• 대한기계학회논문집A
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• 제28권9호
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• pp.1408-1414
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• 2004

The use of flip-chip technology has many advantages over other approaches for high-density electronic packaging. ACF (anisotropic conductive film) is one of the major flip-chip technologies, which has short chip-to-chip interconnection length, high productivity, and miniaturization of package. In this study, thermal fatigue lift of ACF bonding flip-chip package has been predicted. Elastic and thermal properties of ACF were measured by using DMA and TMA. Temperature dependent nonlinear hi-thermal analysis was conducted and the result was compared with Moire interferometer experiment. Calculated displacement field was well matched with experimental result. Thermal fatigue analysis was also conducted. The maximum shear strain occurs at the outmost located bump. Shear stress-strain curve was obtained to calculate fatigue life. Fatigue model for electronic adhesives was used to predict thermal fatigue life of ACF bonding flip-chip packaging. DOE (Design of Experiment) technique was used to find important design factors. The results show that PCB CTE (Coefficient of Thermal Expansion) and elastic modulus of ACF material are important material parameters. And as important design parameters, chip width, bump pitch and bump width were chose. 2$^{nd}$ DOE was conducted to obtain RSM equation far the choose 3 design parameter. The coefficient of determination ($R^2$) for the calculated RSM equation is 0.99934. Optimum design is conducted using the RSM equation. MMFD (Modified Method for feasible Direction) algorithm is used to optimum design. The optimum value for chip width, bump pitch and bump width were 7.87mm, 430$\mu$m, and 78$\mu$m, respectively. Approximately, 1400 cycles have been expected under optimum conditions. Reliability analysis was conducted to find out guideline for control range of design parameter. Sigma value was calculated with changing standard deviation of design variable. To acquire 6 sigma level thermal fatigue reliability, the Std. Deviation of design parameter should be controlled within 3% of average value.

• 한국음향학회지
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• 제36권4호
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• pp.247-253
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• 2017

일반적으로 내화물의 진동특성은 등방성 재료로 가정한 후 확인한다. 하지만 실제로 내화물은 특정 방향으로 가압 성형하여 제조되기 때문에 이방성 재료특성을 보인다. 따라서 본 연구에서는 내화물을 정방정계 대칭성으로 가정하고, 유한요소프로그램을 이용해 너비, 길이, 높이 방향에 대한 주파수 응답을 얻었다. 해석결과의 타당성은 실제 측정결과의 비교를 통해 검증하였다. 주파수 응답을 기반으로, 충격방향기법을 이용하여 내화벽돌의 세 방향의 두께를 추정하였다. 실험을 통해 찾은 두께와 실제 두께와의 최대 오차율은 5 % 미만으로 확인되었다. 이를 통해 내화물과 같은 이방성 재료 두께 측정 시 충격반향기법의 효용성을 확인하였다.

• 한국염색가공학회지
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• 제26권4호
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• pp.305-310
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• 2014

In this study, we presented a newly synthesized pyrene-naphthalene diimide(NDI)-pyrene triad. The optical and structural properties were examined using various characterization techniques. A donor-acceptor-donor triad molecule exhibited a strong charge transfer, though there existed neither intramolecular nor intermolecular hydrogen bonding sites, due to the formation of preferential complementary complex between pyrene and NDI. Powder XRD measurement revealed a sharp and distinctive X-ray patterns, indicating the presence of microcrystalline-like structure. POM images showed anisotropic fingerprint texture similar to that of cholesteric phase, and SEM images showed numerous columnar structures with length of 1 to $10{\mu}m$. Above observation clearly demonstrated that ${\pi}$-complementary NDI-pyrene interactions in the traid was strong enough to form columnar aggregates in the long range.

• Tribology and Lubricants
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• 제33권3호
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• pp.106-111
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• 2017

Sapphire is an anisotropic material with excellent physical and chemical properties and is used as a substrate material in various fields such as LED (light emitting diode), power semiconductor, superconductor, sensor, and optical devices. Sapphire is processed into the final substrate through multi-wire saw, double-side lapping, heat treatment, diamond mechanical polishing, and chemical mechanical polishing. Among these, chemical mechanical polishing is the key process that determines the final surface quality of the substrate. Recent studies have reported that the material removal characteristics during chemical mechanical polishing changes according to the crystal orientations, however, detailed analysis of this phenomenon has not reported. In this work, we carried out chemical mechanical polishing of C(0001), R($1{\bar{1}}02$), and A($11{\bar{2}}0$) substrates with different sapphire crystal planes, and analyzed the effect of crystal orientation on the material removal characteristics and their correlations. We measured the material removal rate and frictional force to determine the material removal phenomenon, and performed nano-indentation to evaluate the material characteristics before and after the reaction. Our findings show that the material removal rate and frictional force depend on the crystal orientation, and the chemical reaction between the sapphire substrate and the slurry accelerates the material removal rate during chemical mechanical polishing.

