• Journal of Welding and Joining
• /
• 제27권3호
• /
• pp.73-79
• /
• 2009

This present paper investigated the mechanical properties and the microstructures of each penetration shapes classifying the conduction shape area and the keyhole shape area about electron beam welded 120(T)mm thick plated aluminum 5052 112H. As a result the penetration depth is increased linearly according to the output power, but the aspect ratio is decreased after the regular output power. In the conduction shape area, the Heat affected zone is observed relatively wider than the keyhole shape area. In the material front surface of the welded specimen, the width is decreased but the width in the material rear surface is increased. After the measuring the Micro Vikers Hardness, it showed almost similar hardness range in all parts, and after testing the tensile strength, the ultimate tensile strength is similar to the ultimate tensile strength of the base material in all the specimens, also the fracture point was generated in the base materials of all the samples. In the result of the impact test, impact absorbed energy of the Keyhole shape area is turned up very high, and also shown up the effect about four times of fracture toughness comparing the base material. In the last result of observing the fractographs, typical ductile fraction is shown in each weld metal, and in the basic material, the dimple fraction is shown. The weld metals are shown that there are no other developments of any new chemical compound during the fastness melting and solidification.

• 반도체디스플레이기술학회지
• /
• 제16권1호
• /
• pp.22-28
• /
• 2017

The result of stripping process for the removal of the post etch/ash Photoresist (PR) residue on an aluminum patterned wafer by using supercritical $CO_2$ ($sc-CO_2$) mixture, was investigated by scanning of electron microscope (SEM) inspection of wafer, measuring the cloud points and visual observation of the state of $sc-CO_2$ mixtures. It was found that $sc-CO_2$ mixtures were made by mixing additives and $sc-CO_2$ should form homogeneous and transparent phase (HTP) in order to effectively and uniformly remove the post etch/ash PR residue on the aluminum patterned wafer using them. The additives were formulated by mixing and co-solvents like an amine compound and fluorosurfactants used as HTP agents, and the PR residue on the wafer were able to be rapidly and effectively removed using the $sc-CO_2$ mixture of HTP. The five kinds of additives were formulated by the recipe of mixing co-solvents and surfactants, which were able to remove PR residue on the wafer by mixing with $sc-CO_2$ at the stripping temperature range from 40 to $80^{\circ}C$. The five kinds of $sc-CO_2$ mixtures which were named as PR removers were made, which were able to form HTP within the above described stripping temperature. The cloud points of $sc-CO_2$ mixtures were measured to find correlation between them and HTP.

• Elastomers and Composites
• /
• 제55권1호
• /
• pp.59-66
• /
• 2020

Herein, we investigated the thermal conductivity and thermal stability of natural rubber composite systems containing hybrid fillers of boron nitride (BN) and aluminum nitride (AlN). In the hybrid system, the bimodal distribution of polygonal AlN and planar BN particles provided excellent filler-packing efficiency and desired energy path for phonon transfer, resulting in high thermal conductivity of 1.29 W/mK, which could not be achieved by single filler composites. Further, polyethylene glycol (PEG) was compounded with a commonly used naphthenic oil, which substantially increased thermal conductivity to 3.51 W/mK with an excellent thermal stability due to facilitated energy transfer across the filler-filler interface. The resulting PEG-incorporated hybrid composite showed a high thermal degradation temperature (T₂) of 290℃, a low coefficient of thermal expansion of 26.4 ppm/℃, and a low thermal distortion parameter of 7.53 m/K, which is well over the naphthenic oil compound. Finally, using the Fourier's law of conduction, we suggested a modeling methodology to evaluate the cooling performance in thermal management system.

• 한국재료학회지
• /
• 제25권3호
• /
• pp.138-143
• /
• 2015

Aluminum nitride, a compound semiconductor, has a Wurtzite structure; good material properties such as high thermal conductivity, great electric conductivity, high dielectric breakdown strength, a wide energy band gap (6.2eV), a fast elastic wave speed; and excellent in thermal and chemical stability. Furthermore, the thermal expansion coefficient of the aluminum nitride is similar to those of Si and GaAs. Due to these characteristics, aluminum nitride can be applied to electric packaging components, dielectric materials, SAW (surface acoustic wave) devices, and photoelectric devices. In this study, we surveyed the crystallization and preferred orientation of AlN thin films with an X-ray diffractometer. To fabricate the AlN thin film, we used the magnetron sputtering method with $N_2$, NH3 and Ar. According to an increase in the partial pressures of $N_2$ and $NH_3$, Al was nitrified and deposited onto a substrate in a molecular form. When AlN was fabricated with $N_2$, it showed a c-axis orientation and tended toward a high orientation with an increase in the temperature. On the other hand, when AlN was fabricated with $NH_3$, it showed a-axis orientation. This result is coincident with the proposed mechanism. We fabricated AlN thin films with an a-axis orientation by controlling the sputtering electric power, $NH_3$ pressure, deposition speed, and substrate temperature. According to the proposed mechanism, we also fabricated AlN thin films which demonstrated high a-axis and c-axis orientations.

• JSTS:Journal of Semiconductor Technology and Science
• /
• 제11권3호
• /
• pp.182-189
• /
• 2011

In this work, a tunneling field-effect transistor (TFET) based on heterojunctions of compound and Group IV semiconductors is introduced and simulated. TFETs based on either silicon or compound semiconductors have been intensively researched due to their merits of robustness against short channel effects (SCEs) and excellent subthreshold swing (SS) characteristics. However, silicon TFETs have the drawback of low on-current and compound ones are difficult to integrate with silicon CMOS circuits. In order to combine the high tunneling efficiency of narrow bandgap material TFETs and the high mobility of III-V TFETs, a Type-I heterojunction tunneling field-effect transistor (I-HTFET) adopting $Ge-Al_xGa_{1-x}As-Ge$ system has been optimized by simulation in terms of aluminum (Al) composition. To maximize device performance, we considered a nanowire structure, and it was shown that high performance (HP) logic technology can be achieved by the proposed device. The optimum Al composition turned out to be around 20% (x=0.2).

