• Title/Summary/Keyword: Aluminum package

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The Effect of Ultrasonic Vibration Table on ELID Grinding Process of Aluminum Nitride Ceramics (초음파 진동 테이블이 질화알루미늄 세라믹의 ELID 연삭 가공에 미치는 영향)

  • Kwak, Tea-Soo;Jung, Myung-Won;Kim, Geon-Hee;Kwak, Ihn-Sil
    • Journal of the Korean Society for Precision Engineering
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    • v.30 no.12
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    • pp.1237-1243
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    • 2013
  • This study has focused on the effect of ultrasonic vibration table in ELID grinding process of aluminum nitride ceramics. Aluminum nitride ceramics has superior physical and chemical properties and widely used in IC, LSI substrate, package and so on. To achieve the high effective machining of brittle and high strength ceramics as like aluminum nitride, machining method combined ELID grinding and ultrasonic vibration has been adopted in this study. From the experimental results, material removal rate, MRR has been increased maximum 36 percent and spindle resistance has been decreased in using ultrasonic table. Surface roughness of ground surface became a little worse in using ultrasonic table but was somewhat improved in feed direction.

Surface Analysis of Aluminum Bonding Pads in Flash Memory Multichip Packaging

  • Son, Dong Ju;Hong, Sang Jeen
    • Transactions on Electrical and Electronic Materials
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    • v.15 no.4
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    • pp.221-225
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    • 2014
  • Although gold wire bonding techniques have already matured in semiconductor manufacturing, weakly bonded wires in semiconductor chip assembly can jeopardize the reliability of the final product. In this paper, weakly bonded or failed aluminum bonding pads are analyzed using X-ray photoelectron spectroscopy (XPS), Auger electron Spectroscopy (AES), and energy dispersive X-ray analysis (EDX) to investigate potential contaminants on the bond pad. We found the source of contaminants is related to the dry etching process in the previous manufacturing step, and fluorocarbon plasma etching of a passivation layer showed meaningful evidence of the formation of fluorinated by-products of $AlF_x$ on the bond pads. Surface analysis of the contaminated aluminum layer revealed the presence of fluorinated compounds $AlOF_x$, $Al(OF)_x$, $Al(OH)_x$, and $CF_x$.

A Comparison of Direct/Indirect Extrusion Process Analysis of Clad Composite Materials (층상복합재료의 직접/간접압출공정해석의 비교)

  • Kim, Jeong-In;Kwon, Hyok-Chon;Kang, Chung-Gil
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 1999.05a
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    • pp.9-19
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    • 1999
  • A clad material is a different type of the typical composites which is composed of two or more materials joined at their interface surface. The advantage of clad material is that the combination of different materials can satisfy both the need of good mechanical properties and the other demand of user such as electrical properties instantaneouly. This paper is concerned with the direct and indirect extrusion process of copper-clad aluminum rod. Extrusion of copper-clad aluminum rod was simulated using a commercially available finite element package of DEFORM. The simulations were performed for copper-clad aluminum rod to predict the distributions of temperature, effective stress, effective strain rate and moan stress for some sheath thicknesses, die exit diameters and die temperatures.

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Effects of ZnO Composition on the Thermal Emission Properties for LTCC Type of High Power LED Package (고전력 LED용 적층형 LTCC 패키징의 ZnO 조성 변화가 방열 특성에 미치는 영향)

  • Kim, Woojeong;Kim, Hyung Soo;Shin, Daegyu;Lee, Hee Chul
    • Journal of the Microelectronics and Packaging Society
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    • v.19 no.4
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    • pp.79-83
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    • 2012
  • LTCC (Low temperature co-fired ceramic) package have been paid much attention due its good reliability, miniaturization, and application of silver paste with complex wiring and printing. Therefore, LTCC package has been expected to replace vulnerable plastic package in the field of high power LED device. Currently, LTCC ceramic package is mainly made up of aluminum oxide powder. In this study, zinc oxide powder is added or replaced for the fabrication of LTCC ceramic body. By adding small amount of ZnO, thermal conductivity of the LTCC ceramic body could be remarkably increased by 25% leading to the extension of LED life time. The LTCC package structure with composition including ZnO has an increased thermal flux by 56% as a result of ANSYS simulation. Actually, the fabricated LED package with the addition of ZnO exhibits a decreased thermal resistivity by 14.9%.

