• Journal of the Korean Ceramic Society
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• v.24 no.3
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• pp.215-222
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• 1987

${\alpha}$-Ferric Hydrous Oxide and ${\alpha}$-Ferric Oxide were obtained as following processes that Ferric Nitrate solution was adjusted to pH 6-8 with Ammonium Hydroxide, refluxed the Iron precipitate for 1 hr. at 80$^{\circ}C$, washed it with water and Methanol (95%), dried it to obtain ${\alpha}$-Ferric Hydrous Oxide at 60$^{\circ}C$, and then heated in atmosphere to prepare ${\alpha}$-Ferric Oxide for 1 hr. at 450$^{\circ}C$. Mica particles cleaned with ultrasonicator (45KHz) in water were mixed with Ferric Nitrate solution and treated it to adsorb ${\alpha}$-Ferric Oxide on the surface of mica particles by using the abovementioned processes, but the heated temperature was at 500$^{\circ}C$. The maximum wavelength of reflected light on the surface of mica-${\alpha}$-Ferric Oxide (50%) was appeared at 546nm but -Ferric Oxide free mica only was at 436 nm. The maximum wavelength was shifted to longer when the weight ratios of ${\alpha}$-Ferric Oxide to mica was changed from 1% to 50%.

• Journal of Environmental Health Sciences
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• v.2 no.1
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• pp.49-51
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• 1975

The accidents, homicides and suicides of carbon monoxide poisoning to increase in number every year are required precize, accurate, and rapid method for the determination of carbon monoxide in the blood samples. Here is the basis of this method for the determination of percentage saturation of hemoglobin by carbon monoxide which have found out to be suitable in laboratory as follows: A 0.1ml of blood is mixed with 20ml of 0.1% ammonium hydroxide, and 20mg sodium hydrosulfite is added to convert oxyhemoglobin to reduction hemoglobin. The absorbance is measured at 538nm and 578nm, the measurement was carried out within ten minutes of addition of sodium hydrosulfate.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.33 no.10
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• pp.1023-1028
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• 2009

Cleaning is required following CMP (chemical mechanical planarization) to remove particles. The minimization of particle residue is required with each successive technology generation, and the cleaning of wafers becomes more complicated. In copper damascene process for interconnection structure, it utilizes 2-step CMP consists of Cu and barrier CMP. Such a 2-steps CMP process leaves a lot of abrasive particles on the wafer surface, cleaning is required to remove abrasive particles. In this study, the chemical mechanical cleaning(CMC) is performed various conditions as a cleaning process. The CMC process combined mechanical cleaning by friction between a wafer and a pad and chemical cleaning by CMC solution consists of tetramethyl ammonium hydroxide (TMAH) / benzotriazole (BTA). This paper studies the removal of abrasive on the Cu wafer and the cleaning efficiency of CMC process.

• Textile Coloration and Finishing
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• v.9 no.1
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• pp.33-43
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• 1997

This study was carried out to investigate increasing the neutral substantivity of anionic dyes for cationic-modified cotton fabric treatied with cationic agent. In the present study 3-chloro-2-hydroxypropyltrimethyl ammonium chloride for reactive cationic agent was produced by reaction of epichlorohydrine with trimethylamine hydrochloride. 3-chloro-2-hydroxypropyltrimethylammonium chloride was converted in an aqueous solution of sodium hydroxide into glycidyltrimethylammonium chloride. By treating with this epoxy reagent the hydroxyl groups of cotton fabric was modified to trimethylammonium group through ether linkage. The introduction of new cationic sites into cotton fabric by pretreating with cationic agent improves the substantivity of anionic dyes with the cotton in dyebath. Dyeablity of the modified cotton fabric for direct and reactive dyes was much improved in a non-electrolytic or a little electrolytic dyebath and was proportional to the concentration of cationic agent.

• Journal of the Korean Applied Science and Technology
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• v.23 no.4
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• pp.300-306
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• 2006

The esterification of palmitic acid in rapeseed oil and methanol emulsified by propylene glycol with PTSA(p-toluene sulfonic acid) was followed by the transesterification of rapeseed oil into biodiesel with 1(w/v)% GMS(glycerol monostearate) as an emulsifier using TMAH(tetramethyl ammonium hydroxide) catalysts at $60^{\circ}C$. The former reaction was optimized at the 1:20 of molar ratio of oil to methanol and 5wt% PTSA, and the latter was optimized at the 1:8 of molar ratio of oil to methanol and 0.8wt% TMAH. The overall conversion into biodiesel was 98% after 60min of reaction time at the 1:8 of molar ratio, 0.8wt% TMAH and $60^{\circ}C$. TMAH was a good catalyst to control the viscosity of biodiesel mixture.

