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Finite Element Analysis of Thermally-Induced Deformation in SMC Compression Molding

SMC 압축성형공정에서의 열변형에 관한 유한요소해석

  • Lee, Jae-Hyoung (Dept. of Mechanical Engineering, Graduate School of Korea Advanced Institute of Science and Technology) ;
  • Lee, Eung-Shik (Dept. of Mechanical Engineering, Graduate School of Korea Advanced Institute of Science and Technology) ;
  • Youn, Sung-Kie (Dept. of Mechanical Engineering, Korea Advanced Institute of Science and Technology)
  • 이재형 (한국과학기술원 대학원 기계공학과) ;
  • 이응식 (한국과학기술원 대학원 기계공학과) ;
  • 윤성기 (한국과학기술원 기계공학과)
  • Published : 1997.01.01

Abstract

Thermally-induced deformation in SMC(Sheet Molding Compound) products is analyzed using three dimensional finite element method. Planar fiber orientation, which causes the anisotropic material properties, is calculated through the flow analysis during the compression stage of the mold. Also curing process is analyzed to predict temperature profile which has significant effects on warpage of SMC products. Through the developed procedure, effects of various process conditions such as charge location, mold temperature, fiber contents, and fiber orientations on deformation of final products are studied. and processing strategies are proposed to reduce the warpage and the shrinkage.

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