• 한국재료학회지
• /
• 제33권1호
• /
• pp.8-14
• /
• 2023

In order to broaden the range of application of light weight aluminum alloys, it is necessary to enhance the mechanical properties of the alloys and combine them with other materials, such as cast iron. In this study, the effects of adding small amounts of Cu and Zr to the Al-Si-Mg based alloy on tensile properties and corrosion characteristics were investigated, and the effect of the addition on the interfacial compounds layer with the cast iron was also analyzed. Although the tensile strength of the Al-Si-Mg alloy was not significantly affected by the additions of Cu and Zr, the corrosion resistance in 3.5 %NaCl solution was found to be somewhat lowered in this research. The influence of Cu and Zr addition on the type and thickness of the interfacial compounds layer formed during compound casting with cast iron was not significant, and the main interfacial compounds were identified to be Al₅FeSi and Al₈Fe₂Si phases, as in the case of the Al-Si-Mg alloys.

• 방사성폐기물학회지
• /
• 제4권1호
• /
• pp.33-40
• /
• 2006

한국원자력연구소 내의 연구용 원자로(TRIGA II, III) 해체 시 발생한 방사성 알루미늄 해체 폐기물의 감용 및 제염 특성을 평가하기 위해 아크로에서 알루미늄의 용융 특성 및 방사성 핵종의 분배 특성에 대한 연구를 수행하였다. 알루미늄 폐기물은 흑연전극(graphite electrode)을 이용한 전기아크로에서 4가지 종류의 플럭스$(A:NaCl-KCl-Na_3AlF_6,\;B:NaCl-NaF-KF,\;C:CaF_2,\;D:LiF-KCl-BaCl_2)$를 함께 첨가하여 용융시켰다. 또한 알루미늄의 용융 시 방사성 핵종의 분배 특성을 고찰하기 위해 알루미늄 시편에 방사성 모의 핵종인 코발트, 세슘, 스트론튬의 화합물을 오염시킨 후 혹연도가니에 넣어 알루미늄 용융실험을 수행하였다. 전기아크로에서 알루미늄의 용융실험을 수행한 결과 플럭스의 종류에 따라 다소 차이는 있으나 플럭스의 첨가에 의해 알루미늄 용융체의 유동성이 증가됨을 확인할 수 있었다. 아크 용융에 의해 생성된 슬래그의 발생량은 플럭스 A와 B를 첨가한 알루미늄 용융실험에 비해 플럭스 C와 D를 첨가한 실험에서 상대적으로 많은 양이 생성됨을 알 수 있었으며, 첨가된 플럭스의 양이 증가할수록 이에 비례하여 슬래그의 발생량이 증가함을 알 수 있었다. 슬래그(slag)의 XRD 분석을 통해 방사성 핵종이 주괴에서 슬래그 상으로 이동한 후 슬래그를 구성하고 있는 산화알루미늄과 결합하여 안정한 화합물로 슬래그 상에 포집됨을 알 수 있었다. 알루미늄 폐기물의 용융시 Co의 분배율은 플럭스를 첨가한 경우에 보다 높은 제염계수를 나타냈으며, 모든 플럭스에서 40% 이상의 제염 효과를 나타내었다. 반면에 휘발성 핵종인 Cs과 Sr은 주괴로부터 98% 이상이 제거되어 대부분이 슬래그상과 분진으로 이동되는 특성을 확인할 수 있었다.

• 한국세라믹학회지
• /
• 제40권5호
• /
• pp.460-467
• /
• 2003

기계적 합금화법에 의해 준비된 복합분말을 이용하여 용사공정에 의해 알루미늄 모재에 Al-SiC$_{p}$ 복합재료 코팅층을 형성하였다. 24h milling 후 복합화된 분말을 제조할 수 있었으며, 이 분말을 용사하여 복합재료 코팅층을 형성할 수 있었다. 코팅층의 두께 및 기공율과 공정변수와 관계를 분석하였으며, 경도의 증가를 확인하였다. 또한 TEM분석에 의해 Al-Si-C-O 화합물의 존재를 확인하였다.

• 한국건축시공학회:학술대회논문집
• /
• 한국건축시공학회 2008년도 추계 학술논문 발표대회
• /
• pp.173-178
• /
• 2008

This is green roof bottom system which composed by aluminum valve and glass fiber together as major reinforcement, so the cooper sheet can have root proof, and using recycled tire gel-type membrane waterproofing system which dost not contains VOCs. The copper sheet reduce the plants' root growing, so it helpes to maintain the waterproofing layer and stability of root proofing. Gel type membrane waterproofing system can do waterproofing, stress dispersion, and reducing leakage expansion. So those two materials can help each other to make green roof bottom layer would have the stability and durability.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 1997년도 춘계학술대회 논문집
• /
• pp.670-674
• /
• 1997

Semi-solid forging is a compound forging technology to deventional forging process. Among several steps of semi-solid forging process, the heating step of a billet prior to semi-solid forging step is necessarily required to obtain globular microstructure. For the forming operation to work properly, it is also important to heat the billet uniformly for the uniformity of solid-liquid distribution. To satisfy these requirements, induction heating has been generally used for a long time. This paper presents the method to find heating condition and the temperature distribution inside of a billet with a induction heating apparatus by comparing the computer simulation with experiment for aluminum alloys Al2024 and A356.