• Journal of environmental and Sanitary engineering
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• v.14 no.2
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• pp.84-89
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• 1999

This experiment was performed to develop the new desulfurization process which can eliminate the possibility of generation of the secondary pollutants by regenerating the limestone from the sulfite/sulfate slurry generated from the wet lime/limestone flue gas desulfurization process by treating it with the ammonium hydroxide and carbon dioxide and using it again. In the experiments, regent grade calcium carbonate was dissolved to obtain the 200ml of sample slurry of the concentration of 2.0~0.4 weight percent. After three times of regeneration and desulfurization process, the coefficients of regeneration and desulfurization efficiencies are calculated/measured. The obtained results are that the coefficients of generation of the first. second, and third regenerated calcium carbonate were 90.88, 92.13, and 91.50%, respectively; and the desulfurization efficiencies of those are 93.4, 94.2 and 93.0%, respectively.

• Journal of Sensor Science and Technology
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• v.17 no.1
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• pp.35-40
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• 2008

Low power bridge type micro gas sensors were fabricated by micro machining technology with TMAH (Tetra Methyl Ammonium Hydroxide) solution. The sensing devices with different heater materials such as metal and poly-silicon were obtained using CMOS (Complementary Metal Oxide Semiconductor) compatible process. The tellurium films as a sensing layer were deposited on the micro machined substrate using shadow silicon mask. The low power micro gas sensors showed high sensitivity to NO with high speed. The pure tellurium film used micro gas sensor showed good sensitivity than transition metal (Pt, Ti) used tellurium film.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.1880-1884
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• 2008

Cleaning is required following CMP (chemical mechanical planarization) to remove particles. The minimization of particle residue is required with each successive technology generation, and the cleaning of wafers becomes more complicated. In copper damascene process for interconnection structure, it utilizes 2-steop CMP consists of Cu CMP and barrier CMP. Such a 2-steps CMP process leaves a lot of abrasive particles on the wafer surface, cleaning is required to remove abrasive particles. In this study, the buffing is performed various conditions as a cleaning process. The buffing process combined mechanical cleaning by friction between a wafer and a buffing pad and chemical cleaning by buffing solution consists of tetramethyl ammonium hydroxide (TMAH)/benzotriazole(BTA).

• Journal of Pharmaceutical Investigation
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• v.6 no.2
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• pp.95-100
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• 1976

A study on the effect of the pH of precipitation on the acid consuming capacity, aging stability, physical and chemical properties of hydrous aluminum oxide prepared by the reaction of aluminum chloride and ammonium hydroxide solution was carried out by means of X-ray diffraction, IR spectra and differential thermal analysis. The results from these experiments are as follows: 1. Hydrous aluminum oxide precipitated at lower pH showed better acid consuming capacity, higher stability and more anion contained in the structure than that prepared at higher pH. 2. The hydrous aluminum oxide prepared at lower pH is amorphous and that prepared at higher pH is crystalline hydrated hydrous aluminum oxide, i.e., Bayerite and these results are conformed to Rhee's hypothesis. 3. The rate of loss of reactivity and the end-point reactivity are related to the pH of precipitation.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1996.11a
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• pp.334-337
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• 1996

Si anisotropic etching is a key technology for micromachining. The main advantages of tetramethyl ammonium hydroxide (TMAH)-based solution are their full compatibility with IC process. In this work the anisotropic etching of single crystal Si in a TMAH (($CH_3$)$_4$NOH) based solution was studied. The influence of the addition of IPA to TMAH solution on their etching characteristics was also presented. The crystal planes bounding the etch front and their etch rates were determined as a function of temperature, crystal orientation, and etchant concentration. The etch rates of (100) oriented Si crystal planes decreased linearly with increasing the IPA concentration, The etched (100) planes were covered by Pyramidal-shaped hillocks below 15 wt.%, but very smooth surfaces were obtained above 20 wt.%. The addition of IPA to TMAH solution leads to smoother surfaces of sidewalls etched planes.