Prediction of Mechanical Properties with Different Cooling Rates of AC4CH Cast Aluminum Alloy and its Application in Computer Simulation (알루미늄 AC4CH 합금주물의 냉각속도 변화에 따른 기계적 물성 예측 및 전산모사 적용)

  • Lee, Byoung-Jun;Cho, In-Sung
    • Journal of Korea Foundry Society
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    • v.38 no.2
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    • pp.41-47
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    • 2018
  • In a numerical study, equations relating the mechanical properties and cooling rate in a casting process have been applied to an AC4CH cast aluminum alloy. Good agreement was found between the measured and predicted material properties. Step-shaped steel blocks were made to comprise a casting mold with a Y-shaped cavity. Thermometers were inserted into each step of the mold to investigate temperature changes. The microstructure and mechanical properties, such as hardness and tensile stress were measured for each cut of piece. The correlation between the cooling rate and SDAS was found by curved fitting. Moreover, both the solidification time and the temperature were simulated using a commercial package, ZCast. The simulation results for yield strength, tensile strength, elongation, and hardness were compared with experimental results. Using the estimated K and n values, the hardness values of a ship propeller were simulated, and the results were similar to those obtained for actual castings.

Application Effect of Heating Energy Saving Package on Venlo Type Glasshouse of Paprika Cultivation (파프리카 재배 벤로형 유리온실에서 난방에너지 절감 패키지 기술 적용효과)

  • Kwon, Jin Kyung;Jeon, Jong Gil;Kim, Seung Hee;Kim, Hyung Gweon
    • Journal of Bio-Environment Control
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    • v.25 no.4
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    • pp.225-231
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    • 2016
  • Glasshouse heating package technologies to improve energy usage efficiency in winter were developed. Heating package was composed of the ground water source heat pump with heating capacity of 105kW, the aluminum multi-layer thermal curtain with six layers of different materials and the root zone local heater with XL pipes of ${\phi}20mm$. Venlo type glasshouse($461m^2$) with the heating package was compared with the same type and area control glasshouse with the light oil boiler, the usual non-woven fabric thermal curtain with respect to the glasshouse inside temperature, relative humidity, crop growth, and heating energy consumption. The results of test in paprika cultivation glasshouses showed that the air temperature inside glasshouse with aluminum multi-layer thermal curtain was maintained $2.2^{\circ}C$ higher than that of control glasshouse in un-heating night time and the temperature in bed with root zone local heating was $4.7^{\circ}C$ higher than that in bed without local heating. Average heating coefficient of performance(COP) of the ground water source heat pump used in paprika cultivation was 3.7 and the glasshouse inside temperature was maintained at $21^{\circ}C$ of heating set up temperature. The heating energy consumptions per 10a were measured at 14,071L of light oil and 364kWh of electric power for the control glasshouse and 35,082kWh for the glasshouse applied heating package. As results, the heating cost of the glasshouse applied heating package was 87 percent lower than that of control glasshouse. The growths of paprika in glasshouses of control and applied heating package did not show any significant difference.

Effect of Packaging Materials and Methods on the Storage Quality of Dried Persimmon (포장재 및 포장방법이 저장곶감의 품질에 미치는 영향)

  • Park, Hyung-Woo;Koh, Ha-Young;Park, Moo-Hyun
    • Korean Journal of Food Science and Technology
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    • v.21 no.3
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    • pp.321-325
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    • 1989
  • Storage quality dried persimmons was evaluated by 5 scale scoring hedonic sensory analysis in various packaging methods and materials. Dried persimmons were deteriorated within 1 months of storage in polyethyene(PE, 0.08mm) and 1.5-2.5 months in nylon(PA/PE, 0.1mm) packages at room temperature, But those were kept good quality for 5 months of storage in PA/PE package and for 8 months in $CO_2$ or $N_2$ gas filled polyester/aluminum/casteded polypropylene(PET/Al./CPP, 0.1mm) package at $5^{\circ}C$. Dried persimmon had the best quality in water content of 37% and at humidity 75% and its shelf-life was noticialy prolonged by low temperature.

