEMS based energy harvester using fuzzy logic. Modeling results are compared with experimental results and it is applied to design of compensation structure for MEMS based energy harvester. Through Fuzzy inference approaches, developed model showed good agreement with the experimental results with limited etch rate information.

• Journal of the Korean Society of Propulsion Engineers
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• v.19 no.1
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• pp.1-8
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• 2015

Micro igniter on the glass membrane for MEMS thruster was developed. The stability of the micro igniter by using a glass membrane with a thickness of tens of microns was improved. The micro igniter was fabricated by anisotropic wet etching of photosensitive glass and deposition of Pt/Ti for electric heat coil. The solid propellant was loaded into the propellant chamber without an especial technique due to the high structural stability of the glass membrane. Ignition tests were performed successfully. The minimum ignition delay was 27.5 ms with an ignition energy of 19.3 mJ.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2009.11a
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• pp.289-292
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• 2009

The fabrication method of glass bipolar plates for micro PEM fuel cell application has been established and performance evaluation has been carried out. The advantages of glass bipolar plates for micro PEM fuel cells are light weight, high chemical resistivity, and easy manufacture. The MEMS fabrication process of anisotropic wet etching, thermal & UV bonding along with metal layer deposition has been introduced. From performance evaluation, it was shown that the micro fuel cell with a metal layer deposited on the reactive area yielded higher power density than the one without it. But both power densities of the two cases showed out to be adequate with the current status of micro fuel cell technology.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.4
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• pp.5-8
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• 2009

In this paper, a high-quality low-temperature co-fired ceramic (LTCC) solenoid inductor using a solder ball and an air cavity on a silicon wafer for three-dimensional (3-D) system-in-package (SiP) is proposed. The LTCC multi-layer solenoid inductor is attached using Ag paste and solder ball on a silicon wafer with the air cavity structure. The air cavity is formed on a silicon wafer through an anisotropic wet-etching technology and is able to isolate the LTCC dielectric loss which is equivalent to a low k material effect. The electrical coupling between the metal layer and the LTCC dielectric layer is decreased by adopting the air cavity. The LTCC solenoid inductor using the solder ball and the air cavity on silicon wafer has an improved Q factor and self-resonant frequency (SRF) by reducing the LTCC dielectric resistance and parasitic capacitance. Also, 3-D device stacking technologies provide an effective path to the miniaturization of electronic systems.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.30 no.12 s.255
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• pp.1642-1648
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• 2006

This paper describes enhancement of the mixing efficiency of a multilamination micro mixer by adding a number of recirculation zones downstream of the mixing zone. Numerical simulation was employed to estimate the mixing efficiency and the pressure drop under various conditions. Numerical results indicated that recirculation micro mixer brought about not only the increase of the mixing efficiency but also the decrease of the pressure drop. Micro mixers were fabricated using photosensitive glass by anisotropic wet etching technique. The width and height of the micro channel were $150{\mu}m$ and $500{\mu}m$, respectively. The performance of micro mixer was measured using color intensity variation of the fluid. Except for extremely low Re below 40, the recirculation micro mixer of the present study showed improved mixing. And the enhancement of the mixing increased as Re rose. When Re increased beyond 400, more than 90% of the mixing was observed in the experiment.

• Journal of the Korean Society for Precision Engineering
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• v.30 no.1
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• pp.128-133
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• 2013

Si Nanowire (Si-NW) arrays were fabricated by top-down method. A relatively simple method is suggested to fabricate suspended silicon nanowire arrays. This method allows for the production of suspended silicon nanowire arrays using anisotropic wet etching and conventional MEMS method of SOI (Silicon-On-Insulator) wafer. The dimensions of the fabricated nanowire arrays with the proposed method were evaluated and their effects on the Field Effect Transistor (FET) characteristics were discussed. Current-voltage (I-V) characteristics of the device with nanowire arrays were measured using a probe station and a semiconductor analyzer. The electrical properties of the device were characterized through leakage current, dielectric property, and threshold voltage. The results implied that the electrical characteristics of the fabricated device show the potential of being ion-selective field effect transistors (ISFETs) sensors.