• 한국분말재료학회지
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• 제18권5호
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• pp.443-448
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• 2011

The HDDR(hydrogenation-disproportionation-desorption-recombination) process can be used as an effective way of converting no coercivity Nd-Fe-B material, with a coarse $Nd_2Fe_{14}B$ grain structure to a highly coercive one with a fine grain. Careful control of the HDDR process can lead to an anisotropic $Nd_2Fe_{14}B$ without any post aligning process. In this study, the effect of hydrogen gas input at various temperature in range of $200{\sim}500^{\circ}C$ of hydrogenation stage (named Modified-solid HDDR, MS-HDDR) on the magnetic properties has been investigated. The powder from the modified-solid HDDR process exhibits Br of 11.7 kG and iHc of 10.7 kOe, which are superior to those of the powder prepared using the normal HDDR process.

• 대한기계학회논문집A
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• 제21권1호
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• pp.154-163
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• 1997

Thermally-induced deformation in SMC(Sheet Molding Compound) products is analyzed using three dimensional finite element method. Planar fiber orientation, which causes the anisotropic material properties, is calculated through the flow analysis during the compression stage of the mold. Also curing process is analyzed to predict temperature profile which has significant effects on warpage of SMC products. Through the developed procedure, effects of various process conditions such as charge location, mold temperature, fiber contents, and fiber orientations on deformation of final products are studied. and processing strategies are proposed to reduce the warpage and the shrinkage.

• 한국철도학회:학술대회논문집
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• 한국철도학회 2003년도 추계학술대회 논문집(II)
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• pp.579-584
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• 2003

In this study, anisotopic yield function is proposed for the numerical analysis of reinforced tunnel ground with grouting. For this, material properties of the reinforced ground both by equilibrium as well as kinematic condition along the interface and by the mean field theory of Eshelby (1957) and Zhao (1990) are compared with each other and, as a result, the advantage/disadvantage of the proposed models are summarized. Finally, reinforced ground around tunnel with grouting is analyzed numerically. A new anisotropic yield function model is shown to be more reliable than the previous one and the predicted result is agreeable with the experimental data available.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2002년도 추계학술발표대회 논문집
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• pp.179-182
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• 2002

Rapid Prototyping (RP) technologies provide the ability to fabricate initial prototypes from various model materials. Stratasys' Fused Deposition Modeling (FDM) is a typical RP process that can fabricate prototypes out of plastic materials, and the parts made from FDM were often used as load-carrying elements. Because FDM deposits materials in about $300\mutextrm{m}$ thin filament with designated orientation, parts made from FDM show anisotropic material properties. This paper proposes an analytic model to predict the tensile strength of FDM parts. Applying the Classical Lamination Theory, which was developed for laminated composite materials, a computer code was implemented. Tsai-Wu failure criterion was added to the code to predict the failure of the FDM parts. The tensile strengths predicted by the analytic model were compared with experimental data. The data and prediction agreed reasonably well to prove the validity of the model. In addition, a web-based advisory service was developed to provide to strength prediction and design rules for FDM parts.

• KIEE International Transaction on Electrical Machinery and Energy Conversion Systems
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• 제5B권4호
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• pp.299-305
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• 2005

The work described in this paper is to investigate the additional iron losses and consequent temperatures in core ends of a turbo-generator wound with high voltage cables. Electromagnetic calculations are made with 3D FE models, which include the lamination material with anisotropic properties both in magnetic permeability and electric conductivity. The models also include the geometry of the stator teeth and eventually the axial steps designated to reduce the core end losses. The 3D model of the rotor consists of field windings with straight in-slot parts and end windings. The thermal models are simplified into two dimensions and include the heat sources dumped from the 3D electromagnetic solutions. The influences of power factor on additional iron losses are studied for this cable wound machine and conventional machines. The calculation results show that the additional iron losses can be reduced to about $15\%$ by introducing some small steps around the airgap corner of core ends.

• 한국소음진동공학회논문집
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• 제15권12호
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• pp.1416-1421
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• 2005

This paper presents an analytical approach for the vibration characteristics of a piezoelectric disc for torsional vibration transducers. The characteristic equation of the piezoelectric annular disc has been derived from Gibbs' free energy equations and mechanical and electrical equilibrium. With an anisotropic material properties of the disc, the characteristic equation has yielded resonance frequencies. Numerically-calculated results have been compared with the results obtained by the finite element analysis and experiments and have confirmed the validity of the theoretical analysis.