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Numerical computation of pulsed laser ablation phenomena by thermal mechanisms (열적 메커니즘에 의한 펄스레이저 어블레이션 현상의 수치계산)

  • Oh, Bu-Kuk;Kim, Dong-Sik
    • Proceedings of the KSME Conference
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    • 2003.04a
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    • pp.1572-1577
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    • 2003
  • High-power pulsed laser ablation under atmospheric pressure is studied utilizing numerical and experimental methods with emphasis on recondensation ratio, and the dynamics of the laser induced vapor flow. In the numerical calculation, the temperature pressure, density and vaporization flux on a solid substrate are first obtained by a heat-transfer computation code based on the enthalpy method, and then the plume dynamics is calculated by using a commercial CFD package. To confirm the computation results, the probe beam deflection technique was utilized for measuring the propagation of a laser induced shock wave. Discontinuities of properties and velocity over the Knudsen layer were investigated. Related with the analysis of the jump condition, the effect of the recondesation ratio on the plume dynamics was examined by comparing the pressure, density, and mass fraction of ablated aluminum vapor. To consider the effect of mass transfer between the ablation plume and air, unlike the most previous investigations, the equation of species conservation is simultaneously solved with the Euler equations. Therefore the numerical model computes not only the propagation of the shock front but also the distribution of the aluminum vapor. To our knowledge, this is the first work that employed a commercial CFD code in the calculation of pulsed ablation phenomena.

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A Comparative Study of Radiographic Images on Normal Anatomical Structures (정상 해부학적 구조물에 대한 X-선 영상의 비교 연구)

  • Choi Heang-Hee;Choi Eui-Hwan;Kim Jae-Duk
    • Journal of Korean Academy of Oral and Maxillofacial Radiology
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    • v.29 no.1
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    • pp.283-297
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    • 1999
  • Purpose: To compare radiographic images of Digora/sup (R)/ system and Ektaspeed Plus film obtained from normal adults. Materials and methods: Storage phosphor plate(SPP) was placed in a film holder behind Ektaspeed Plus film package without lead foil. The effect of film on SPP was studied in a separate in vitro experiment. Forty-seven sets of images were prepared for the evaluaton. The regions of interest(ROI) for evaluation were designated at seven sites including normal anatomical structures. The image quality for each ROI was evaluated on enhanced and unenhanced storage phosphor(SP) images and Ektaspeed Plus film. Results: Two film-SPP configurations showed significantly different gray levels at each step of the aluminum step wedge(p<0.05). The contrasts were comparable. Enhanced SP images were significantly superior to unenhaned images and film in all anatomical sturctures(p<0.01). The differences between unenhanced SP images and film were significant(p<0.05) except root canal and cortical bone on alveolar crest. For anatomical items. there were statistically significant difference among five observers(p<0.05). Conclusions: The image quality of enhanced SP images were superior to Ektaspeed Plus film. and Digora system is potentially applicable to clinical diagnosis.

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Measurement and Evaluation of Thermal Expansion Coefficient for Warpage Analysis of Package Substrate (패키지 기판의 Warpage 해석을 위한 열팽창계수의 측정 및 평가)

  • Yang, Hee Gul;Joo, Jin Won
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.38 no.10
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    • pp.1049-1056
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    • 2014
  • Microelectronics components contain various materials with different coefficients of thermal expansion (CTE). Although a large amount of published data on the CTE of standard materials is available, it occasionally becomes necessary to measure this property for a specific actual material over a particular temperature range. A change in the temperature of a material causes a corresponding change in the output of the strain gage installed on the specimen because of not only the mechanical load but also the temperature change. In this paper, a detailed technique for CTE measurement based on these thermal characteristics of strain gages is proposed and its reliability is evaluated. A steel specimen, aluminum specimen, and copper specimen, whose CTE values are well known, were used in this evaluation. The proposed technique was successfully applied to the measurement of the CTE of a coreless package substrate composing of electronics packages.